KR950023962U - 반도체장치의 리드 프레임 - Google Patents
반도체장치의 리드 프레임Info
- Publication number
- KR950023962U KR950023962U KR2019940000119U KR19940000119U KR950023962U KR 950023962 U KR950023962 U KR 950023962U KR 2019940000119 U KR2019940000119 U KR 2019940000119U KR 19940000119 U KR19940000119 U KR 19940000119U KR 950023962 U KR950023962 U KR 950023962U
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- lead frame
- lead
- frame
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940000119U KR200157362Y1 (ko) | 1994-01-06 | 1994-01-06 | 반도체장치의 리드 프레임 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940000119U KR200157362Y1 (ko) | 1994-01-06 | 1994-01-06 | 반도체장치의 리드 프레임 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950023962U true KR950023962U (ko) | 1995-08-23 |
KR200157362Y1 KR200157362Y1 (ko) | 1999-09-15 |
Family
ID=19375302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940000119U KR200157362Y1 (ko) | 1994-01-06 | 1994-01-06 | 반도체장치의 리드 프레임 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200157362Y1 (ko) |
-
1994
- 1994-01-06 KR KR2019940000119U patent/KR200157362Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200157362Y1 (ko) | 1999-09-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20050523 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |