KR970000007B1 - Device for transporting and positioning semiconductor wafer-type workpieces - Google Patents

Device for transporting and positioning semiconductor wafer-type workpieces Download PDF

Info

Publication number
KR970000007B1
KR970000007B1 KR90010491A KR900010491A KR970000007B1 KR 970000007 B1 KR970000007 B1 KR 970000007B1 KR 90010491 A KR90010491 A KR 90010491A KR 900010491 A KR900010491 A KR 900010491A KR 970000007 B1 KR970000007 B1 KR 970000007B1
Authority
KR
South Korea
Prior art keywords
transporting
semiconductor wafer
type workpieces
positioning semiconductor
positioning
Prior art date
Application number
KR90010491A
Other languages
English (en)
Inventor
Alois Muller
Helmut Seidl
Erich Wimmer
Laszlo Eigner
Original Assignee
Wacker Siltronic Halbleitermat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic Halbleitermat filed Critical Wacker Siltronic Halbleitermat
Application granted granted Critical
Publication of KR970000007B1 publication Critical patent/KR970000007B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
KR90010491A 1989-07-14 1990-07-11 Device for transporting and positioning semiconductor wafer-type workpieces KR970000007B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3923405A DE3923405A1 (de) 1989-07-14 1989-07-14 Vorrichtung zum transportieren und positionieren von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, und verfahren zur nasschemischen oberflaechenbehandlung derselben

Publications (1)

Publication Number Publication Date
KR970000007B1 true KR970000007B1 (en) 1997-01-04

Family

ID=6385088

Family Applications (1)

Application Number Title Priority Date Filing Date
KR90010491A KR970000007B1 (en) 1989-07-14 1990-07-11 Device for transporting and positioning semiconductor wafer-type workpieces

Country Status (5)

Country Link
US (1) US5108513A (ko)
EP (1) EP0408021B1 (ko)
JP (1) JPH0744165B2 (ko)
KR (1) KR970000007B1 (ko)
DE (2) DE3923405A1 (ko)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073817B2 (ja) * 1990-06-15 1995-01-18 株式会社マトリックス 半導体ウェーハの表面処理装置
EP0557523B1 (en) * 1990-11-16 1997-08-20 Kabushiki Kaisha Watanabe Shoko Device for carrying thin plate-like substrate
DE4100526A1 (de) * 1991-01-10 1992-07-16 Wacker Chemitronic Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben
US5788425A (en) * 1992-07-15 1998-08-04 Imation Corp. Flexible system for handling articles
US5344365A (en) * 1993-09-14 1994-09-06 Sematech, Inc. Integrated building and conveying structure for manufacturing under ultraclean conditions
JP3331256B2 (ja) * 1994-05-10 2002-10-07 バイエルコーポレーション 試験片表裏判別手段
US5762084A (en) * 1994-07-15 1998-06-09 Ontrak Systems, Inc. Megasonic bath
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system
US5548505A (en) * 1994-07-15 1996-08-20 Oktrak Systems, Inc. Scrubber control system
DE19628620A1 (de) * 1995-08-08 1998-01-29 Heidelberger Druckmasch Ag Leiteinrichtung für einen frisch bedruckten Bogen
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
DE19901162C2 (de) * 1999-01-14 2002-03-14 Wacker Siltronic Halbleitermat Vorrichtung und Verfahren zum Reinigen von Halbleiterscheiben
NL1011487C2 (nl) * 1999-03-08 2000-09-18 Koninkl Philips Electronics Nv Werkwijze en inrichting voor het roteren van een wafer.
US6818604B2 (en) 2001-10-04 2004-11-16 Speedfam-Ipec Corporation System and method for cleaning workpieces
US20030168174A1 (en) * 2002-03-08 2003-09-11 Foree Michael Todd Gas cushion susceptor system
US6883250B1 (en) * 2003-11-04 2005-04-26 Asm America, Inc. Non-contact cool-down station for wafers
US11024527B2 (en) 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US7513822B2 (en) 2005-06-18 2009-04-07 Flitsch Frederick A Method and apparatus for a cleanspace fabricator
US9457442B2 (en) * 2005-06-18 2016-10-04 Futrfab, Inc. Method and apparatus to support process tool modules in a cleanspace fabricator
US9159592B2 (en) 2005-06-18 2015-10-13 Futrfab, Inc. Method and apparatus for an automated tool handling system for a multilevel cleanspace fabricator
US9059227B2 (en) 2005-06-18 2015-06-16 Futrfab, Inc. Methods and apparatus for vertically orienting substrate processing tools in a clean space
US10651063B2 (en) 2005-06-18 2020-05-12 Frederick A. Flitsch Methods of prototyping and manufacturing with cleanspace fabricators
US10627809B2 (en) 2005-06-18 2020-04-21 Frederick A. Flitsch Multilevel fabricators
US9339900B2 (en) 2005-08-18 2016-05-17 Futrfab, Inc. Apparatus to support a cleanspace fabricator
WO2007025199A2 (en) * 2005-08-26 2007-03-01 Flitsch Frederick A Multi-level cleanspace fabricator elevator system
CN102986016B (zh) 2005-09-18 2015-11-25 弗雷德里克·A·弗里奇 用于在洁净空间中垂直定位基片处理设备的方法和装置
JP4594241B2 (ja) 2006-01-06 2010-12-08 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びコンピュータプログラム
DE202006018111U1 (de) * 2006-07-25 2007-02-08 Lang, Marcus Vorrichtung zum beschleunigten nasschemischen Behandeln von Oberflächen
WO2009153061A1 (de) 2008-06-19 2009-12-23 Rena Gmbh Verfahren und vorrichtung zum transportieren von gegenständen
WO2010004800A1 (ja) * 2008-07-10 2010-01-14 オイレス工業株式会社 旋回流形成体及び非接触搬送装置
CN102239093B (zh) * 2008-11-18 2013-12-18 翁令司工业股份有限公司 非接触式运送装置
CN101875036A (zh) * 2009-04-30 2010-11-03 深圳富泰宏精密工业有限公司 转动装置
US8834073B2 (en) * 2010-10-29 2014-09-16 Corning Incorporated Transport apparatus having a measuring system and methods therefor
EP2648213B1 (en) 2012-04-04 2014-10-22 RENA GmbH Apparatus and method for the transport on a liquid
US9698042B1 (en) 2016-07-22 2017-07-04 Lam Research Corporation Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge
JP7437186B2 (ja) * 2020-02-26 2024-02-22 Ｊｓｗアクティナシステム株式会社 浮上搬送装置、及びレーザ処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3215238A (en) * 1963-10-30 1965-11-02 Rca Corp Orienting articles of manufacture
US3797889A (en) * 1971-12-30 1974-03-19 Texas Instruments Inc Workpiece alignment system
US3976329A (en) * 1974-09-09 1976-08-24 Texas Instruments Incorporated Vacuum braking system for semiconductor wafers
US4618292A (en) * 1977-02-28 1986-10-21 International Business Machines Corporation Controls for semiconductor wafer orientor
US4242038A (en) * 1979-06-29 1980-12-30 International Business Machines Corporation Wafer orienting apparatus
US4348139A (en) * 1980-04-30 1982-09-07 International Business Machines Corp. Gas film wafer transportation system
JPS63225028A (ja) * 1987-03-16 1988-09-20 Hitachi Ltd 搬送装置

