KR960026695A - Lead frame transfer loader method of coating equipment for semiconductor packages - Google Patents

Lead frame transfer loader method of coating equipment for semiconductor packages Download PDF

Info

Publication number
KR960026695A
KR960026695A KR1019940036222A KR19940036222A KR960026695A KR 960026695 A KR960026695 A KR 960026695A KR 1019940036222 A KR1019940036222 A KR 1019940036222A KR 19940036222 A KR19940036222 A KR 19940036222A KR 960026695 A KR960026695 A KR 960026695A
Authority
KR
South Korea
Prior art keywords
lead frame
coating
guide rail
discharge
supply
Prior art date
Application number
KR1019940036222A
Other languages
Korean (ko)
Other versions
KR0167144B1 (en
Inventor
이규형
김명일
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940036222A priority Critical patent/KR0167144B1/en
Publication of KR960026695A publication Critical patent/KR960026695A/en
Application granted granted Critical
Publication of KR0167144B1 publication Critical patent/KR0167144B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 반도체 패키지용 와이어 본딩 코팅장치의 리드프레임 이송로더 방법에 관한 것으로서, 반도체 칩(C)이 다수개 탑재된 리드프레임 자재(LF)가 코팅시스템(1)의 인라인 매거진 홀더(2)에서 공급되어 이송로더(3)의 안내레일(4)로 유입되어 안내레일(4) 공급측에 구비된 자재공급인지센서(5)에 감지되면 공급측그립퍼(6)가 자재(LF)를 그립하여 안내레일(4)을 따라 코팅장치(3A)로 자재(LF)를 공급시키기 위한 자리공급단계(A)와; 서보모터 A(7)의 구동에 의해 회전하는 리드스크류 A(8)에 의하여 좌ㆍ우 이동되는 공급측 그립퍼(6)가 리드프레임 자재(LF)를 코팅장치(3A)로 이송시키기 위한 자재공급이송단계(B)와; 코팅장치(3A)로 이송되는 리드프레임 자재(LF)가 안내레일(4) 소정위치에 구비된 위치결정센서(9)의 감지에 따라 코팅되는 반도체 칩(C)에 코팅액 도포 포인트를 셋팅하는 코팅액 셋팅포인트단계(C´)와; 코팅액 도포가 완료된 리드프레임 자재(LF)를 배출측그립퍼(10)가 그립하여 서보모터 B(11)의 구동에 의해 회전하는 리드스크퓨 B(12)에 의하여 안내레일(4)의 배출측으로 리드프레임 자재(LF)를 이송시켜 안내레일(4)의 배출측에 구비된 자재배출감지센서(13)에 자재(LF)를 감지되어 있는 자재배출이송단계(D)와; 자재배출감지센서(13)에 감지된 자재(LF)를 백앤드 매거진 홀더(14)의 빈트레이를 배출시키도록 한 자재배출단계(E)와; 로 이루어진 코팅장치의 이송로더에 의해 리드프레임 자재를 안정적으로 공급이송이 가능하게 하고, 자재의 손상을 방지하며, 작업성을 향상시킬 수 있도록 한 것이다.The present invention relates to a lead frame transfer loader method of a wire bonding coating apparatus for a semiconductor package, wherein a lead frame material (LF) having a plurality of semiconductor chips (C) mounted thereon is provided in an inline magazine holder (2) of a coating system (1). When supplied and introduced into the guide rail 4 of the transfer loader 3 and detected by the material supply sensor 5 provided on the supply side of the guide rail 4, the supply side gripper 6 grips the material LF to guide the rail. A seat feeding step (A) for feeding the material (LF) to the coating apparatus 3A along (4); The supply-side gripper 6 which is moved left and right by the lead screw A 8 rotating by the drive of the servomotor A 7 transfers the material supply for transferring the lead frame material LF to the coating apparatus 3A. Step (B); The coating liquid for setting the coating liquid coating point on the semiconductor chip C coated with the lead frame material LF transferred to the coating apparatus 3A according to the detection of the positioning sensor 9 provided at the predetermined position of the guide rail 4. A setting point step C ′; The lead-side gripper 10 grips the lead frame material LF on which the coating liquid is applied and leads to the discharge side of the guide rail 4 by the lead screed B 12 that is rotated by the drive of the servomotor B 11. A material discharge transfer step (D) which transfers the frame material (LF) and detects the material (LF) in the material discharge detection sensor (13) provided on the discharge side of the guide rail (4); A material discharge step (E) for discharging the empty tray of the back end magazine holder 14 with the material LF detected by the material discharge detection sensor 13; By the transfer loader of the coating device made of a lead frame material can be stably supplied and transported, to prevent damage to the material, to improve the workability.

