KR970033732A - Motion control device of injection molding mold using vacuum adsorption - Google Patents

Motion control device of injection molding mold using vacuum adsorption Download PDF

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Publication number
KR970033732A
KR970033732A KR1019950055574A KR19950055574A KR970033732A KR 970033732 A KR970033732 A KR 970033732A KR 1019950055574 A KR1019950055574 A KR 1019950055574A KR 19950055574 A KR19950055574 A KR 19950055574A KR 970033732 A KR970033732 A KR 970033732A
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South Korea
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vacuum
mold
injection molding
cavity
controller
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KR1019950055574A
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Korean (ko)
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KR0164994B1 (en
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양재호
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배순훈
대우전자 주식회사
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Abstract

본 발명은 수지를 용융하여 금형에 사출하고 냉각 고화하여 제품을 성형하는 사출성형기의 사출성형금형에 관한 것으로서 사출성형시 급속온수기(7)에서 금형하측부(32)의 냉각수로 공급되는 온수의 가열에 의해 금형의 온도를 상승시키게 되어, 캐비티(37)내의 용융수지의 유동성을 향상시키고, 가스벤트(3a)(3b)(3c)를 통한 진공탱크(11)의 진공흡착으로 사출압을 저하시키게 되므로 사출기의 형체력이 감소되어 금형의 크기를 축소시키도록 함과, 캐비티(37) 좁은 폭이 가능해지므로 제품의 두께가 얇아져 제품의 중량이 절감되도록 함은 물론 수지의 소모량이 절감되도록 하고, 상기 용융수지의 유동성이 향상됨에 따라 외관품질이 향상되도록 하는 진공흡착을 이용한 사출성형금형의 동작제어장치에 관한 것이다.The present invention relates to an injection molding mold of an injection molding machine that melts a resin, injects it into a mold, and solidifies and cools the product, thereby heating hot water supplied from the rapid hot water heater 7 to the cooling water of the lower mold 32 during injection molding. This increases the temperature of the mold, thereby improving the flowability of the molten resin in the cavity 37 and lowering the injection pressure by vacuum adsorption of the vacuum tank 11 through the gas vents 3a, 3b, 3c. Therefore, the clamping force of the injection molding machine is reduced to reduce the size of the mold, and the narrow width of the cavity 37 becomes possible, so that the thickness of the product is reduced, so that the weight of the product is reduced, as well as the consumption of resin, and the melting The present invention relates to an operation control apparatus for injection molding mold using vacuum adsorption to improve appearance quality as the flowability of the resin is improved.

Description

진공흡착을 이용한 사출성형금형의 동작제어장치Motion control device of injection molding mold using vacuum adsorption

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 일반적인 사출성형과정을 보인 개략도.1 is a schematic view showing a general injection molding process.

제2도는 종래 사출성형금형의 구성을 보인 상세도.2 is a detailed view showing the configuration of a conventional injection molding mold.

제3도는 본 발명에 따른 사출성형금형의 구성을 보인 상세도.Figure 3 is a detailed view showing the configuration of the injection molding mold according to the present invention.

제4도는 본 발명에 따른 사출성형금형의 제어장치의 구성을 보인 구성도.Figure 4 is a block diagram showing the configuration of a control device for injection molding mold according to the present invention.

Claims (4)

