KR970028792A - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

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Publication number
KR970028792A
KR970028792A KR1019950044233A KR19950044233A KR970028792A KR 970028792 A KR970028792 A KR 970028792A KR 1019950044233 A KR1019950044233 A KR 1019950044233A KR 19950044233 A KR19950044233 A KR 19950044233A KR 970028792 A KR970028792 A KR 970028792A
Authority
KR
South Korea
Prior art keywords
formula
resin composition
photosensitive resin
iii
photopolymerizable monomer
Prior art date
Application number
KR1019950044233A
Other languages
Korean (ko)
Other versions
KR100238332B1 (en
Inventor
황재영
이병일
Original Assignee
이웅열
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이웅열, 주식회사 코오롱 filed Critical 이웅열
Priority to KR1019950044233A priority Critical patent/KR100238332B1/en
Publication of KR970028792A publication Critical patent/KR970028792A/en
Application granted granted Critical
Publication of KR100238332B1 publication Critical patent/KR100238332B1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

본 발명은 인쇄회로기판의 제작에 사용되는 감광성 수지 조성물에 관한 것으로서, 하기 일반식(I), (II) 및 (III)으로 나타내어지는 광중합성 단량체를 동시에 함유함을 특징으로 하며,The present invention relates to a photosensitive resin composition used in the manufacture of a printed circuit board, characterized in that it simultaneously contains a photopolymerizable monomer represented by the following general formula (I), (II) and (III),

위 식(I)에서 R1은 H 또는 CH3 In formula (I), R 1 is H or CH 3

위 식(II)에서 R2는 H 또는 CH3이며, j+k는 20~40의 자연수.In formula (II), R 2 is H or CH 3 , j + k is a natural number of 20-40.

위 식(III)에서 R3는 H 또는 CH3이며, m+n+l은 3~9의 자연수.In Formula (III), R 3 is H or CH 3 , and m + n + l is a natural number of 3-9.

이러한 특징을 갖는 본 발명의 감광성 수지 조성물을 이용하면 내약품성을 지니면서 빠른 현상성과 고해상성 및 강화성 텐팅성을 동시에 만족할 수 있는 알카리 현상성 드라이 필름 레지스트를 제작할 수 있게 된다.By using the photosensitive resin composition of the present invention having such characteristics, it is possible to produce an alkali developable dry film resist having chemical resistance and satisfying both rapid developability and high resolution and reinforcing tentability.

Description

감광성 수지 조성물Photosensitive resin composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (3)

고분자 결합체, 광중합 개시제, 말단 에틸렌성 불포화기를 적어도 1개 이상 포함하는 광중합성 단량체로 이루어진 감광성 수지 조성물에 있어서, 하기 일반식(I), (II) 및 (III)으로 나타내어지는 광중합성 단량체를 동시에 함유함을 특징으로 하는 감광성 수지 조성물:In the photosensitive resin composition which consists of a polymeric binder, a photoinitiator, and the photopolymerizable monomer containing at least 1 terminal ethylenically unsaturated group, the photopolymerizable monomer represented by following General formula (I), (II), and (III) is simultaneously A photosensitive resin composition comprising: 위 식(I)에서 R1은 H 또는 CH3 In formula (I), R 1 is H or CH 3 위 식(II)에서 R2는 H 또는 CH3이며, j+k는 20~40의 자연수In formula (II), R 2 is H or CH 3 , j + k is a natural number of 20-40 위 식(III)에서 R3는 H 또는 CH3이며, m+n+l은 3~9의 자연수.In Formula (III), R 3 is H or CH 3 , and m + n + l is a natural number of 3-9. 제1항에 있어서, 광중합성 단량체(I), (II) 및 (III)의 함량이 감광성 수지 조성물의 전체량에 대하여 13~40중량부인 것을 특징으로 하는 감광성 수지 조성물.The photosensitive resin composition of Claim 1 whose content of photopolymerizable monomer (I), (II), and (III) is 13-40 weight part with respect to the total amount of the photosensitive resin composition. 제1항 또는 제2항에 있어서, 감광성 수지 조성물의 전체량에 대하여 상기 식(I)의 광중합성 단량체는 6~18중량부, 상기 식 (II)의 광중합성 단량체는 6~15중량부, 상기 식 (Ⅲ)의 광중합성 단량체는 1.5~9중량부의 양으로 함유함을 특징으로 하는 감광성 수지 조성물.The photopolymerizable monomer of the formula (I) is 6-18 parts by weight, the photopolymerizable monomer of the formula (II) is 6-15 parts by weight, based on the total amount of the photosensitive resin composition. The photopolymerizable monomer of Formula (III) is contained in an amount of 1.5 to 9 parts by weight, the photosensitive resin composition. ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950044233A 1995-11-28 1995-11-28 Photosensitive resin composite KR100238332B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950044233A KR100238332B1 (en) 1995-11-28 1995-11-28 Photosensitive resin composite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950044233A KR100238332B1 (en) 1995-11-28 1995-11-28 Photosensitive resin composite

Publications (2)

Publication Number Publication Date
KR970028792A true KR970028792A (en) 1997-06-24
KR100238332B1 KR100238332B1 (en) 2000-07-01

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ID=19436039

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950044233A KR100238332B1 (en) 1995-11-28 1995-11-28 Photosensitive resin composite

Country Status (1)

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KR (1) KR100238332B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100591065B1 (en) * 1999-08-23 2006-06-19 주식회사 코오롱 A composition of photo-cure
KR20180092381A (en) 2017-02-09 2018-08-20 동우 화인켐 주식회사 Adhesive composition and adhesive pattern formed therfrom

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101369268B1 (en) 2006-04-24 2014-03-04 코오롱인더스트리 주식회사 Photosensitive resist composition with high Chemical resistance

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100591065B1 (en) * 1999-08-23 2006-06-19 주식회사 코오롱 A composition of photo-cure
KR20180092381A (en) 2017-02-09 2018-08-20 동우 화인켐 주식회사 Adhesive composition and adhesive pattern formed therfrom
US10336924B2 (en) 2017-02-09 2019-07-02 Dongwoo Fine-Chem Co., Ltd. Pressure sensitive adhesive composition and pressure sensitive adhesive pattern formed therfrom

Also Published As

Publication number Publication date
KR100238332B1 (en) 2000-07-01

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