KR960019424A - Radiation Cooling Apparatus and Method of Field Emission Device Assembly - Google Patents

Radiation Cooling Apparatus and Method of Field Emission Device Assembly Download PDF

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Publication number
KR960019424A
KR960019424A KR1019950043861A KR19950043861A KR960019424A KR 960019424 A KR960019424 A KR 960019424A KR 1019950043861 A KR1019950043861 A KR 1019950043861A KR 19950043861 A KR19950043861 A KR 19950043861A KR 960019424 A KR960019424 A KR 960019424A
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KR
South Korea
Prior art keywords
cooling
workpiece
providing
surface adjacent
conduction
Prior art date
Application number
KR1019950043861A
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Korean (ko)
Inventor
더블류. 스코갠 존
이. 네이드 브루스
Original Assignee
윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
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Publication date
Application filed by 윌리엄 이. 힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이. 힐러
Publication of KR960019424A publication Critical patent/KR960019424A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D13/00—Stationary devices, e.g. cold-rooms
    • F25D13/06—Stationary devices, e.g. cold-rooms with conveyors carrying articles to be cooled through the cooling space
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
    • F27D15/02—Cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D31/00—Other cooling or freezing apparatus

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Abstract

워크피스(50)의 복사 냉각을 제공하기 위한 장치(10)는 워크피스(50)를 둘러싸는 진공실(100)을 갖고, 복사에 의해 워크피스(50)를 냉각시키기 위한 냉각 부재를 갖는다. 열 에너지 전달 부재(150)는 전도에 의해 냉각 부재(140)를 냉각시킨다. 워크피스(50)를 복사 냉각시키기 위한 방법에 또한 기술되어 있다.The apparatus 10 for providing radiative cooling of the workpiece 50 has a vacuum chamber 100 surrounding the workpiece 50 and a cooling member for cooling the workpiece 50 by radiation. The thermal energy transfer member 150 cools the cooling member 140 by conduction. Also described is a method for radiatively cooling the workpiece 50.

Description

전계 방출 디바이스 어셈블리의 복사 냉각 장치 및 방법Radiation Cooling Apparatus and Method of Field Emission Device Assembly

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 복사 냉각 장치의 제1실시예를 도시한 개략도,1 is a schematic view showing a first embodiment of the radiation cooling apparatus of the present invention;

제2도는 본 발명의 복사 냉각 장치의 제2실시예의 단면도를 도시한 개략도.2 is a schematic view showing a sectional view of a second embodiment of the radiation cooling apparatus of the present invention.

Claims (19)

