KR970018407A - Semiconductor pad structure - Google Patents

Semiconductor pad structure Download PDF

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Publication number
KR970018407A
KR970018407A KR1019950031108A KR19950031108A KR970018407A KR 970018407 A KR970018407 A KR 970018407A KR 1019950031108 A KR1019950031108 A KR 1019950031108A KR 19950031108 A KR19950031108 A KR 19950031108A KR 970018407 A KR970018407 A KR 970018407A
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KR
South Korea
Prior art keywords
pad
semiconductor
square
semiconductor pad
once
Prior art date
Application number
KR1019950031108A
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Korean (ko)
Inventor
이치훈
김선준
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950031108A priority Critical patent/KR970018407A/en
Publication of KR970018407A publication Critical patent/KR970018407A/en

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Abstract

본 발명은 패키지 크랙(PACKAGE CRACK)을 개선하기 위한 반도체 패드 구조에 관한 것으로, 정사각형의 구조로 구성된 반도체 패드에 있어서, 상기 패드의 정사각형의 각 모서리 부분을 적어도 한 번 이상 절단하여, 반도체 패드의 모든 내각이 90° 보다 크고 180° 보다 작게 되도록 구성된 것을 특징으로 한다. 본 발명에 의하면, 종래의 정사각형 구조로 된 패드의 각 모서리 부분을 적어도 한번 이상 절단함으로써, 패시베이션에 대한 패드 내의 특정부위 스트레스 집중도를 분산, 완화하여 반도체 패드의 기하학적인 형상의 변경만으로도 크랙 발생을 최소화 시킬 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pad structure for improving a package crack. In a semiconductor pad having a square structure, each corner portion of the square of the pad is cut at least once to prevent all of the semiconductor pads. The cabinet is characterized in that it is configured to be larger than 90 ° and smaller than 180 °. According to the present invention, by cutting each corner portion of a pad having a conventional square structure at least once, dispersing and mitigating stress concentration in a specific portion of the pad for passivation, thereby minimizing crack generation even by changing the geometric shape of the semiconductor pad. You can.

Description

반도체 패드 구조Semiconductor pad structure

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 의한 반도체 패드 구조의 일 실시예를 도시한 도면이다.2 is a view showing an embodiment of a semiconductor pad structure according to the present invention.

제3도는 제2도에 도시된 반도체 패드의 단면도를 도시한 도면이다.3 is a cross-sectional view of the semiconductor pad illustrated in FIG. 2.

Claims (2)

정사각형의 구조로 구성된 반도체 패드에 있어서, 상기 패드의 정사각형의 각 모서리 부분을 적어도 한번 이상 절단하여, 반도체 패드의 모든 내각이 90° 보다 크고 180° 보다 작게 되도록 구성된 것을 특징으로 하는 반도체 패드 구조.12. A semiconductor pad structure having a square structure, wherein each corner portion of the square of the pad is cut at least once, so that all internal angles of the semiconductor pad are larger than 90 degrees and smaller than 180 degrees. 제1항에 있어서, 절단되어 형성된 새로운 모서리변의 길이는 상기 정사각형 패드의 각 모서리길이의 25% 이내로 함을 특징으로 하는 반도체 패드 구조.The semiconductor pad structure as claimed in claim 1, wherein the length of the new corner edge formed by cutting is within 25% of each edge length of the square pad.
KR1019950031108A 1995-09-21 1995-09-21 Semiconductor pad structure KR970018407A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950031108A KR970018407A (en) 1995-09-21 1995-09-21 Semiconductor pad structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950031108A KR970018407A (en) 1995-09-21 1995-09-21 Semiconductor pad structure

Publications (1)

Publication Number Publication Date
KR970018407A true KR970018407A (en) 1997-04-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950031108A KR970018407A (en) 1995-09-21 1995-09-21 Semiconductor pad structure

Country Status (1)

Country Link
KR (1) KR970018407A (en)

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