KR960026532A - Transfer loader of coating equipment for semiconductor package - Google Patents

Transfer loader of coating equipment for semiconductor package Download PDF

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Publication number
KR960026532A
KR960026532A KR1019940036221A KR19940036221A KR960026532A KR 960026532 A KR960026532 A KR 960026532A KR 1019940036221 A KR1019940036221 A KR 1019940036221A KR 19940036221 A KR19940036221 A KR 19940036221A KR 960026532 A KR960026532 A KR 960026532A
Authority
KR
South Korea
Prior art keywords
transfer loader
lead frame
frame material
coating
sensor
Prior art date
Application number
KR1019940036221A
Other languages
Korean (ko)
Other versions
KR0143020B1 (en
Inventor
이규형
김명일
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940036221A priority Critical patent/KR0143020B1/en
Publication of KR960026532A publication Critical patent/KR960026532A/en
Application granted granted Critical
Publication of KR0143020B1 publication Critical patent/KR0143020B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 반도체 패키지용 코팅장치의 이송로더에 관한 것으로서, 리드프레임자재(LF)에 탑재된 반도체칩(C) 표면을 와이어본딩상을 좋게 하기 위하여 코팅용액을 도포할 수 있도록 한 코팅장치(1)에서 리드프레임자재(LF)를 이송시킬 수 있는 이송로더(4)를 인라인 매거진홀더(2)와 백앤드 매거진홀더(19)사이에 구비하고, 상기 이송로더(4) 상부에는 좌,우 길이방향으로 안내레일(5)을 구비하며, 안내레일(5)의 일측에는 자재공급 감지센서(6)를 구비하고, 타측의 소정위치에는 위치결정센서(7)를 구비하며, 위치결정센서(7)의 타측에는 자재배출 감지센서(8)와 과부하 방지센서(9)를 구비하고, 이송로더(4)의 전면에는 리드프레임자재(LF)를 공급 및 배출시키는 공급측 그립퍼(12)와 공압실린더(14)를 구동수단에 의해 작동하도록 함에 따라 크기 및 규격에 따라 달리하는 반도체 패키지의 리드프레임 자재의 탑재판에 탑재된 반도체칩의 표면에 코팅용액을 고르게 도포할 수 있도록 코팅장치를 제공하고, 상기 코팅장치중 반도체칩이 탑재된 리드프레임 자재를 안정적으로 이송시킬 수 있도록 한 이송로더를 구비하여 각 제품종류에 따라 코팅액의 도포를 원활히 할 수 있도록 한 효과가 있는 것이다.The present invention relates to a transfer loader of a coating apparatus for a semiconductor package, wherein the coating apparatus for applying a coating solution to improve the wire bonding on the surface of the semiconductor chip (C) mounted on the lead frame material (LF) (1 ) Is provided between the in-line magazine holder (2) and the back and back magazine holder (19), which can transfer the lead frame material (LF) in the upper, left, right length on the transfer loader (4) A guide rail 5 in a direction, and a material supply sensor 6 on one side of the guide rail 5, a positioning sensor 7 on a predetermined position on the other side, and a positioning sensor 7. The other side is provided with a material discharge detection sensor (8) and the overload protection sensor (9), the front side of the transfer loader 4, the supply side gripper 12 and the pneumatic cylinder (12) for supplying and discharging the lead frame material (LF) 14) by the drive means, according to the size and specification Liha provides a coating device to evenly apply the coating solution to the surface of the semiconductor chip mounted on the mounting plate of the lead frame material of the semiconductor package, and stably transports the lead frame material on which the semiconductor chip is mounted among the coating devices The transfer loader is provided so that the coating liquid can be smoothly applied according to each product type.

Description

반도체 패키지용 코팅장치의 이송로더Transfer loader of coating equipment for semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 코팅장치의 전체 구성평면도, 제2도는 본 발명의 이송로더의 평면도, 제3도는 본 발명의 이송로더의 정면도, 제4도는 본 발명의 이송로더의 우측면도.1 is a plan view of the overall configuration of the coating apparatus of the present invention, Figure 2 is a plan view of the transfer loader of the present invention, Figure 3 is a front view of the transfer loader of the present invention, Figure 4 is a right side view of the transfer loader of the present invention.