고정측판(33)에 설치된 금형상측부(31)와 이동측판(34)에 설치된 금형하측부(32)가 분리 및 접촉되는 캐비티(37)가 형성되어 제품을 사출성형하는 사출성형형금에 있어서, 상기 캐비티(37)내의 진공을 처리하는 진공처리장치와, 상기 상금형하측부(32)를 냉각 및 가열하는 냉온처리장치가 포함됨을 특징으로 하는 진공흡착을 이용한 사출성형금형의 동작제어장치.In the injection molding mold for injection molding a product by forming a cavity 37 in which the upper mold part 31 provided on the fixed side plate 33 and the lower mold part 32 provided on the movable side plate 34 are separated and contacted. And a vacuum processing apparatus for processing the vacuum in the cavity (37), and a cold / temperature processing apparatus for cooling and heating the upper mold lower portion (32). 제1항에 있어서, 상기 진공처리장치가 사출성형금형(30)을 제어하는 콘트롤러(1)와, 상기 금형상측부(31)에 금형하측부(32)가 닫힘을 감지하는 리미트스위치(2)와, 상기 캐비티(37)의 가스를 배출되도록 하는 가스벤트(3a)(3b)(3c)와, 상기 가스벤트(3a)(3b)(3c)에 연동되게 연결되어 상기 리미트스위치(2)의 감지신호 및 콘트롤러(1)의 제어에 의해 상기 캐비티(37)내의 가스를 진공흡착하는 진공탱크(11)와, 상기 진공탱크(11)의 진공도를 유지시켜 주는 진공발생기(4)와, 상기 콘트롤러(1)의 제어에 의해 상기 캐비티(37)내의 진공을 감지 및 진공흡착을 차단하는 진공감지솔레노이드밸브(9)(5a)(5b)(5c)로 구성됨을 특징으로 하는 진공흡착을 이용한 사출성형금형의 동작제어장치.According to claim 1, wherein the vacuum processing device is a controller (1) for controlling the injection molding mold 30, and the limit switch (2) for detecting the closing of the mold lower portion 32 in the upper mold 31 And a gas vent (3a) (3b) (3c) and the gas vent (3a) (3b) (3c) for discharging the gas of the cavity 37 is connected to the limit switch (2) of the A vacuum tank 11 for vacuum-suctioning gas in the cavity 37 under the control of a detection signal and the controller 1, a vacuum generator 4 for maintaining the degree of vacuum of the vacuum tank 11, and the controller Injection molding using vacuum suction, characterized in that the vacuum sensing solenoid valve (9) (5a) (5b) (5c) to sense the vacuum in the cavity 37 and block the vacuum suction by the control of (1) Mold motion control device. 제2항에 있어서, 상기 가스벤트(3a)(3b)(3c)가 상기 용융수지의 최종 충진완료 지점의 캐비티(37)의 위치에 필요 수만큼 설치됨을 특징으로 하는 진공흡착을 이용한 사출성형금형의 동작제어장치.3. The injection molding mold using vacuum adsorption according to claim 2, wherein the gas vents 3a, 3b, and 3c are installed in the number of required positions at the cavity 37 at the final filling point of the molten resin. Motion control device. 제1항에 있어서, 상기 냉온처리장치가 상기 리미트스위치(2)의 감지신호 및 상기 콘트롤러(1)의 제어에 의해 금형하측부(32)의 냉각수로(38)에 온수를 공급하여 가열하는 급속온수기(7)와, 상기 콘트롤러(1)의 제어에 의해 금형하측부(32)의 냉각수로(38)에 냉수를 공급하여 냉각시키는 냉각기(8)와, 상기 냉각수로(38)로 부터 배출되는 온수 및 냉수를 혼입 저장하는 리저버(10)와, 상기 콘트롤러(1)의 제어에 의해 급속온수기(7)의 온수와 냉각기(8)의 냉각수를 냉각수로(38)로 차단 및 공급하는 솔레노이드밸브(9)로 구성됨을 특징으로 하는 진공흡착을 이용한 사출성형금형의 동작제어장치.The method according to claim 1, wherein the cold / hot processing apparatus rapidly supplies hot water to the cooling water passage 38 of the lower mold 32 by heating the sensing signal of the limit switch 2 and the control of the controller 1. The water heater 7 and the cooler 8 for supplying and cooling cold water to the cooling water passage 38 of the lower mold 32 under the control of the controller 1 and discharged from the cooling water passage 38 A solenoid valve for blocking and supplying a reservoir 10 for mixing and storing hot water and cold water, and the hot water of the quick water heater 7 and the cooling water of the cooler 8 by the control of the controller 1. 9) an operation control apparatus for injection molding mold using vacuum adsorption, characterized in that consisting of. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950055574A 1995-12-23 1995-12-23 Movement controlling apparatus for injection molding mould using vacuum absorption KR0164994B1 (en)

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KR1019950055574A KR0164994B1 (en) 1995-12-23 1995-12-23 Movement controlling apparatus for injection molding mould using vacuum absorption

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Application Number Priority Date Filing Date Title
KR1019950055574A KR0164994B1 (en) 1995-12-23 1995-12-23 Movement controlling apparatus for injection molding mould using vacuum absorption

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KR970033732A true KR970033732A (en) 1997-07-22
KR0164994B1 KR0164994B1 (en) 1999-03-20

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Publication number Priority date Publication date Assignee Title
KR101066310B1 (en) * 2010-05-24 2011-09-20 주식회사 나노엔텍 A stamper inserted mold for manufacturing a biochip having microscopic pattern and macro pattern in one body and manufacturing method of the biochip using the same
KR101364715B1 (en) * 2012-02-13 2014-02-19 쓰리이엠주식회사 Vacuum forming apparatus and method of the same

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