KR960013141A - Lead free coating method - Google Patents

Lead free coating method Download PDF

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Publication number
KR960013141A
KR960013141A KR1019940023383A KR19940023383A KR960013141A KR 960013141 A KR960013141 A KR 960013141A KR 1019940023383 A KR1019940023383 A KR 1019940023383A KR 19940023383 A KR19940023383 A KR 19940023383A KR 960013141 A KR960013141 A KR 960013141A
Authority
KR
South Korea
Prior art keywords
lead
film
circuit board
copper foil
coating method
Prior art date
Application number
KR1019940023383A
Other languages
Korean (ko)
Other versions
KR0125133B1 (en
Inventor
조일제
Original Assignee
이헌조
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이헌조, 엘지전자 주식회사 filed Critical 이헌조
Priority to KR94023383A priority Critical patent/KR0125133B1/en
Publication of KR960013141A publication Critical patent/KR960013141A/en
Application granted granted Critical
Publication of KR0125133B1 publication Critical patent/KR0125133B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 전사 열압착방법으로 인쇄회로기판 위에 적정량의 납을 프리 코팅하는 납의 프리 코팅방법에 관한 것으로서, 필름 위의 원하는 부분에 납을 접착시키는 제1과정과, 상기 필름에 접착된 납을 인쇄회로기판의 동박에 접착시키는 제2과정과, 필름을 박리시키는 제3과정으로 이루어진 것을 특징으로 한다.The present invention relates to a lead pre-coating method for pre-coating an appropriate amount of lead on a printed circuit board by a transfer thermocompression method, the first process of adhering lead to a desired portion on the film, and printing the lead bonded to the film And a second process of adhering to the copper foil of the circuit board and a third process of peeling off the film.

본 발명의 납의 프리 코팅방법은 집적회로 및 일반 전자부품이 실장될 동박 위에 납이 동시에 프리 코팅되어 솔더 페이스트 인쇄공정이 삭제되고, 납량이 일정하게 제어되어 제품의 불량률이 현저하게 낮아진다는효과가 있다.The lead pre-coating method of the present invention has the effect that lead is simultaneously pre-coated on the copper foil on which the integrated circuit and the general electronic component are to be mounted, so that the solder paste printing process is eliminated, and the amount of lead is constantly controlled so that the defective rate of the product is significantly lowered. .

Description

납의 프리 코팅방법Lead free coating method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 납의 프리 코팅공정을 도시한 흐름도.2 is a flow chart showing a pre-coating process of lead according to the present invention.

제3도는 본 발명에 의한 부품의 실장공정을 도시한 흐름도이다.3 is a flowchart illustrating a mounting process of parts according to the present invention.

Claims (3)

필름 위의 원하는 부분에 납을 접착시기는 제1과정과, 상기 필름에 접착된 납을 인쇄회로기판의 동박에 접착시키는 제2과정과, 필름을 박리시키는 제3과정으로 이루어진 것을 특징으로 하는 납의 프리 코팅방법.The first step of adhering the lead to the desired portion on the film, the second process of adhering the lead bonded to the film to the copper foil of the printed circuit board, and the third process of peeling the film Pre-coating method. 제1항에 있어서, 상기 제1과정은 전체 필름 위에 납을 접착시키는 제1단계와, 상기 납위에 포토 레지스터를 도포하는 제2단계와, 납과 포토 레지스터가 도포된 필름을 인체회로기판에 형성된 동박과 대칭이 되도록 노광처리하는 제3단계와, 상기 필름을 부식시켜 필름 위에 노광처리된 납만이 남도록 하는 제4단계로 이루어진 것을 특징으로 하는 납의 프리 코팅방법.The method of claim 1, wherein the first process comprises a first step of adhering lead on the entire film, a second step of applying a photoresist on the lead, and a film coated with lead and the photoresist on the human body circuit board. And a fourth step of exposing the film so as to be symmetrical with the copper foil, and a fourth step of corroding the film to leave only the exposed lead on the film. 제1항에 있어서, 상기 제2과정은 인제회로기판의 동박에 접착용 플럭스를 도포하는 제1단계와, 필름에 형성된 납과 동박이 접하도록 인쇄회로기판 위에 필름을 가접착시키는 제2단계와, 납과 도박을 170℃∼190℃에서 열압착시켜 접착시키는 제3단계로 이루어진 것을 특징으로 하는 납의 프리 코팅방법.The method of claim 1, wherein the second process comprises: a first step of applying an adhesive flux to the copper foil of the circuit board, and a second step of temporarily bonding the film on the printed circuit board so that the lead and the copper foil formed on the film contact each other; , Lead pre-coating method comprising a third step of bonding the lead and gambling at 170 ℃ to 190 ℃ by thermal bonding. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR94023383A 1994-09-15 1994-09-15 Method of lead free coating KR0125133B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94023383A KR0125133B1 (en) 1994-09-15 1994-09-15 Method of lead free coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94023383A KR0125133B1 (en) 1994-09-15 1994-09-15 Method of lead free coating

Publications (2)

Publication Number Publication Date
KR960013141A true KR960013141A (en) 1996-04-20
KR0125133B1 KR0125133B1 (en) 1997-12-04

Family

ID=19392870

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94023383A KR0125133B1 (en) 1994-09-15 1994-09-15 Method of lead free coating

Country Status (1)

Country Link
KR (1) KR0125133B1 (en)

Also Published As

Publication number Publication date
KR0125133B1 (en) 1997-12-04

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