KR970047009U - Slim Semiconductor Package - Google Patents

Slim Semiconductor Package

Info

Publication number
KR970047009U
KR970047009U KR2019950053235U KR19950053235U KR970047009U KR 970047009 U KR970047009 U KR 970047009U KR 2019950053235 U KR2019950053235 U KR 2019950053235U KR 19950053235 U KR19950053235 U KR 19950053235U KR 970047009 U KR970047009 U KR 970047009U
Authority
KR
South Korea
Prior art keywords
semiconductor package
slim semiconductor
slim
package
semiconductor
Prior art date
Application number
KR2019950053235U
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019950053235U priority Critical patent/KR970047009U/en
Publication of KR970047009U publication Critical patent/KR970047009U/en

Links

KR2019950053235U 1995-12-29 1995-12-29 Slim Semiconductor Package KR970047009U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950053235U KR970047009U (en) 1995-12-29 1995-12-29 Slim Semiconductor Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950053235U KR970047009U (en) 1995-12-29 1995-12-29 Slim Semiconductor Package

Publications (1)

Publication Number Publication Date
KR970047009U true KR970047009U (en) 1997-07-31

Family

ID=60874987

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950053235U KR970047009U (en) 1995-12-29 1995-12-29 Slim Semiconductor Package

Country Status (1)

Country Link
KR (1) KR970047009U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726967B1 (en) * 2005-11-24 2007-06-14 한국광기술원 Wireless Bonding Method in LED Packaging

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100726967B1 (en) * 2005-11-24 2007-06-14 한국광기술원 Wireless Bonding Method in LED Packaging

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application