KR970018216A - Planarization Method of Semiconductor Device - Google Patents
Planarization Method of Semiconductor Device Download PDFInfo
- Publication number
- KR970018216A KR970018216A KR1019950031794A KR19950031794A KR970018216A KR 970018216 A KR970018216 A KR 970018216A KR 1019950031794 A KR1019950031794 A KR 1019950031794A KR 19950031794 A KR19950031794 A KR 19950031794A KR 970018216 A KR970018216 A KR 970018216A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- insulating film
- planarization
- semiconductor substrate
- semiconductor device
- Prior art date
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Abstract
본 발명은 평탄화를 위해 플로우 공정을 수행함으로써 발생되는 종래의 평탄화 기술의 문제점을 해결하기 위한 것으로, 플로우 공정대신 포토레지스트(4)나 SOG(5)를 도포하여 에치 백함으로써 금속 콘택을 위한 사진식각 공정에서 패턴의 형성 및 임계 치수의 조정이 용이하고, 고단차로 인한 과식각을 방지할 수 있으며, 단차로 인간 잔류물의 발생을 최대로 줄일 수 있게 된다.The present invention is to solve the problem of the conventional planarization technology caused by performing a flow process for planarization, and instead of the flow process by applying a photoresist (4) or SOG (5) to etch back the photo etch for metal contact It is easy to form patterns and adjust critical dimensions in the process, to prevent over-etching due to high steps, and to minimize the generation of human residues by steps.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2A도 내지 제2C도는 본 발명의 바람직한 일 실시예에 따른 평탄화 방법을 설명하기 위한 도면,2A to 2C are views for explaining a planarization method according to an embodiment of the present invention,
제3A도 및 제3B도는 본 발명의 바람직한 다른 실시예에 따른 평탄화 방법을 설명하기 위한 도면.3A and 3B are views for explaining a planarization method according to another preferred embodiment of the present invention.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950031794A KR970018216A (en) | 1995-09-26 | 1995-09-26 | Planarization Method of Semiconductor Device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950031794A KR970018216A (en) | 1995-09-26 | 1995-09-26 | Planarization Method of Semiconductor Device |
Publications (1)
Publication Number | Publication Date |
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KR970018216A true KR970018216A (en) | 1997-04-30 |
Family
ID=66615581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950031794A KR970018216A (en) | 1995-09-26 | 1995-09-26 | Planarization Method of Semiconductor Device |
Country Status (1)
Country | Link |
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KR (1) | KR970018216A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100737379B1 (en) * | 2005-12-06 | 2007-07-09 | 한국전자통신연구원 | Method of planarization for semiconductor substrate |
-
1995
- 1995-09-26 KR KR1019950031794A patent/KR970018216A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100737379B1 (en) * | 2005-12-06 | 2007-07-09 | 한국전자통신연구원 | Method of planarization for semiconductor substrate |
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