KR970046919U - Ball grid array package element - Google Patents

Ball grid array package element

Info

Publication number
KR970046919U
KR970046919U KR2019950048428U KR19950048428U KR970046919U KR 970046919 U KR970046919 U KR 970046919U KR 2019950048428 U KR2019950048428 U KR 2019950048428U KR 19950048428 U KR19950048428 U KR 19950048428U KR 970046919 U KR970046919 U KR 970046919U
Authority
KR
South Korea
Prior art keywords
grid array
ball grid
array package
package element
ball
Prior art date
Application number
KR2019950048428U
Other languages
Korean (ko)
Other versions
KR0131750Y1 (en
Inventor
최종해
김진성
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950048428U priority Critical patent/KR0131750Y1/en
Publication of KR970046919U publication Critical patent/KR970046919U/en
Application granted granted Critical
Publication of KR0131750Y1 publication Critical patent/KR0131750Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
KR2019950048428U 1995-12-27 1995-12-27 Ball grid array package device KR0131750Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950048428U KR0131750Y1 (en) 1995-12-27 1995-12-27 Ball grid array package device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950048428U KR0131750Y1 (en) 1995-12-27 1995-12-27 Ball grid array package device

Publications (2)

Publication Number Publication Date
KR970046919U true KR970046919U (en) 1997-07-31
KR0131750Y1 KR0131750Y1 (en) 1998-12-01

Family

ID=19439098

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950048428U KR0131750Y1 (en) 1995-12-27 1995-12-27 Ball grid array package device

Country Status (1)

Country Link
KR (1) KR0131750Y1 (en)

Also Published As

Publication number Publication date
KR0131750Y1 (en) 1998-12-01

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