KR970053142A - Semiconductor Package Batch Work Device - Google Patents

Semiconductor Package Batch Work Device Download PDF

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Publication number
KR970053142A
KR970053142A KR1019950058486A KR19950058486A KR970053142A KR 970053142 A KR970053142 A KR 970053142A KR 1019950058486 A KR1019950058486 A KR 1019950058486A KR 19950058486 A KR19950058486 A KR 19950058486A KR 970053142 A KR970053142 A KR 970053142A
Authority
KR
South Korea
Prior art keywords
strip
rail
buffer
pick
output
Prior art date
Application number
KR1019950058486A
Other languages
Korean (ko)
Other versions
KR100392729B1 (en
Inventor
김강산
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950058486A priority Critical patent/KR100392729B1/en
Publication of KR970053142A publication Critical patent/KR970053142A/en
Application granted granted Critical
Publication of KR100392729B1 publication Critical patent/KR100392729B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

본 발명은 반도체 패키지 일괄 작업 장치에 관한 것으로, 버퍼를 사용하여 오토 몰드 시스템과 리드 절곡 장비를 연결하여 장비를 일괄작동시키고, 오토 몰드 시스템 고장시 버퍼부에 있는 스트립 공급 장치에 의해 스트립을 리드 절곡 장비에 공급함으로써 스트립의 손상을 줄이고, 적은 노동력으로 작업할 수 있게 하였으며, 생산 공정을 일원화하여 생산 관리 측면을 향상시킨 것을 특징으로 하는 반도체 패키지 일괄 작업 장치에 관한 것이다.The present invention relates to a batch package operation apparatus for semiconductor packages, wherein the apparatus is collectively operated by connecting an auto mold system and lead bending equipment using a buffer, and when the auto mold system is broken, the strip is bent by a strip supply device in the buffer unit. By supplying the equipment to reduce the damage of the strip, it is possible to work with less labor, and the semiconductor package batch operation device characterized in that the production management is improved by unifying the production process.

Description

반도체 패키지 일괄 작업 장치Semiconductor Package Batch Work Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 개략적인 구성도.1 is a schematic configuration diagram of the present invention.

Claims (3)

반도체 패키지 일괄 작업 장치에 있어서, 작업 효율을 향상시키기 위해 오토 몰드 시스템과 리드 절곡 장비 사이를 연결하여 몰딩된 리드 프레임의 길이 방향으로 연속 이송시키는 버퍼로 구성되어진 것을 특징으로 하는 반도체 패키지 일괄 작업 장치.A semiconductor package batch work device, comprising: a buffer for continuously feeding in a longitudinal direction of a molded lead frame by connecting between an auto mold system and lead bending equipment in order to improve work efficiency. 제1항에 있어서, 버퍼는 몰드 아웃-풋 레일로부터 스트립을 공급받는 레일1와 레일2으로 구성된 버퍼 인-풋 레일과, 제1가이드를 전후 왕복 운동하며 버퍼 인-풋 레일상의 스트립을 트랜스퍼 레일상으로 공급하는 제1픽업 장치와, 상기 제1픽업 장치로부터 스트립을 공급받아 버퍼 아웃-풋 레일에 공급하는 트랜스퍼레일과, 상기 트랜스퍼 레일로부터 스트립을 공급받아 리드 절곡 장비인 인-풋 레일에 공급하는 버퍼 아웃-풋 레일과, 오토 몰드 시스템이 고장나서 정지할시 스트립을 버퍼 아웃-풋 레일상에 공급하는 보조 스트립 공급장치로 이루어진 것을 특징으로 하는 반도체 패키지 일괄 작업 장치.2. The buffer of claim 1, wherein the buffer comprises a buffer input-foot rail consisting of rail 1 and rail 2 supplied with a strip from a mold output rail, and a strip on the buffer input-output rail reciprocating back and forth with the first guide. A first pick-up device for daily supply, a transfer rail for receiving a strip from the first pick-up device, and supplying the strip to a buffer output-rail, and an input rail for receiving a strip from the transfer rail and a lead bending device. And an auxiliary strip supply device for supplying a strip on the buffer output-rail when the auto mold system fails and stops. 제2항에 있어서, 보조 스트립 공급장치는 별도의 패키지를 픽업하여 버퍼 아웃-풋 레일에 공급하는 제2픽업 장치와, 별도의 스트립을 상하 이송시켜 제2픽업장치가 스트립을 픽업할 수 있게 한 엘리베이터와, 상기 엘리베이터에 의해 상하 이송시되는 스트립의 이탈을 방지하여 스트립을 안정되게 픽업위치로 이송가능케 한 가이드 블럭으로 구성되어진 것을 특징으로 하는 반도체 패키지 일괄 작업 장치.3. The auxiliary strip feeding device according to claim 2, wherein the auxiliary strip feeding device picks up a separate package and supplies it to the buffer output-rail rail, and transfers the separate strip up and down to allow the second pickup device to pick up the strip. And an elevator, and a guide block for stably transporting the strip to the pick-up position by preventing separation of the strip during the vertical transfer by the elevator. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950058486A 1995-12-27 1995-12-27 Semiconductor package batch working apparatus KR100392729B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950058486A KR100392729B1 (en) 1995-12-27 1995-12-27 Semiconductor package batch working apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950058486A KR100392729B1 (en) 1995-12-27 1995-12-27 Semiconductor package batch working apparatus

Publications (2)

Publication Number Publication Date
KR970053142A true KR970053142A (en) 1997-07-29
KR100392729B1 KR100392729B1 (en) 2003-11-17

Family

ID=37421968

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950058486A KR100392729B1 (en) 1995-12-27 1995-12-27 Semiconductor package batch working apparatus

Country Status (1)

Country Link
KR (1) KR100392729B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990034055A (en) * 1997-10-28 1999-05-15 윤종용 Semiconductor Package Manufacturing System Management System

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990034055A (en) * 1997-10-28 1999-05-15 윤종용 Semiconductor Package Manufacturing System Management System

Also Published As

Publication number Publication date
KR100392729B1 (en) 2003-11-17

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