KR970024018A - 반도체 웨이퍼 접착장치 - Google Patents

반도체 웨이퍼 접착장치 Download PDF

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Publication number
KR970024018A
KR970024018A KR1019950038997A KR19950038997A KR970024018A KR 970024018 A KR970024018 A KR 970024018A KR 1019950038997 A KR1019950038997 A KR 1019950038997A KR 19950038997 A KR19950038997 A KR 19950038997A KR 970024018 A KR970024018 A KR 970024018A
Authority
KR
South Korea
Prior art keywords
pair
wafer
wafer bonding
semiconductor wafer
bonding apparatus
Prior art date
Application number
KR1019950038997A
Other languages
English (en)
Other versions
KR0176164B1 (ko
Inventor
차기호
이병훈
이경욱
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950038997A priority Critical patent/KR0176164B1/ko
Priority to JP8234516A priority patent/JPH09115788A/ja
Priority to US08/723,239 priority patent/US5746883A/en
Publication of KR970024018A publication Critical patent/KR970024018A/ko
Application granted granted Critical
Publication of KR0176164B1 publication Critical patent/KR0176164B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

반도체 웨이퍼 접합장치가 개시되어 있다. 본 발명은 웨이퍼 접합장치에 있어서, 동일축 상에 놓여지고 서로 반대방향으로 회전하는 한 쌍의 로울러; 상기 한 쌍의 로울러에 각각 고정되고 표면에 홈이 형성된 한 쌍의 웨이퍼 지지대; 상기 하나의 웨이퍼 지지대의 끝 부분에 설치된 간격조절 핀; 및 상기 다른 하나의 웨이퍼 지지대의 소정부분에 설치된 압력 핀을 포함하는 것을 특징으로 하는 반도체 웨이퍼 접합장치를 제공한다.

Description

반도체 웨이퍼 접착장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 의한 반도체 웨이퍼 접합장치의 평면도,
제4도는 본 발명에 의한 반도체 웨이퍼 접합장치의 단면도,
제5도는 제3도의 B 부분을 확대하여 도시한 단면도이다.

Claims (2)

  1. 웨이퍼 접합장치에 있어서, 동일축 상에 놓여지고 서로 반대방향으로 회전하는 한 쌍의 로울러; 상기 한 쌍의 로울러에 각각 고정되고 표면에 홈이 형성된 한 쌍의 웨이퍼 지지대; 상기 하나의 웨이퍼 지지대의 끝 부분에 설치된 간격조절 핀; 및 상기 다른 하나의 웨이퍼 지지대의 소정부분에 설치된 압력 핀을 포함하는 것을 특징으로 하는 반도체 웨이퍼 접합장치.
  2. 제1항에 있어서, 상기 간격조절 핀은 상기 한 쌍의 웨이퍼 지지대가 서로 마주보도록 접할 때 일정간격을 유지하도록 하는 기능을 갖는 것을 특징으로 하는 반도체 웨이퍼 접합장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950038997A 1995-09-29 1995-10-31 반도체 웨이퍼 접착장치 KR0176164B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019950038997A KR0176164B1 (ko) 1995-10-31 1995-10-31 반도체 웨이퍼 접착장치
JP8234516A JPH09115788A (ja) 1995-09-29 1996-09-04 半導体ウェーハ接合装置
US08/723,239 US5746883A (en) 1995-09-29 1996-09-27 Apparatus for bonding semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950038997A KR0176164B1 (ko) 1995-10-31 1995-10-31 반도체 웨이퍼 접착장치

Publications (2)

Publication Number Publication Date
KR970024018A true KR970024018A (ko) 1997-05-30
KR0176164B1 KR0176164B1 (ko) 1999-04-15

Family

ID=19432517

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038997A KR0176164B1 (ko) 1995-09-29 1995-10-31 반도체 웨이퍼 접착장치

Country Status (1)

Country Link
KR (1) KR0176164B1 (ko)

Also Published As

Publication number Publication date
KR0176164B1 (ko) 1999-04-15

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