KR970003738A - Flawed heater block - Google Patents

Flawed heater block Download PDF

Info

Publication number
KR970003738A
KR970003738A KR1019950018129A KR19950018129A KR970003738A KR 970003738 A KR970003738 A KR 970003738A KR 1019950018129 A KR1019950018129 A KR 1019950018129A KR 19950018129 A KR19950018129 A KR 19950018129A KR 970003738 A KR970003738 A KR 970003738A
Authority
KR
South Korea
Prior art keywords
heater block
groove
semiconductor chip
seating portion
block according
Prior art date
Application number
KR1019950018129A
Other languages
Korean (ko)
Other versions
KR0150705B1 (en
Inventor
이윤수
김병만
방정호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950018129A priority Critical patent/KR0150705B1/en
Publication of KR970003738A publication Critical patent/KR970003738A/en
Application granted granted Critical
Publication of KR0150705B1 publication Critical patent/KR0150705B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 리드 온 칩 구조를 갖는 반도체 패키지의 와이어 본딩공정에 사용되는 몸체부와 안착부를 갖는 히터 블록에 있어서, 상기 안착부에 원형홈과 직선형홈을 형성시켜서; 리드프레임의 내부리드가 작업 공차내의 범위에서 기울어지거나휘어진 경우 및 공급 실수(Feeding Error)와; 반도체 칩을 안착시킬 경우에 있어서, 상기 반도체 칩이 안착부에 미세하게 비뚤어지게 안착되더라도 히터 블록과 직접적으로 접촉되는 경우와; 안착부 표면의 먼지 등으로 인해 반도체 칩의 밑면이손상을 입게 되는 것을 방지할 수 있는 효과를 나타내는 것을 특징으로 한다.The present invention provides a heater block having a body portion and a seating portion used in a wire bonding process of a semiconductor package having a lead-on chip structure, comprising: forming a circular groove and a straight groove in the seating portion; When the inner lead of the lead frame is inclined or warped in the working tolerance range and a feeding error; In the case of mounting the semiconductor chip, the semiconductor chip is in direct contact with the heater block even if the semiconductor chip is seated slightly crooked; Characterized in that the bottom surface of the semiconductor chip is prevented from being damaged by dust or the like on the seating surface.

Description

홈을 갖는 히터 블록Heater block with groove

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 따른 히터 블록의 사시도, 제4도는 본 발명에 따른 히터 블록을 이용하여 리드 온 칩 반도체 패키지의 와이어 본딩이 완료된 상태를 도시한 단면도.3 is a perspective view of a heater block according to the present invention, and FIG. 4 is a cross-sectional view showing a state in which wire bonding of a lead-on-chip semiconductor package is completed using the heater block according to the present invention.

Claims (6)

리드 온 칩 구조를 갖는 반도체 패키지의 와이어 본딩공정에 사용되는 기구로써, 열이 발생되는 몸체부와; 반도체 칩이 안착되는 안착부를 갖는 히터 블록에 있어서, 상기 안착부에 형성된 원형홈과; 상기 안착부 표면의 이물질로인한 상기 반도체 칩 밑면의 손상을 방지하는 직선홈이 상기 안착부 외곽 말단에 형성된 것을 특징으로 하는 홈을 갖는히터 블록.An apparatus used in a wire bonding process of a semiconductor package having a lead-on-chip structure, the apparatus comprising: a body portion for generating heat; A heater block having a seating portion on which a semiconductor chip is mounted, comprising: a circular groove formed in the seating portion; The heater block having a groove, characterized in that a straight groove for preventing damage to the bottom surface of the semiconductor chip due to foreign matter on the surface of the seating portion is formed on the outer end of the seating portion. 제1항에 있어서, 상기 원형홈이 상기 안착부의 각 모서리마다 형성된 것을 특징으로 하는 홈을 갖는 히터 블록.The heater block according to claim 1, wherein the circular groove is formed at each corner of the seating portion. 제1항에 있어서, 상기 원형홈들 사이에 직선형홈이 형성된 것을 특징으로 하는 홈을 갖는 히터 블록.The heater block according to claim 1, wherein a straight groove is formed between the circular grooves. 제3항에 있어서, 상기 직선형홈이 상기 반도체 칩이 안착되는 면적의 내측으로 일정 길이만큼을 포함하여 형성된 것을 특징으로 하는 홈을 갖는 히터 블록.The heater block according to claim 3, wherein the straight groove includes a predetermined length inwardly of an area where the semiconductor chip is seated. 제1항에 있어서, 상기 원형홈과 상기 직선형홈이 일체형으로 형성된 것을 특징으로 하는 홈을 갖는 히터블록.The heater block according to claim 1, wherein the circular groove and the linear groove are integrally formed. 제1항에 있어서, 상기 원형홈과 상기 직선형홈이 분리형으로 형성된 것을 특징으로 하는 홈을 갖는 히터블록.The heater block according to claim 1, wherein the circular groove and the linear groove are formed separately. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950018129A 1995-06-29 1995-06-29 A heater block with a groove KR0150705B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950018129A KR0150705B1 (en) 1995-06-29 1995-06-29 A heater block with a groove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950018129A KR0150705B1 (en) 1995-06-29 1995-06-29 A heater block with a groove

Publications (2)

Publication Number Publication Date
KR970003738A true KR970003738A (en) 1997-01-28
KR0150705B1 KR0150705B1 (en) 1998-12-01

Family

ID=19418746

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950018129A KR0150705B1 (en) 1995-06-29 1995-06-29 A heater block with a groove

Country Status (1)

Country Link
KR (1) KR0150705B1 (en)

Also Published As

Publication number Publication date
KR0150705B1 (en) 1998-12-01

Similar Documents

Publication Publication Date Title
KR950001998A (en) Semiconductor device having a small die pad and manufacturing method thereof
KR890012380A (en) Electronic device package and manufacturing method
KR880005684A (en) Semiconductor device
KR920702549A (en) Semiconductor device and manufacturing method thereof
KR980006174A (en) Rip Lead Package
GB2241379B (en) A semiconducter package
KR850005152A (en) Semiconductor device
KR970003738A (en) Flawed heater block
KR920015521A (en) Semiconductor device and manufacturing method thereof
KR940016723A (en) Semiconductor lead frame
KR910001949A (en) Flagless Leadframes, Packages and Methods
KR920010803A (en) Wire Bonding Semiconductor Device
KR930011189A (en) Lead frame structure and wire bonding method of semiconductor device
KR930017160A (en) Semiconductor package
KR930002033Y1 (en) Lead-frame
KR930007925Y1 (en) Internal lead moving protecting lead-frame
KR950034719A (en) Lead frame and package device manufacturing method including the lead frame
JPH0878590A (en) Lead frame
KR970018472A (en) Leadframe pads for surface mount semiconductor chip packages
JPH0228353A (en) Resin sealed type semiconductor device
KR950025970A (en) Lead Frames for Semiconductor Packages
KR970008540A (en) Lead Structure of Semiconductor Package Leadframe
KR970013275A (en) Semiconductor chip package with lead frame with through hole
KR970013262A (en) Leadframe with Extended Internal Leads
KR950010042A (en) Lead Frames for Semiconductor Devices

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080602

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee