KR960035985A - Semiconductor package - Google Patents
Semiconductor package Download PDFInfo
- Publication number
- KR960035985A KR960035985A KR1019950006034A KR19950006034A KR960035985A KR 960035985 A KR960035985 A KR 960035985A KR 1019950006034 A KR1019950006034 A KR 1019950006034A KR 19950006034 A KR19950006034 A KR 19950006034A KR 960035985 A KR960035985 A KR 960035985A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- heat sink
- semiconductor
- semiconductor chip
- package according
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 발명은 반도체 패키지에 관한 것으로서, 반도체 칩에서 발생하는 열을 외부로 방출시키기 위하여 반도체 패키지에 내장되어 있는 방열판의 구조를 반복되는 다수의 철부와 요부로 개선시켜서, 방열판의 표면적을 최대로 증대시켜 주므로써, 반도체 칩에서 발생되는 열의 방출을 신속하고 효과적으로 이루어지게하여 반도체에 대한 기능적 신뢰성을 높여 줄 수 있는 반도체 패키지를 제공하고자 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, in which the structure of a heat sink embedded in a semiconductor package is improved to a plurality of repetitive convexities and recesses in order to dissipate heat generated from a semiconductor chip to the outside, thereby maximizing the surface area of the heat sink In view of the above, it is intended to provide a semiconductor package capable of quickly and effectively dissipating heat generated from a semiconductor chip to increase functional reliability of the semiconductor.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 따른 반도체 패키지의 일구현예를 나타내는 구성도. 제3도는 본 발명에 따른 반도체 패키지의 다른 일구현예를 나타내는 구성도.2 is a block diagram showing an embodiment of a semiconductor package according to the present invention. 3 is a block diagram showing another embodiment of the semiconductor package according to the present invention.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950006034A KR960035985A (en) | 1995-03-22 | 1995-03-22 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950006034A KR960035985A (en) | 1995-03-22 | 1995-03-22 | Semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960035985A true KR960035985A (en) | 1996-10-28 |
Family
ID=66553501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950006034A KR960035985A (en) | 1995-03-22 | 1995-03-22 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960035985A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990035568A (en) * | 1997-10-31 | 1999-05-15 | 윤종용 | package |
KR100806061B1 (en) * | 2002-04-11 | 2008-02-21 | 페어차일드코리아반도체 주식회사 | Power semiconductor module for preventing chip crack and for improving thermal resistance |
-
1995
- 1995-03-22 KR KR1019950006034A patent/KR960035985A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990035568A (en) * | 1997-10-31 | 1999-05-15 | 윤종용 | package |
KR100806061B1 (en) * | 2002-04-11 | 2008-02-21 | 페어차일드코리아반도체 주식회사 | Power semiconductor module for preventing chip crack and for improving thermal resistance |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960026690A (en) | Semiconductor package | |
KR950024313A (en) | High heat dissipation semiconductor package | |
KR960019689A (en) | Downset Exposed Die Mount Pad Leadframe and Package | |
KR950030323A (en) | Semiconductor device and production method of semiconductor device and semiconductor module | |
KR960035985A (en) | Semiconductor package | |
KR950031665A (en) | Electronic component cooling device and method | |
JP3157541B2 (en) | Semiconductor package with heat sink | |
KR970053677A (en) | Columnar package with heat sink | |
KR930014914A (en) | Semiconductor package | |
JPS6325958A (en) | Semiconductor device | |
KR960019679A (en) | Semiconductor device | |
KR970053758A (en) | Structure of Semiconductor Package | |
JPH0559851U (en) | IC sealing case | |
KR960002778A (en) | Die heat dissipation package | |
JPS62224049A (en) | Electronic device | |
KR970030701A (en) | Stacked Package with Heat Dissipation | |
KR970024058A (en) | Package sealed with a metal lid | |
KR970053748A (en) | Leadframe of Semiconductor Package | |
KR970030726A (en) | Ball Grid Array Package with Lead Frame | |
KR960019678A (en) | How to attach heat sink and lead frame of semiconductor package | |
JPH03104142A (en) | Resin sealed type semiconductor device | |
KR960005962A (en) | Heat Proof Heat Sink of Semiconductor Package | |
KR970024065A (en) | Semiconductor chip package in which semiconductor chips are fixed by tie bars | |
JPH0617244U (en) | Semiconductor device with resin-sealed heat sink | |
KR970024106A (en) | Upset Adjusted Lead Frame and Semiconductor Chip Packages Using the Same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |