KR970023929A - Pad Placement Reduces Chip Area - Google Patents
Pad Placement Reduces Chip Area Download PDFInfo
- Publication number
- KR970023929A KR970023929A KR1019950038999A KR19950038999A KR970023929A KR 970023929 A KR970023929 A KR 970023929A KR 1019950038999 A KR1019950038999 A KR 1019950038999A KR 19950038999 A KR19950038999 A KR 19950038999A KR 970023929 A KR970023929 A KR 970023929A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- pads
- pad arrangement
- pad
- chip area
- Prior art date
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- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 발명은 반도체장치의 패드배치에 관해 개시한다. 본 발명의 패드배치는 모든 패드(Pad)를 칩 내부에 구비하는 패드 배치에 있어서, 상기 패드중 일부패드를 연결수단을 구비하여 칩 외부에 배치한 것을 특징으로 한다.The present invention discloses a pad arrangement of a semiconductor device. In the pad arrangement of the present invention, in the pad arrangement including all pads inside the chip, some pads of the pads are provided outside the chip with connection means.
본 발명은 패드배치에 의하면, 칩의 면적을 줄일 수 있고 전체적으로는 반도체장치의 고 집적화를 이룰 수 있다.According to the pad arrangement, the present invention can reduce the area of the chip and achieve high integration of the semiconductor device as a whole.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의한 패드배치를 나타낸 도면이다.2 is a view showing a pad arrangement according to the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038999A KR970023929A (en) | 1995-10-31 | 1995-10-31 | Pad Placement Reduces Chip Area |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038999A KR970023929A (en) | 1995-10-31 | 1995-10-31 | Pad Placement Reduces Chip Area |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970023929A true KR970023929A (en) | 1997-05-30 |
Family
ID=66585058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038999A KR970023929A (en) | 1995-10-31 | 1995-10-31 | Pad Placement Reduces Chip Area |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970023929A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859237B2 (en) | 2014-11-10 | 2018-01-02 | Samsung Electronics Co., Ltd. | Chip using triple pad configuration and packaging method thereof |
-
1995
- 1995-10-31 KR KR1019950038999A patent/KR970023929A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9859237B2 (en) | 2014-11-10 | 2018-01-02 | Samsung Electronics Co., Ltd. | Chip using triple pad configuration and packaging method thereof |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |