KR960035985A - Semiconductor package - Google Patents

Semiconductor package Download PDF

Info

Publication number
KR960035985A
KR960035985A KR1019950006034A KR19950006034A KR960035985A KR 960035985 A KR960035985 A KR 960035985A KR 1019950006034 A KR1019950006034 A KR 1019950006034A KR 19950006034 A KR19950006034 A KR 19950006034A KR 960035985 A KR960035985 A KR 960035985A
Authority
KR
South Korea
Prior art keywords
semiconductor package
heat sink
semiconductor
semiconductor chip
package according
Prior art date
Application number
KR1019950006034A
Other languages
Korean (ko)
Inventor
유연철
한인규
김기정
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019950006034A priority Critical patent/KR960035985A/en
Publication of KR960035985A publication Critical patent/KR960035985A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 반도체 패키지에 관한 것으로서, 반도체 칩에서 발생하는 열을 외부로 방출시키기 위하여 반도체 패키지에 내장되어 있는 방열판의 구조를 반복되는 다수의 철부와 요부로 개선시켜서, 방열판의 표면적을 최대로 증대시켜 주므로써, 반도체 칩에서 발생되는 열의 방출을 신속하고 효과적으로 이루어지게하여 반도체에 대한 기능적 신뢰성을 높여 줄 수 있는 반도체 패키지를 제공하고자 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, in which the structure of a heat sink embedded in a semiconductor package is improved to a plurality of repetitive convexities and recesses in order to dissipate heat generated from a semiconductor chip to the outside, thereby maximizing the surface area of the heat sink In view of the above, it is intended to provide a semiconductor package capable of quickly and effectively dissipating heat generated from a semiconductor chip to increase functional reliability of the semiconductor.

Description

반도체 패키지Semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 반도체 패키지의 일구현예를 나타내는 구성도. 제3도는 본 발명에 따른 반도체 패키지의 다른 일구현예를 나타내는 구성도.2 is a block diagram showing an embodiment of a semiconductor package according to the present invention. 3 is a block diagram showing another embodiment of the semiconductor package according to the present invention.

Claims (5)

와이어(10)를 매개체로 리드프레임(20)과 연결되어 있는 반도체 칩(30)과, 이 반도체 칩(30)의 상면에 부착 고정되어 있는 반도체 칩 탑재판(40)과, 상기 리드프레임(20) 및 반도체 칩 탑재판(40)의 상면에 부착 고정되어 있는 방열판(50)과, 상기 각 구성품(20, 30, 40, 50)을 감싸고 있는 수지(60)로 이루어져 있는 반도체 패키지에 있어서, 상기 방열판(50)은 반복되는 철부(52)와 요부(54)로 구성되어 있는 것을 특징으로 하는 반도체 패키지.The semiconductor chip 30 connected to the lead frame 20 via the wire 10 as a medium, the semiconductor chip mounting plate 40 fixed to the upper surface of the semiconductor chip 30, and the lead frame 20. ) And a heat dissipation plate 50 attached to and fixed to an upper surface of the semiconductor chip mounting plate 40, and a semiconductor package comprising a resin 60 surrounding the components 20, 30, 40, and 50. The heat sink (50) is a semiconductor package, characterized in that consisting of the repetitive convex portion 52 and the recessed portion (54). 제1항에 있어서, 상기 방열판(50)의 상부는 외부로 돌출되는 있는 것을 특징으로 하는 반도체 패키지.The semiconductor package according to claim 1, wherein an upper portion of the heat sink (50) protrudes outward. 제1항에 있어서, 상기 방열판(50)의 철부(52a)는 사각수직판형으로 형성되어 있는 것을 특징으로 하는 반도체 패키지.The semiconductor package according to claim 1, wherein the convex portions (52a) of the heat sink (50) are formed in a rectangular vertical plate shape. 제1항에 있어서, 상기 방열판(50)의 철부(52b)는 사각기둥형으로 형성되어 있는 것을 특징으로하는 반도체 패키지.The semiconductor package according to claim 1, wherein the convex portions (52b) of the heat sink (50) are formed in a square pillar shape. 제1항에 있어서, 상기 방열판(50)의 철부(52c)는 사각뿔형으로 형성되어 있는 것을 특징으로 하는 반도체 패키지.The semiconductor package according to claim 1, wherein the convex portion (52c) of the heat sink (50) is formed in a quadrangular pyramid shape. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950006034A 1995-03-22 1995-03-22 Semiconductor package KR960035985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950006034A KR960035985A (en) 1995-03-22 1995-03-22 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950006034A KR960035985A (en) 1995-03-22 1995-03-22 Semiconductor package

Publications (1)

Publication Number Publication Date
KR960035985A true KR960035985A (en) 1996-10-28

Family

ID=66553501

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950006034A KR960035985A (en) 1995-03-22 1995-03-22 Semiconductor package

Country Status (1)

Country Link
KR (1) KR960035985A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990035568A (en) * 1997-10-31 1999-05-15 윤종용 package
KR100806061B1 (en) * 2002-04-11 2008-02-21 페어차일드코리아반도체 주식회사 Power semiconductor module for preventing chip crack and for improving thermal resistance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990035568A (en) * 1997-10-31 1999-05-15 윤종용 package
KR100806061B1 (en) * 2002-04-11 2008-02-21 페어차일드코리아반도체 주식회사 Power semiconductor module for preventing chip crack and for improving thermal resistance

Similar Documents

Publication Publication Date Title
KR960026690A (en) Semiconductor package
KR950024313A (en) High heat dissipation semiconductor package
KR960019689A (en) Downset Exposed Die Mount Pad Leadframe and Package
KR950030323A (en) Semiconductor device and production method of semiconductor device and semiconductor module
KR960035985A (en) Semiconductor package
KR950031665A (en) Electronic component cooling device and method
JP3157541B2 (en) Semiconductor package with heat sink
KR970053677A (en) Columnar package with heat sink
KR930014914A (en) Semiconductor package
JPS6325958A (en) Semiconductor device
KR960019679A (en) Semiconductor device
KR970053758A (en) Structure of Semiconductor Package
JPH0559851U (en) IC sealing case
KR960002778A (en) Die heat dissipation package
JPS62224049A (en) Electronic device
KR970030701A (en) Stacked Package with Heat Dissipation
KR970024058A (en) Package sealed with a metal lid
KR970053748A (en) Leadframe of Semiconductor Package
KR970030726A (en) Ball Grid Array Package with Lead Frame
KR960019678A (en) How to attach heat sink and lead frame of semiconductor package
JPH03104142A (en) Resin sealed type semiconductor device
KR960005962A (en) Heat Proof Heat Sink of Semiconductor Package
KR970024065A (en) Semiconductor chip package in which semiconductor chips are fixed by tie bars
JPH0617244U (en) Semiconductor device with resin-sealed heat sink
KR970024106A (en) Upset Adjusted Lead Frame and Semiconductor Chip Packages Using the Same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application