Description

반도체 패키지용 코팅장치의 리드프레임 이송로더방법Lead frame transfer loader method of coating equipment for semiconductor packages

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 코팅장치의 전체 구성 평면도.1 is a plan view of the overall configuration of the coating apparatus of the present invention.

Claims (3)

반도체 칩(C)이 다수개 탑재된 리드프레임 자재(LF)가 코팅시스템(1)의 인라인 매거진 홀더(2)에서 공급되어 이송로더(3)의 안내레일(4)로 유입되어 안내레일(4) 공급측에 구비된 자재공급인지센서(5)에 감지되면 공급측 그립퍼(6)가 자재(LF)를 그립하여 안내레일(4)을 따라 코팅장치(3A)로 자재(LF)를 공급시키기 위한 자재공급단계(A)와; 서보모터 A(7)의 구동에 의해 회전하는 리드스크류 A(8)에 의하여 좌ㆍ우 이동되는 공급측 그립퍼(6)가 리드프레임 자재(LF)를 코팅장치(3A)로 이동시키기 위한 자재공급이송단계(B)와; 코팅장치(3A)로 이송되는 리드프레임 자재(LF)가 안내레일(4) 소정위치에 구비된 위치결정센서(9)의 감지에 따라 코팅되는 반도체 칩(C)에 코팅액 도포 포인트를 셋팅하는 셋팅포인트단계(C´)와; 코팅액 도포가 완료된 리드프레임 자재(LF)를 배출측 그립퍼(10)가 그립하여 서보모터 B(11)의 구동에 의해 회전하는 리드스크류 B(12)에 의하여 안내레일(4)의 배출측으로 리드 프레임 자재(LF)를 이송시켜 안내레일(4)의 배출측에 구비된 자재배출감지센서(13)에 자재(LF)를 감지되어 있는 자재배출이송단계(D)와; 자재배출감지센서(13)에 감지된 자재(LF)를 백앤드 매거진 홀더(14)의 빈매거진을 배출시키도록 한 자재배출단계(E)와; 로 이루어진 코팅장치의 이송로더에 의해 코팅액이 도포되는 리드프레임 자재를 용이하게 이송시킬 수 있도록 한 것을 특징으로 하는 반도체 패키지용 코팅장치의 리드프레임 이송로더 방법.Lead frame material (LF) having a plurality of semiconductor chips (C) mounted thereon is supplied from the in-line magazine holder (2) of the coating system (1) and introduced into the guide rail (4) of the transfer loader (3). ) When the material supply sensor 5 provided on the supply side is detected, the supply side gripper 6 grips the material LF and supplies the material LF to the coating apparatus 3A along the guide rail 4. Supplying step (A); The supply-side gripper 6, which is moved left and right by the lead screw A 8, which is rotated by the drive of the servomotor A 7, moves the material supply for moving the lead frame material LF to the coating apparatus 3A. Step (B); A setting for setting the coating liquid coating point on the semiconductor chip C to which the lead frame material LF transferred to the coating apparatus 3A is coated according to the detection of the positioning sensor 9 provided at the predetermined position of the guide rail 4. Point stage C ′; The lead frame material LF, which has been coated with the coating liquid, is gripped by the discharge side gripper 10 and is driven to the discharge side of the guide rail 4 by the lead screw B 12 that is rotated by the drive of the servomotor B 11. A material discharge transfer step (D) which transfers the material LF and detects the material LF in the material discharge detection sensor 13 provided on the discharge side of the guide rail 4; A material discharge step (E) for discharging the empty magazine of the back end magazine holder 14 with the material LF detected by the material discharge detection sensor 13; Lead frame transfer loader method of the coating device for a semiconductor package, characterized in that to facilitate the transfer of the lead frame material to which the coating liquid is applied by a transfer loader of the coating device consisting of. 제1항에 있어서, 상기 코팅액 셋팅포인트(C´)에서의 위치결정센서(9)은 리드프레임 자재(LF)의 끝부분을 감지하여 자재(LF)의 길이에 관계없이 자재(LF)을 감지할 수 있도록 한 것을 특징으로 하는 반도체 패키지용 코팅장치의 리드프레임 이송로더 방법.The method of claim 1, wherein the positioning sensor (9) at the coating liquid setting point (C ') detects the end of the lead frame material (LF) to detect the material (LF) regardless of the length of the material (LF) Lead frame transfer loader method of the coating device for a semiconductor package, characterized in that it can be. 제1항에 있어서, 상기 지지배출 이송단계(D)에서는 과부하감지센서(20)에 의해 자재(LF)의 백앤드매거진에 입력시 발생하는 잼 및 부하압력을 감지할 수 있도록 한 것을 특징으로 하는 반도체 패키지용 코팅장치의리드프레임 이송로더 방법.The method of claim 1, wherein in the support discharge transfer step (D), the jam and load pressure generated when the input to the back-end magazine of the material (LF) by the overload detection sensor 20 can be detected. Lead frame transfer loader method of coating equipment for semiconductor packages. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940036222A 1994-12-23 1994-12-23 Lead frame transfer method of coating system KR0167144B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940036222A KR0167144B1 (en) 1994-12-23 1994-12-23 Lead frame transfer method of coating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940036222A KR0167144B1 (en) 1994-12-23 1994-12-23 Lead frame transfer method of coating system

