KR950021489U - 리드프레임의 패드구조 - Google Patents
리드프레임의 패드구조Info
- Publication number
- KR950021489U KR950021489U KR2019930030799U KR930030799U KR950021489U KR 950021489 U KR950021489 U KR 950021489U KR 2019930030799 U KR2019930030799 U KR 2019930030799U KR 930030799 U KR930030799 U KR 930030799U KR 950021489 U KR950021489 U KR 950021489U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- pad structure
- pad
- lead
- frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930030799U KR970001140Y1 (ko) | 1993-12-30 | 1993-12-30 | 리드프레임의 패드구조 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930030799U KR970001140Y1 (ko) | 1993-12-30 | 1993-12-30 | 리드프레임의 패드구조 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950021489U true KR950021489U (ko) | 1995-07-28 |
| KR970001140Y1 KR970001140Y1 (ko) | 1997-02-18 |
Family
ID=19373780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019930030799U KR970001140Y1 (ko) | 1993-12-30 | 1993-12-30 | 리드프레임의 패드구조 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970001140Y1 (ko) |
-
1993
- 1993-12-30 KR KR2019930030799U patent/KR970001140Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970001140Y1 (ko) | 1997-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20080214 Year of fee payment: 12 |
|
| EXPY | Expiration of term |