KR970018343A - 클램프장치 - Google Patents

클램프장치 Download PDF

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Publication number
KR970018343A
KR970018343A KR1019960035265A KR19960035265A KR970018343A KR 970018343 A KR970018343 A KR 970018343A KR 1019960035265 A KR1019960035265 A KR 1019960035265A KR 19960035265 A KR19960035265 A KR 19960035265A KR 970018343 A KR970018343 A KR 970018343A
Authority
KR
South Korea
Prior art keywords
reinforcing plate
piezoelectric element
plate portion
preload
clamping device
Prior art date
Application number
KR1019960035265A
Other languages
English (en)
Other versions
KR100251433B1 (ko
Inventor
고이치 하라다
미노루 도리하타
다카유키 이이야마
Original Assignee
후지야마 겐지
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지야마 겐지, 가부시키가이샤 신가와 filed Critical 후지야마 겐지
Publication of KR970018343A publication Critical patent/KR970018343A/ko
Application granted granted Critical
Publication of KR100251433B1 publication Critical patent/KR100251433B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/06—Arrangements for positively actuating jaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B9/00—Hand-held gripping tools other than those covered by group B25B7/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
    • H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
    • H02N2/04—Constructional details
    • H02N2/043—Mechanical transmission means, e.g. for stroke amplification

Abstract

(과제) 보강판부의 변형을 끝까지 억지하여, 압전소자의 파괴를 방지한다.
(해결수단) 압전소자(20)에 보강판부(13)를 통하여 예압을 부여하는 소자예압조정나사(21)를 구비하고, 상기 보강판부(13)는 소자예압조정나사(21)가 나사맞춤한 나사부착부(11)에 신축가능한 가요성부(12A,12B)를 통해 접속되어 있다.

Description

클램프장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 클램프장치의 하나의 실시예를 나타내는 정면도이다.

Claims (2)

  1. 한쌍의 클램프클릭이 각각 부착된 한쌍의 클램프아암과, 상기 클램프클릭을 개폐시키어 워크를 클램프시키는 압전소자 및 이 압전소자의 신축동작을 확대하는 확대기구와, 상기 압전소자에 보강판부를 통하여 예압을 부여하는 소자예압조정나사를 구비한 클램프장치에 있어서, 상기 보강판부는, 상기 소자예압조정나사가 나사맞춤된 부착부에 신축가능한 가요성부를 통해 접속되어 있는 것을 특징으로 하는 클램프 장치.
  2. 제1항에 있어서, 상기 가요성부는, 주름상자 구조로 이루어지는 것을 특징으로 하는 클램프장치.
KR1019960035265A 1995-09-13 1996-08-24 클램프장치 KR100251433B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-259510 1995-09-13
JP07259510A JP3079503B2 (ja) 1995-09-13 1995-09-13 クランプ装置

Publications (2)

Publication Number Publication Date
KR970018343A true KR970018343A (ko) 1997-04-30
KR100251433B1 KR100251433B1 (ko) 2000-04-15

Family

ID=17335112

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960035265A KR100251433B1 (ko) 1995-09-13 1996-08-24 클램프장치

Country Status (4)

Country Link
US (1) US5746422A (ko)
JP (1) JP3079503B2 (ko)
KR (1) KR100251433B1 (ko)
TW (1) TW342527B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092863A (ja) * 1996-09-13 1998-04-10 Tosok Corp ボンディング装置用ワイヤクランパ
US5901896A (en) * 1997-06-26 1999-05-11 Kulicke And Soffa Investments, Inc Balanced low mass miniature wire clamp
US6548938B2 (en) * 2000-04-18 2003-04-15 Viking Technologies, L.C. Apparatus having a pair of opposing surfaces driven by a piezoelectric actuator
US6879087B2 (en) * 2002-02-06 2005-04-12 Viking Technologies, L.C. Apparatus for moving a pair of opposing surfaces in response to an electrical activation
US6759790B1 (en) * 2001-01-29 2004-07-06 Viking Technologies, L.C. Apparatus for moving folded-back arms having a pair of opposing surfaces in response to an electrical activation
CN1666352B (zh) * 2002-07-03 2011-09-14 瓦伊金技术有限公司 起机械杠杆作用的灵巧器件操作机构上的温度补偿嵌入件
JP4791957B2 (ja) * 2003-04-04 2011-10-12 バイキング テクノロジィーズ エル．シー． 機能材料アクチュエータ製品からの仕事を最適化する機器および方法
DE102005023767A1 (de) * 2005-05-19 2006-11-23 Otto-Von-Guericke-Universität Magdeburg Stellantrieb
US7731138B2 (en) 2005-05-26 2010-06-08 Covidien Ag Flexible clamping apparatus for medical devices
US7980521B2 (en) 2007-05-04 2011-07-19 Tyco Healthcare Group Lp Medical device safety support with infinite positioning
CH698828B1 (de) * 2007-06-11 2009-11-13 Esec Ag Drahtklammer für einen Wire Bonder.
US7546993B1 (en) 2008-03-25 2009-06-16 Tyco Healthcare Group Lp Flexible clamping apparatus for medical devices
SG157975A1 (en) * 2008-06-18 2010-01-29 Mfg Integration Technology Ltd Adaptive clamp width adjusting device
US8499431B2 (en) * 2009-10-26 2013-08-06 Robert Bosch Gmbh Piezoelectric clamping device
TWI643276B (zh) * 2016-08-23 2018-12-01 日商新川股份有限公司 夾線裝置的校準方法以及打線裝置
CN107414477B (zh) * 2017-08-18 2019-03-15 天津大学 一种压电驱动式二自由度高精度微操作夹持器
CN114619423B (zh) * 2022-01-27 2023-11-21 华南理工大学 一种跨尺度微小零件自适应柔顺装配机构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296781A (ja) * 1985-06-25 1986-12-27 Nec Corp 圧電型駆動装置
JPH01245532A (ja) * 1988-03-26 1989-09-29 Toshiba Corp ワイヤクランプ機構
US5314175A (en) * 1990-02-27 1994-05-24 Matsushita Electric Industrial Co., Ltd. Wire clamping device and wire clamping method
JPH0616519A (ja) * 1992-07-02 1994-01-25 Dainippon Ink & Chem Inc 農園芸用肥料
US5334415A (en) * 1992-09-21 1994-08-02 Compaq Computer Corporation Method and apparatus for film coated passivation of ink channels in ink jet printhead
JP3005783B2 (ja) * 1993-03-09 2000-02-07 株式会社新川 ワイヤクランパ
JP3005784B2 (ja) * 1993-03-09 2000-02-07 株式会社新川 ワイヤクランパ

Also Published As

Publication number Publication date
JPH0982745A (ja) 1997-03-28
US5746422A (en) 1998-05-05
TW342527B (en) 1998-10-11
KR100251433B1 (ko) 2000-04-15
JP3079503B2 (ja) 2000-08-21

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