KR970059856U - Semiconductor wafer pattern inspection device - Google Patents

Semiconductor wafer pattern inspection device

Info

Publication number
KR970059856U
KR970059856U KR2019960007604U KR19960007604U KR970059856U KR 970059856 U KR970059856 U KR 970059856U KR 2019960007604 U KR2019960007604 U KR 2019960007604U KR 19960007604 U KR19960007604 U KR 19960007604U KR 970059856 U KR970059856 U KR 970059856U
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
inspection device
pattern inspection
wafer pattern
semiconductor
Prior art date
Application number
KR2019960007604U
Other languages
Korean (ko)
Other versions
KR200152641Y1 (en
Inventor
신필식
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019960007604U priority Critical patent/KR200152641Y1/en
Publication of KR970059856U publication Critical patent/KR970059856U/en
Application granted granted Critical
Publication of KR200152641Y1 publication Critical patent/KR200152641Y1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
KR2019960007604U 1996-04-09 1996-04-09 Pattern inspection apparatus for semiconductor wafer KR200152641Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960007604U KR200152641Y1 (en) 1996-04-09 1996-04-09 Pattern inspection apparatus for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960007604U KR200152641Y1 (en) 1996-04-09 1996-04-09 Pattern inspection apparatus for semiconductor wafer

Publications (2)

Publication Number Publication Date
KR970059856U true KR970059856U (en) 1997-11-10
KR200152641Y1 KR200152641Y1 (en) 1999-07-15

Family

ID=19453544

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960007604U KR200152641Y1 (en) 1996-04-09 1996-04-09 Pattern inspection apparatus for semiconductor wafer

Country Status (1)

Country Link
KR (1) KR200152641Y1 (en)

Also Published As

Publication number Publication date
KR200152641Y1 (en) 1999-07-15

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