KR970047009U - Slim Semiconductor Package - Google Patents
Slim Semiconductor PackageInfo
- Publication number
- KR970047009U KR970047009U KR2019950053235U KR19950053235U KR970047009U KR 970047009 U KR970047009 U KR 970047009U KR 2019950053235 U KR2019950053235 U KR 2019950053235U KR 19950053235 U KR19950053235 U KR 19950053235U KR 970047009 U KR970047009 U KR 970047009U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- slim semiconductor
- slim
- package
- semiconductor
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950053235U KR970047009U (en) | 1995-12-29 | 1995-12-29 | Slim Semiconductor Package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950053235U KR970047009U (en) | 1995-12-29 | 1995-12-29 | Slim Semiconductor Package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970047009U true KR970047009U (en) | 1997-07-31 |
Family
ID=60874987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950053235U KR970047009U (en) | 1995-12-29 | 1995-12-29 | Slim Semiconductor Package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970047009U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100726967B1 (en) * | 2005-11-24 | 2007-06-14 | 한국광기술원 | Wireless Bonding Method in LED Packaging |
-
1995
- 1995-12-29 KR KR2019950053235U patent/KR970047009U/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100726967B1 (en) * | 2005-11-24 | 2007-06-14 | 한국광기술원 | Wireless Bonding Method in LED Packaging |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |