KR970032344A - How to install parts of chip mounter - Google Patents

How to install parts of chip mounter Download PDF

Info

Publication number
KR970032344A
KR970032344A KR1019950040828A KR19950040828A KR970032344A KR 970032344 A KR970032344 A KR 970032344A KR 1019950040828 A KR1019950040828 A KR 1019950040828A KR 19950040828 A KR19950040828 A KR 19950040828A KR 970032344 A KR970032344 A KR 970032344A
Authority
KR
South Korea
Prior art keywords
feeder
adsorption
component
spare
mounting
Prior art date
Application number
KR1019950040828A
Other languages
Korean (ko)
Other versions
KR0177653B1 (en
Inventor
이성재
Original Assignee
배순훈
대우전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 배순훈, 대우전자 주식회사 filed Critical 배순훈
Priority to KR1019950040828A priority Critical patent/KR0177653B1/en
Publication of KR970032344A publication Critical patent/KR970032344A/en
Application granted granted Critical
Publication of KR0177653B1 publication Critical patent/KR0177653B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명은 칩형 부품 자동 장착중 장착할 해당 피더의 부품이 다 소모되면 예비로 준비한 동일 부품을 흡착하여 장착하도록 한 칩 마운터의 부품 장착방법에 관한 것이다.The present invention relates to a component mounting method of the chip mounter to suck and mount the same components prepared in advance when the components of the feeder to be mounted during the automatic mounting of the chip-shaped components are exhausted.

이러한 본 발명은 해당 피더를 부품 흡착위치로 이동시키고 인덱스를 회전시켜 장착할 부품을 흡착하는 단계와; 흡착한 부품의 상태를 검색하여 양호할 경우 PCB의 지정된 노드에 흡착한 부품을 장착하는 단계와; 검색한 부품의 상태가 불량할 경우 에러를 발생하고 장착 동작을 중지한후 흡착 불량 반복수틀 카운팅하는 단계와; 장착 동작 중지후 운전 스위치가 온되면 예비 피더를 검색하여 예비 피더가 없을 경우 인덱스를 회전시켜 흡착불량 피더의 부품을 재흡착하는 단계와; 예비 피더가 존재할 경우 실제 흡착불량 반복수와 기설정된 반복수를 비교하여 동일하면 예비피더를 흡착위치로 이동시키고 인덱스를 회전시켜 예비 부품을 흡착하는 단계를 순차 실행시키게 되는 것이다.The present invention includes the steps of moving the feeder to the component adsorption position and rotating the index to suck the components to be mounted; Retrieving the state of the adsorbed component and mounting the adsorbed component to a designated node of the PCB if it is satisfactory; Generating an error when the retrieved part is in a bad state, stopping the mounting operation, and counting a bad adsorption repeating frame; Searching for the spare feeder when the operation switch is turned on after stopping the mounting operation, and rotating the index if there is no spare feeder to resorb the parts of the poor adsorption feeder; If there is a spare feeder, the actual adsorption poor repeating number and the preset repeating number is the same, if the same is to move the pre-feeder to the adsorption position and rotate the index to adsorb the spare parts sequentially.

Description

칩 마운터의 부품 장착방법How to install parts of chip mounter

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 따른 부품 장착방법을 보이는 플로우 차트이다.3 is a flow chart showing a component mounting method according to the present invention.

제4도는 본 발명의 부품 장착법을 위한 데이터 구성도이다.4 is a data configuration diagram for the component mounting method of the present invention.