Claims (3)

리드프레임자재(LF)에 탑재된 반도체칩(C) 표면을 와이어본딩후 다이 및 와이어를 보호하기 위하여 코팅용액을 도포할 수 있도록 한 코팅장치(1)에서 리드프레임자재(LF)를 이송시킬 수 있는 이송로더(4)를 인라인 매거진홀더(2)와 백앤드 매거진홀더(19)사이에 구비하고, 상기 이송로더(4) 상부에는 좌, 우 길이방향으로 안내레일(5)을 구비하며, 안내레일(5)의 일측에는 자재공급 감지센서(6)를 구비하며, 타측의 소정위치에는 위치결정센서(7)를 구비하고, 위치결정센서(7)의 타측에는 자재배출 감지센서(8)와 과부하 방지센서(9)를 구비하며, 이송로더(4)의 전면에는 리드프레임자재(LF)를 공급 및 배출시키는 공급측 그립퍼(12)와 배출측 그립퍼(13)를 구동수단에 의해 작동하도록 설치된 것을 특징으로 하는 반도체 패키지의 코팅장치의 이송로더.After wire-bonding the surface of the semiconductor chip C mounted on the lead frame material LF, the lead frame material LF can be transferred from the coating apparatus 1 to apply a coating solution to protect the die and the wire. A transfer loader (4) between the in-line magazine holder (2) and the back and magazine holder (19), the transfer loader (4) is provided with a guide rail (5) in the left and right longitudinal direction, the guide One side of the rail (5) is provided with a material supply sensor (6), the other side is provided with a positioning sensor (7), the other side of the positioning sensor (7) and the material discharge detection sensor (8) and It is provided with an overload prevention sensor (9), and the front side of the transfer loader (4) is installed to operate the supply side gripper 12 and the discharge side gripper 13 for supplying and discharging the lead frame material (LF) by the drive means A transfer loader for coating apparatus for semiconductor packages. 제1항에 있어서, 상기 이송로더(1)의 전방에 구비된 공급측 그립퍼(12)와 배출측 그립퍼(13)는 좌,우 길이방향으로 상,하에 복수개 병설구비된 리드스크류A,B(10)(11)에 각각 설치된 것을 특징으로 하는 반도체 패키지의 코팅장치의 이송로더.According to claim 1, wherein the feed side gripper 12 and the discharge side gripper (13) provided in front of the transfer loader (1) is provided with a plurality of lead screws A, B (10) arranged in parallel in the left and right longitudinal direction (10) Transfer loader of the coating apparatus of the semiconductor package, characterized in that each installed in the (11). 제1항에 있어서, 상기 이송로더(4)에는 조정구(4)를 구비하여 리드프레임자재(LF)의 폭에 따라 안내레일(5)의 목(W)을 조정할 수 있도록 한 것을 특징으로 하는 반도체 패키지의 코팅장치의 이송로더.The semiconductor according to claim 1, wherein the transfer loader (4) is provided with an adjusting tool (4) to adjust the neck (W) of the guide rail (5) according to the width of the lead frame material (LF). Transfer loader of the coating unit of the package. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940036221A 1994-12-23 1994-12-23 Transfer loader of coating apparatus for semiconductor package KR0143020B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940036221A KR0143020B1 (en) 1994-12-23 1994-12-23 Transfer loader of coating apparatus for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940036221A KR0143020B1 (en) 1994-12-23 1994-12-23 Transfer loader of coating apparatus for semiconductor package

Publications (2)

Publication Number Publication Date
KR960026532A true KR960026532A (en) 1996-07-22
KR0143020B1 KR0143020B1 (en) 1998-08-17

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ID=19403089

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940036221A KR0143020B1 (en) 1994-12-23 1994-12-23 Transfer loader of coating apparatus for semiconductor package

Country Status (1)

Country Link
KR (1) KR0143020B1 (en)

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Publication number Publication date
KR0143020B1 (en) 1998-08-17

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