워크피스(workpiece)를 복사 냉각(radiation cooling)하는 장치에 있어서, 상기 워크피스를 둘러싸는 진공실(evacuated chamber); 및 복사 냉각함으로써 상기 워크피스를 냉각시키기 위해 상기 워크피스에 인접한 표면을 갖는 수단을 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.An apparatus for radiating cooling a workpiece, the apparatus comprising: an evacuated chamber surrounding the workpiece; And means having a surface adjacent to the workpiece for cooling the workpiece by radiative cooling. 제1항에 있어서, 상기 냉각 수단의 전도 냉각(conduction cooling)을 제공하기 위한 수단을 더 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.The apparatus of claim 1, further comprising means for providing conduction cooling of said cooling means. 제1항에 있어서, 상기 표면이 상기 워크피스를 둘러싸는 것을 특징으로 하는 워크피스 복사 냉각 장치.The apparatus of claim 1, wherein said surface surrounds said workpiece. 제1항에 있어서, 상기 냉각 수단은 복사에 의해 상기 워크피스를 냉각시키기 위한 상기 워크피스에 인접한 제2표면을 더 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.The apparatus of claim 1, wherein said cooling means further comprises a second surface adjacent said workpiece for cooling said workpiece by radiation. 제1항에 있어서, 상기 냉각 수단은 조정 가능한 것을 특징으로 하는 워크피스 복사 냉각 장치.The apparatus of claim 1, wherein said cooling means is adjustable. 제4항에 있어서, 상기 제2표면은 조정 가능한 것을 특징으로 하는 워크피스 복사 냉각 장치.5. The apparatus of claim 4, wherein said second surface is adjustable. 워크피스를 복사 냉각하는 장치에 있어서, 상기 워크피스를 둘러싸는 챔버(chamber); 상기 방에 결합된 진공 펌프; 및 복사에 의해 상기 워크피스를 냉각시키기 위해 상기 워크피스에 인접한 냉각 표면을 갖는 냉각 부재(cooling member)를 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.An apparatus for radiating cooling a workpiece, the apparatus comprising: a chamber surrounding the workpiece; A vacuum pump coupled to the room; And a cooling member having a cooling surface adjacent to the workpiece for cooling the workpiece by radiation. 제7항에 있어서, 전도에 의해 상기 냉각 부재를 냉각시키기 위한 열 에너지 전달 부재를 더 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.8. The apparatus of claim 7, further comprising a thermal energy transfer member for cooling said cooling member by conduction. 제7항에 있어서, 대류(convection)에 의해 상기 냉각 부재를 냉각시키기 위한 열 에너지 전달 부재를 더 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.8. The apparatus of claim 7, further comprising a heat energy transfer member for cooling said cooling member by convection. 제7항에 있어서, 상기 냉각 부재는 조정 가능한 것을 특징으로 하는 워크피스 복사 냉각 장치.8. A workpiece radiant cooling apparatus according to claim 7, wherein the cooling member is adjustable. 워크피스를 복사 냉각하기 위한 방법에 있어서, 진공실에서 상기 워크피스를 둘러싸는 단계; 상기 워크피스에 인접한 표면을 갖는 냉각 부재를 제공하는 단계; 및 상기 냉각 부재를 냉각시킴으로써 상기 워크피스에 복사 냉각을 제공하는 단계를 포함하는 것을 특징으로 하는 워크피스의 복사 냉각 방법.A method for radiatively cooling a workpiece, comprising: surrounding the workpiece in a vacuum chamber; Providing a cooling member having a surface adjacent the workpiece; And providing radiative cooling to the workpiece by cooling the cooling member. 제11항에 있어서, 상기 냉각 단계는 상기 냉각 부재의 전도 냉각을 포함하는 것을 특징으로 하는 워크피스의 복사 냉각 방법.12. The method of claim 11, wherein said cooling step comprises conduction cooling of said cooling member. 워크피스를 냉각하기 위한 방법에 있어서, 표면을 갖는 냉각 부재를 구비한 챔버를 제공하는 단계; 상기 챔버를 진공 상태가 되게 하는 단계; 상기 표면에 인접하게 상기 워크피스를 배치하는 단계; 상기 냉각 부재를 냉각시킴으로써 상기 워크피스에 복사 냉각을 제공하는 단계를 포함하는 것을 특징으로 하는 워크피스의 복사 냉각 방법.CLAIMS 1. A method for cooling a workpiece, comprising: providing a chamber having a cooling member having a surface; Bringing the chamber into a vacuum state; Placing the workpiece adjacent the surface; Providing radiative cooling to the workpiece by cooling the cooling member. 제13항에 있어서, 상기 냉각 단계는 상기 냉각 부재의 대류 냉각을 포함하는 것을 특징으로 하는 워크피스의 복사 냉각 방법.14. The method of claim 13, wherein said cooling step comprises convective cooling of said cooling member. 제13항에 있어서, 상기 냉각 단계는 상기 냉각 부재의 전도 냉각을 포함하는 것을 특징으로 하는 워크피스의 복사 냉각 방법.14. The method of claim 13, wherein said cooling step comprises conducting cooling of said cooling member. 워크피스를 복사 냉각하는 장치에 있어서, 상기 워크피스를 둘러싸는 진공실; 및 상기 워크피스로부터의 열 복사를 집열시키기 위해 상기 워크피스에 인접한 표면을 갖는 수단을 포함하는 것을 특징으로 하는 워크피스의 복사 냉각 장치.An apparatus for radiatively cooling a workpiece, comprising: a vacuum chamber surrounding the workpiece; And means having a surface adjacent to the workpiece for collecting heat radiation from the workpiece. 제16항에 있어서, 상기 집열 수단의 전도 냉각을 제공하기 위한 수단을 더 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.17. The apparatus of claim 16, further comprising means for providing conduction cooling of said heat collecting means. 제16항에 있어서, 상기 표면은 상기 워크피스를 둘러싸는 것을 특징으로 하는 워크피스 복사 냉각 장치.17. The apparatus of claim 16 wherein said surface surrounds said workpiece. 제16항에 있어서, 상기 집열 수단은 상기 워크피스로부터의 열 복사를 집열시키기 위해 상기 워크피스에 인접한 제2표면을 더 포함하는 것을 특징으로 하는 워크피스 복사 냉각 장치.17. The apparatus of claim 16, wherein said collecting means further comprises a second surface adjacent said workpiece for collecting heat radiation from said workpiece. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950043861A 1994-11-28 1995-11-27 Radiation Cooling Apparatus and Method of Field Emission Device Assembly KR960019424A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34518494A 1994-11-28 1994-11-28
US08/345,184 1994-11-28

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KR960019424A true KR960019424A (en) 1996-06-17

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EP (1) EP0715330A1 (en)
JP (1) JPH08222130A (en)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442214B1 (en) * 2000-02-16 2004-07-30 캐논 가부시끼가이샤 Method and apparatus for manufacturing image displaying apparatus
KR100434524B1 (en) * 1997-11-28 2004-09-07 삼성에스디아이 주식회사 Method for manufacturing field emission device, including step of circulating water coolant along water channel formed by water channel forming guide

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KR100370415B1 (en) * 1996-09-24 2003-03-15 삼성에스디아이 주식회사 Apparatus and method for sealing substrates of field emission display device
KR102248471B1 (en) * 2019-07-29 2021-05-06 고려대학교 산학협력단 Radiation cooling performance measuring apparatus
CN114885450B (en) * 2022-07-11 2022-09-20 中国飞机强度研究所 Extremely high temperature extremely low warm heat intensity cycle test system that aerospace plane test was used

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100434524B1 (en) * 1997-11-28 2004-09-07 삼성에스디아이 주식회사 Method for manufacturing field emission device, including step of circulating water coolant along water channel formed by water channel forming guide
KR100442214B1 (en) * 2000-02-16 2004-07-30 캐논 가부시끼가이샤 Method and apparatus for manufacturing image displaying apparatus

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Publication number Publication date
JPH08222130A (en) 1996-08-30
EP0715330A1 (en) 1996-06-05

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