Publications (2)

Publication Number Publication Date
KR960026695A true KR960026695A (en) 1996-07-22
KR0167144B1 KR0167144B1 (en) 1998-12-15

Family

ID=19403091

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940036222A KR0167144B1 (en) 1994-12-23 1994-12-23 Lead frame transfer method of coating system

Country Status (1)

Country Link
KR (1) KR0167144B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453690B1 (en) * 1997-12-30 2005-02-24 앰코 테크놀로지 코리아 주식회사 Material transfer gripper of loading apparatus for bga semiconductor package to smoothly transfer material and plan transfer precision

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100781155B1 (en) * 2002-01-24 2007-11-30 삼성테크윈 주식회사 Apparatus and method for punching lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453690B1 (en) * 1997-12-30 2005-02-24 앰코 테크놀로지 코리아 주식회사 Material transfer gripper of loading apparatus for bga semiconductor package to smoothly transfer material and plan transfer precision

Also Published As

Publication number Publication date
KR0167144B1 (en) 1998-12-15

Similar Documents

Publication Publication Date Title
JP2000040898A (en) Method for distributing chip with solder bump on front surface using tape for carrying chip
KR920015503A (en) Automatic Separator for Stacked Wafer and Separating Method
US20080006922A1 (en) Thermal release adhesive-backed carrier tapes
JP2598305B2 (en) Semiconductor wafer processing system
KR960026695A (en) Lead frame transfer loader method of coating equipment for semiconductor packages
KR20170116648A (en) A bundle packaging apparatus
JP2006069744A (en) Container handling line
KR0143020B1 (en) Transfer loader of coating apparatus for semiconductor package
JP2668735B2 (en) Transfer device
KR0167142B1 (en) Coating device of package coating system
JP2002167045A (en) Method and device for transferring adhesive material
KR100210160B1 (en) Station of wafer mounting system for semiconductor package
KR0139266B1 (en) Method of semiconductor package coating system
KR102019696B1 (en) A Separation Regulating Type of a Label Feeder
KR0138057B1 (en) Gripper apparatus of lead frame loader for semiconductor package
KR0129225Y1 (en) Pusher structure of lead frame loader having tension for semiconductor package
JPH10117092A (en) Parts-feeding device
KR0184714B1 (en) Coating system for manufacturing semiconductor package
KR100216836B1 (en) Leadframe transfer apparatus of marking equipment for semiconductor package fabrication
KR0138054B1 (en) Heat block of lead frame loader for semiconductor packaging
JP3798854B2 (en) In-line type processing apparatus and method for conveying object to be processed
KR101926091B1 (en) A Label Feeder Having an Improved Function of Separating a Label
KR100351174B1 (en) circuit tape magazine unit of TBGA semiconductor manufacture system
KR100199826B1 (en) Roller apparatus of wafer mounting system for semiconductor package
KR100199827B1 (en) Tape transfer apparatus of wafer mounting system for semiconductor package

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee