KR970052649A - Semiconductor Wafer Cleaning Equipment - Google Patents

Semiconductor Wafer Cleaning Equipment Download PDF

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Publication number
KR970052649A
KR970052649A KR1019950051994A KR19950051994A KR970052649A KR 970052649 A KR970052649 A KR 970052649A KR 1019950051994 A KR1019950051994 A KR 1019950051994A KR 19950051994 A KR19950051994 A KR 19950051994A KR 970052649 A KR970052649 A KR 970052649A
Authority
KR
South Korea
Prior art keywords
cleaning liquid
inner tank
semiconductor wafer
cleaning
robot arm
Prior art date
Application number
KR1019950051994A
Other languages
Korean (ko)
Other versions
KR0179781B1 (en
Inventor
한석빈
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019950051994A priority Critical patent/KR0179781B1/en
Priority to US08/769,059 priority patent/US5673713A/en
Priority to JP8339316A priority patent/JP2762075B2/en
Priority to CN96114249A priority patent/CN1083153C/en
Publication of KR970052649A publication Critical patent/KR970052649A/en
Application granted granted Critical
Publication of KR0179781B1 publication Critical patent/KR0179781B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

본 발명은 반도체 웨이퍼 세정장치에 관한 것으로, 종래의 반도체 웨이퍼 세정장치는 웨이퍼를 세정하기 위하여 내조의 상면까지 세정액을 공급하여 세정액이 외조로 흘러넘치도록 하는 방식으로 실제 세정되는 웨이퍼 높이 이상까지 세정액을 공급하여야 하므로 세정액을 절감하는데 한계가 있는 문제점이 있었던 바, 본 발명은 하부내조(11)의 상부에 형상기억합금으로된 상부내조(12)를 설치하고, 그 상부내조(13)의 사면 단부에 힌지수단(13)을 구비한 로봇 암(14)을 설치하여 세정시 소정온도의 세정액으로 상부내조의 내측 공간을 줄여서 세정을 실시함으로써 세정액을 절감하는 효과가 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer cleaning apparatus, and a conventional semiconductor wafer cleaning apparatus supplies cleaning liquid to the upper surface of the inner tank to clean the wafer, so that the cleaning liquid can be flushed to the height of the wafer or more to be actually cleaned in such a manner that the cleaning liquid flows into the outer tank. The present invention has a problem in that there is a limit in reducing the cleaning liquid, the present invention is installed in the upper inner tank 12 made of a shape memory alloy on the upper portion of the lower inner tank 11, the end of the slope of the upper inner tank 13 By installing the robot arm 14 provided with the hinge means 13, the cleaning liquid is reduced by reducing the inner space of the upper inner tank with the cleaning liquid at a predetermined temperature during cleaning.

Description

반도체 웨이퍼 세정장치Semiconductor Wafer Cleaning Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명 반도체 웨이퍼 세정장치의 구성을 보인 사시도.2 is a perspective view showing the configuration of the semiconductor wafer cleaning apparatus of the present invention.

제3도는 본 발명 반도체 웨이퍼 세정장치의 웨이퍼 투입시를 보인 것으로,3 shows a wafer input of the semiconductor wafer cleaning apparatus of the present invention.

(a)는 단면도.(a) is a cross-sectional view.

(b)는 평면도.(b) is a plan view.

Claims (2)

세정액을 공급하기 위한 공급라인과 세정액을 배출하기 위한 배출라인이 구비된 외조의 내부에 하부내조가 설치되고, 그 하부내조의 상부에 형상기억합금으로된 상부내조가 설치되며, 그 상부내조의 단부에는 각각 힌지수단을 구비한 로봇 암이 설치되고, 그 각각의 로봇 암에는 로봇 암을 조정하기 위한 콘트롤 박스가 연결설치되며, 상기 상, 하부 내조의 내부에는 세정액을 분배하기 위한 배플 플래이트가 설치되고, 상기 공급라인 상에는 세정액을 펌핑하기 위한 펌프가 설치되어서 구성된 것을 특징으로 하는 반도체 웨이퍼 세정장치.A lower inner tank is installed inside the outer tank having a supply line for supplying the cleaning liquid and a discharge line for discharging the cleaning liquid, and an upper inner tank made of a shape memory alloy is installed on the upper portion of the lower inner tank, and an end portion of the upper inner tank is provided. Each robot arm is provided with hinge means, and each robot arm is provided with a control box for adjusting the robot arm, and a baffle plate for dispensing the cleaning liquid is installed inside the upper and lower inner tanks. And a pump for pumping a cleaning liquid is installed on the supply line. 제1항에 있어서, 상기 상부내조는 공정진행시 웨이퍼와 1mm 이상 거리가 유지되도록 변형되는 것을 특징으로 하는 반도체 웨이퍼 세정장치.The semiconductor wafer cleaning apparatus according to claim 1, wherein the upper inner tub is deformed to maintain a distance of 1 mm or more from the wafer during the process. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950051994A 1995-12-19 1995-12-19 Cleaning apparatus of semiconductor wafer KR0179781B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950051994A KR0179781B1 (en) 1995-12-19 1995-12-19 Cleaning apparatus of semiconductor wafer
US08/769,059 US5673713A (en) 1995-12-19 1996-12-18 Apparatus for cleansing semiconductor wafer
JP8339316A JP2762075B2 (en) 1995-12-19 1996-12-19 Cleaning equipment for semiconductor wafers
CN96114249A CN1083153C (en) 1995-12-19 1996-12-19 Apparatus for cleansing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950051994A KR0179781B1 (en) 1995-12-19 1995-12-19 Cleaning apparatus of semiconductor wafer

Publications (2)

Publication Number Publication Date
KR970052649A true KR970052649A (en) 1997-07-29
KR0179781B1 KR0179781B1 (en) 1999-04-15

Family

ID=19441414

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950051994A KR0179781B1 (en) 1995-12-19 1995-12-19 Cleaning apparatus of semiconductor wafer

Country Status (1)

Country Link
KR (1) KR0179781B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114745805A (en) 2016-12-27 2022-07-12 韦勒斯标准与技术协会公司 Wireless communication method and wireless communication terminal using OFDM random access

Also Published As

Publication number Publication date
KR0179781B1 (en) 1999-04-15

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