Claims (1)

해당 피더를 부품 흡착위치로 이동시키고 인덱스를 회전시켜 장착할 부품을 흡착하는 단계와; 상기 흡착한 부품의 상태를 검색하여 양호할 경우 PCB의 지정된 노드에 흡착한 부품을 장착하는 단계와; 상기 검색한 부품의 상태가 불량할 경우 에러를 발생하고 장착 동작을 중지한후 흡착 불량 반복수를 카운팅하는 단계와; 상기 장착 동작중지후 운전 스위치가 온되면 예비 피더를 검색하여 예비 피더가 없을 경우 인덱스를 회전시켜 흡착 불량 피더의 부품을 재흡착하는 단계와; 상기 예비 피더가 존재할 경우 실제 흡착불량 반복수와 기설정된 장착 데이터의 반복수를 비교하여 동일하면 예비 피더를 흡착위치로 이동시키고 인덱스를 회전시켜 예비 부품을 흡착하는 단계로 이루어짐을 특징으로 하는 칩 마운터의 부품 장착방법.Moving the feeder to the component suction position and rotating the index to suck the component to be mounted; Retrieving the state of the adsorbed component and mounting the adsorbed component to a designated node of the PCB if satisfactory; Counting the number of repeated adsorption defects after generating an error and stopping the mounting operation when the state of the searched component is poor; Searching for a pre-feeder when the operation switch is turned on after the mounting operation is stopped, and re-adsorbing a component of a bad adsorption feeder by rotating an index when there is no pre-feeder; If the spare feeder is present, the chip mounter comprising the step of adsorbing the spare parts by moving the spare feeder to the adsorption position and rotating the index if the same is compared by comparing the actual repetition of the number of bad adsorption and the number of repetition of the preset mounting data. How to install parts ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950040828A 1995-11-10 1995-11-10 Part mounting method of chip mounter KR0177653B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950040828A KR0177653B1 (en) 1995-11-10 1995-11-10 Part mounting method of chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950040828A KR0177653B1 (en) 1995-11-10 1995-11-10 Part mounting method of chip mounter

Publications (2)

Publication Number Publication Date
KR970032344A true KR970032344A (en) 1997-06-26
KR0177653B1 KR0177653B1 (en) 1999-05-15

Family

ID=19433762

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950040828A KR0177653B1 (en) 1995-11-10 1995-11-10 Part mounting method of chip mounter

Country Status (1)

Country Link
KR (1) KR0177653B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100305663B1 (en) * 1999-03-16 2001-09-26 정문술 A Method for Discriminating the Existence of an Electronic Element Using Vacuum Suction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100305663B1 (en) * 1999-03-16 2001-09-26 정문술 A Method for Discriminating the Existence of an Electronic Element Using Vacuum Suction

Also Published As

Publication number Publication date
KR0177653B1 (en) 1999-05-15

Similar Documents

Publication Publication Date Title
JPH0247119B2 (en)
JP2599510B2 (en) Component mounting machine
CN214334507U (en) Mobile phone PCB testing device
KR970032344A (en) How to install parts of chip mounter
USRE35027E (en) Pick and place method and apparatus
KR920005680A (en) Electronic device mounting method and device thereof
GB2298183A (en) Suction Mounting Head
KR850003105A (en) Automatic board-in board unloader and IC package software
JPH10173394A (en) Chip-mounting apparatus and method of mounting chip components
JP2900249B2 (en) Valve assembly method
EP0213746A2 (en) Method and apparatus for handling leaded and leadless surface mountable components
KR960003535A (en) Suction nozzle error detection method of electronic parts mounting
CN218301791U (en) Positioning tool for SMT paster processing
JP2000196296A (en) Method of mounting electronic components
JPH044800U (en)
KR960033190A (en) PCB position fixing device for electronic component mounter
KR950010734A (en) Centering method and device for electronic parts mounting machine
JPH07202491A (en) Chip resistor fitting method and device
JPH0680944B2 (en) Electronic component mounting method and apparatus therefor
JPS59225598A (en) Method of mounting electronic part
KR970002226B1 (en) A nozzle of chip mounter making method
JPH09232795A (en) Suction device and mounting device
JPH0529795A (en) Electronic part mounting apparatus, part attracting method, and part mounting method
JPH08222894A (en) Method and device for mounting electronic parts
JPH10107493A (en) Method for sucking electronic component

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee