KR960025501U - 반도체 리드프레임의 패드구조 - Google Patents

반도체 리드프레임의 패드구조

Info

Publication number
KR960025501U
KR960025501U KR2019940033994U KR19940033994U KR960025501U KR 960025501 U KR960025501 U KR 960025501U KR 2019940033994 U KR2019940033994 U KR 2019940033994U KR 19940033994 U KR19940033994 U KR 19940033994U KR 960025501 U KR960025501 U KR 960025501U
Authority
KR
South Korea
Prior art keywords
lead frame
pad structure
semiconductor lead
semiconductor
pad
Prior art date
Application number
KR2019940033994U
Other languages
English (en)
Other versions
KR200143924Y1 (ko
Inventor
이정
유희열
박병희
Original Assignee
아남반도체주식회사
암코 일렉트로닉스 아이엔시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남반도체주식회사, 암코 일렉트로닉스 아이엔시 filed Critical 아남반도체주식회사
Priority to KR2019940033994U priority Critical patent/KR200143924Y1/ko
Priority to JP7345711A priority patent/JP2767404B2/ja
Priority to US08/571,316 priority patent/US5661338A/en
Publication of KR960025501U publication Critical patent/KR960025501U/ko
Application granted granted Critical
Publication of KR200143924Y1 publication Critical patent/KR200143924Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019940033994U 1994-12-14 1994-12-14 반도체 리드프레임의 패드구조 KR200143924Y1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR2019940033994U KR200143924Y1 (ko) 1994-12-14 1994-12-14 반도체 리드프레임의 패드구조
JP7345711A JP2767404B2 (ja) 1994-12-14 1995-12-08 半導体パッケージのリードフレーム構造
US08/571,316 US5661338A (en) 1994-12-14 1995-12-12 Chip mounting plate construction of lead frame for semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940033994U KR200143924Y1 (ko) 1994-12-14 1994-12-14 반도체 리드프레임의 패드구조

Publications (2)

Publication Number Publication Date
KR960025501U true KR960025501U (ko) 1996-07-22
KR200143924Y1 KR200143924Y1 (ko) 1999-06-15

Family

ID=19401308

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940033994U KR200143924Y1 (ko) 1994-12-14 1994-12-14 반도체 리드프레임의 패드구조

Country Status (1)

Country Link
KR (1) KR200143924Y1 (ko)

Also Published As

Publication number Publication date
KR200143924Y1 (ko) 1999-06-15

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