KR960024670A - Photosensitive Resin Composition - Google Patents

Photosensitive Resin Composition Download PDF

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Publication number
KR960024670A
KR960024670A KR1019940036798A KR19940036798A KR960024670A KR 960024670 A KR960024670 A KR 960024670A KR 1019940036798 A KR1019940036798 A KR 1019940036798A KR 19940036798 A KR19940036798 A KR 19940036798A KR 960024670 A KR960024670 A KR 960024670A
Authority
KR
South Korea
Prior art keywords
resin composition
photosensitive resin
photopolymerizable monomer
parts
photopolymerizable
Prior art date
Application number
KR1019940036798A
Other languages
Korean (ko)
Other versions
KR0140055B1 (en
Inventor
지승룡
황재영
이병일
Original Assignee
이웅열
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이웅열, 주식회사 코오롱 filed Critical 이웅열
Priority to KR1019940036798A priority Critical patent/KR0140055B1/en
Publication of KR960024670A publication Critical patent/KR960024670A/en
Application granted granted Critical
Publication of KR0140055B1 publication Critical patent/KR0140055B1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

본 발명은 빠른 현상성과 강화된 텐팅성을 동시에 만족할 수 있는 알카리 현상성 드라이 필름 레지스트의 제작에 이용할 수 있는 감광성 수지조성물에 관한 것이다.The present invention relates to a photosensitive resin composition that can be used for the production of an alkaline developable dry film resist capable of satisfying both rapid developability and enhanced tentability.

Description

감광성 수지조성물Photosensitive Resin Composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

고분자 결합제, 광중합 개시제, 말단 에틸렌성 불포화기를 적어도 1개 이상 포함하는 광중합성 단량체로 이루어진 감광성 주지조성물에 있어서, 상기 광중합성 단량체가 다음 구조식(I) 및 (II)로 나타내어지는 광중합성 단량체들을 동시에 포함함을 특징으로 하는 감광성 수지조성물.In the photosensitive main composition consisting of a polymer binder, a photopolymerization initiator, and a photopolymerizable monomer containing at least one terminal ethylenically unsaturated group, the photopolymerizable monomer may be a photopolymerizable monomer represented by the following structural formulas (I) and (II) simultaneously: Photosensitive resin composition comprising a. (I) (I) (R1,R2,R3,R4,R5는 각각 H 또는 CH3x+y는 20~40)(R 1 , R 2 , R 3 , R 4 , R 5 are each H or CH 3 x + y is 20-40) (II) (II) (R6: CH2CH(CH3)O, ℓ+m+n은 3~9, R7: H 또는 CH3)(R 6 : CH 2 CH (CH 3 ) O, l + m + n is 3-9, R 7 : H or CH 3 ) 제1항에 있어서, 조합된 광중합성 단량체들의 함량이 감광성 수지조성물 전체량에 대하여 9 내지 33중량부임을 특징으로 하는 감광성 수지조성물.The photosensitive resin composition according to claim 1, wherein the content of the combined photopolymerizable monomers is 9 to 33 parts by weight based on the total amount of the photosensitive resin composition. 제1항 또는 제2항에 있어서, 감광성 수지조성물의 전체량에 대하여 상기 구조식(I)의 광중합성 단량체는 7 내지 20중량부, 상기 구조식(II)의 광중합성 단량체는 2 내지 13중량부임을 특징으로 하는 감광성 수지조성물.The photopolymerizable monomer of the formula (I) is 7 to 20 parts by weight, and the photopolymerizable monomer of the formula (II) is 2 to 13 parts by weight based on the total amount of the photosensitive resin composition. Photosensitive resin composition characterized by the above-mentioned. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940036798A 1994-12-26 1994-12-26 Photosensitive resin composition KR0140055B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940036798A KR0140055B1 (en) 1994-12-26 1994-12-26 Photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940036798A KR0140055B1 (en) 1994-12-26 1994-12-26 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
KR960024670A true KR960024670A (en) 1996-07-20
KR0140055B1 KR0140055B1 (en) 1998-06-15

Family

ID=19403516

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940036798A KR0140055B1 (en) 1994-12-26 1994-12-26 Photosensitive resin composition

Country Status (1)

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KR (1) KR0140055B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980049928A (en) * 1996-12-20 1998-09-15 구광시 Photocurable Resin Composition

Also Published As

Publication number Publication date
KR0140055B1 (en) 1998-06-15

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