Also Published As

Publication number Publication date
EP0408021B1 (de) 1993-10-06
EP0408021A1 (de) 1991-01-16
DE3923405A1 (de) 1991-01-24
JPH0355836A (ja) 1991-03-11
JPH0744165B2 (ja) 1995-05-15
US5108513A (en) 1992-04-28
DE59002987D1 (de) 1993-11-11

Similar Documents

Publication Publication Date Title
KR970000007B1 (en) Device for transporting and positioning semiconductor wafer-type workpieces
KR970010571B1 (en) Semiconductor device and its fabrication method
KR960008517B1 (en) Semiconductor device and the manufacturing method
EP0357064A3 (en) Metal bump type semiconductor device and method for manufacturing the same
GB8907898D0 (en) Semiconductor devices and fabrication thereof
GB9214440D0 (en) Semiconductor device and manufacturing method thereof
EP0345380A3 (en) Semiconductor device and manufacturing method thereof
EP0498446A3 (en) Multichip packaged semiconductor device and method for manufacturing the same
EP0543361A3 (en) Semiconductor device and method of manufacturing the same
EP0421735A3 (en) Semiconductor device and method of manufacturing the same
EP0519830A3 (en) Hemt type semiconductor device
EP0417787A3 (en) Multimold semiconductor device and the manufacturing method therefor
EP0386447A3 (en) Apparatus and method for processing a semiconductor wafer
GB2237931B (en) Semi-conductor device and manufacturing method thereof
GB2245424B (en) A semiconductor device and methods for manufacturing semiconductor devices
KR960000962B1 (en) Semiconductor device and the manufacturing method thereof
HK1009308A1 (en) Semi-conductor device and method of manufacturing the same
GB2238428B (en) Semiconductor device and manufacturing method thereof
EP0408868A3 (en) High voltage semiconductor device and fabrication process
EP0409256A3 (en) Semiconductor ic device and method for manufacturing the same
HK41890A (en) Semiconductor device and fabrication process thereof
EP0361283A3 (en) Resin-sealed type semiconductor device and method for manufacturing the same
EP0405301A3 (en) Method and apparatus for handling semiconductor wafers
KR950001757B1 (en) Semiconductor device and manufacturing method thereof
GB9215477D0 (en) Semiconductor device and manufacturing method therefor

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20011229

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee