KR970052561A - Manufacturing method of optical path control device - Google Patents

Abstract

The present invention relates to an optical path control device, comprising: forming a sacrificial film to expose the pad on top of a driving substrate having transistors embedded in a matrix and having pads electrically connected to respective transistors on a surface thereof; Depositing continuously while varying the frequency of the film to form a membrane having a bending force of the film by extending the compressive stress at the lower end of the pad of the exposed driving substrate and gradually increasing the compressive stress at the bottom thereof; Forming an opening through which the pad is exposed in a predetermined portion of the membrane; forming a plug in the opening to be electrically connected to the pad; and electrically separating actuators adjacent to a predetermined portion of the upper portion of the membrane. Defining electrode separation area Forming a photoresist pattern, forming a lower electrode to be electrically connected to the plug on the membrane and the photoresist pattern, and simultaneously removing the lower electrode material formed on the photoresist pattern with the photoresist pattern; Forming a deformable portion and an upper electrode sequentially on the lower electrode, separating the actuator by etching the sacrificial layer to expose the sacrificial layer from the upper electrode to the membrane, and a protective film on the surface of the upper electrode and the side of the actuator And a step of removing the sacrificial film and the protective film. Therefore, it is possible to prevent the actuator from bending upward when the air gap is defined by removing the sacrificial film due to the stress of the membrane.

Description

Manufacturing method of optical path control device

Since this is an open matter, no full text was included.

1 (a) to (d) is a manufacturing process diagram of the optical path control apparatus according to the present invention.

* Explanation of symbols for main parts of the drawings

41: drive substrate 43: pad

45: sacrificial film 47: membrane

48: opening 49: plug

51: lower electrode 53: deformation part

55 upper electrode 57 protective film

59: air gap 60: actuator

61, 63: first and second membrane

Claims (16)

Forming a sacrificial film so that the pad is exposed on top of a driving substrate having transistors embedded in a matrix and having pads electrically connected to respective transistors on a surface thereof, and forming a membrane while continuously changing a frequency of a high frequency in a growth chamber. And a membrane forming process having a bending force as a whole as the extension stress is applied to the lower end of the membrane and the compressive stress is applied as it is deposited from the lower part to the upper part, and an opening for exposing the pad to a predetermined portion of the membrane is formed. Forming a photosensitive film pattern defining an electrode isolation region for electrically separating actuators adjacent to a predetermined portion of an upper portion of the membrane; and forming a plug in the opening to electrically connect the plug to the pad. And forming a lower electrode on the membrane and the photoresist pattern so as to be electrically connected to the plug, and simultaneously removing the lower electrode material formed on the photoresist pattern with the photoresist pattern. And forming an upper electrode sequentially, separating the actuator by etching the sacrificial layer from the upper electrode to the membrane, and forming a protective film on the surface of the upper electrode and the side of the actuator; And a process for removing the sacrificial film and the protective film. The method of claim 1, wherein the sacrificial layer is formed of PSG (Phospho-Silicate Glass). The method of claim 2, wherein the sacrificial layer is deposited to a thickness of 0.1 to 2 μm. The method of claim 1, wherein the membrane is formed of a silicon nitride or a silicide of silicon carbide. The method of claim 4, wherein the membrane is deposited to a thickness of 0.1 to 2 μm by PECVD. The optical path control apparatus according to claim 5, wherein the membrane is deposited to have a stretch stress at a high frequency of about 2000 to 10000 KHz, and the second membrane is deposited to have a compressive stress at a high frequency of about 10 to 1000 KHz. Manufacturing method. The method of claim 5, wherein the membrane is deposited to be subjected to compressive stress at a high frequency state of about 10 to 100 KHz, and the optical path control apparatus for depositing a second membrane to be subjected to stretching stress at a high frequency state of about 2000 to 10000 KHz. Way. The method of claim 1, wherein the lower electrode is formed of platinum (Pt) or platinum / titanium (Pt / Ti). The method of claim 8, wherein the lower electrode is deposited to a thickness of 500 to 2000 kPa by sputtering or vacuum deposition. The method of claim 1, wherein the deformable part is formed of a piezoelectric ceramic of BaTiO ₃ , PZT (Pb (Zr, Ti) O ₃ ) or PLZT (Pb, La) (Zr, Ti) O ₃ ). . The method of manufacturing an optical path control device according to claim 1, wherein the deformable part is formed of a total distortion ceramic such as PMN (Pb (Mg, Nb) O ₃ ). The manufacturing method of the optical path control apparatus of Claim 10 or 11 which forms the said deformation | transformation part in thickness of 0.1-2 micrometers. 13. The method of claim 12, wherein the deforming part is formed by sputtering. The method of claim 12, wherein the deformation part is formed by spin coating or spray coating. The method of claim 1, wherein the upper electrode is formed of aluminum (Al) or silver (Ag) having good electrical and reflective properties. 16. The method of claim 15, wherein the upper electrode is formed to a thickness of 500 to 2000 kPa by sputtering or vacuum deposition. ※ Note: The disclosure is based on the initial application.