KR960012448A - 구면형 범프의 접촉 구조 - Google Patents

구면형 범프의 접촉 구조 Download PDF

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Publication number
KR960012448A
KR960012448A KR1019950029064A KR19950029064A KR960012448A KR 960012448 A KR960012448 A KR 960012448A KR 1019950029064 A KR1019950029064 A KR 1019950029064A KR 19950029064 A KR19950029064 A KR 19950029064A KR 960012448 A KR960012448 A KR 960012448A
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KR
South Korea
Prior art keywords
spherical
contact
bump
contact structure
bumps
Prior art date
Application number
KR1019950029064A
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English (en)
Other versions
KR100341033B1 (ko
Inventor
슌지 아베
가즈미 우라쓰지
Original Assignee
야마나카 가즈타카
야마이치 덴키 가부시키가이샤
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Application filed by 야마나카 가즈타카, 야마이치 덴키 가부시키가이샤 filed Critical 야마나카 가즈타카
Publication of KR960012448A publication Critical patent/KR960012448A/ko
Application granted granted Critical
Publication of KR100341033B1 publication Critical patent/KR100341033B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/112—Resilient sockets forked sockets having two legs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

본 발명은 다수의 구면형 범프를 갖는 IC 팩키지와 소켓의 접촉핀의 접촉 구조에 있어서, 고신뢰의 접촉을 확보하면서 구면형 범프의 손상을 최소한으로 억제하고 동 범프의 품질과 실장 성능을 보증하도록 접촉 구조를 제공하는 것이 목적이다.
구면형 범프(2)와 접촉핀(3)의 접촉 구조로서, 접촉핀(3)이 탄성지편(4a,4b)으로 지지되는 접촉부(5)를 갖고, 이 접촉부(5)가 구면형 범프(2)의 하사점부를 제외하는 구면(球面)과 마주 보도록 배치되는 접촉 구조에 있어서, 상기 접촉부(5)가 구면형 범프(2)의 구면을 파고 들어가는 돌기(5e,5f)를 갖고 있음과 아울러, 이 돌기(5e,5f)가 파고 들어가는 양을 설정하는 수압면(受壓面)(5c,5d)을 갖는 구면형 범프의 접촉 구조이다.

Description

구면형 범프의 접촉 구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 동 접촉핀을 소켓 본체에 끼우고 구면형 범프와 접촉하고 있는 상태의 한 핀을 확대한 단면도.

Claims (4)

  1. 구면형 범프와 접촉핀의 접촉 구조로서, 접촉핀의 탄성지편으로 지지되는 접촉부를 갖고, 이 접촉부가 구면형 범프의 하사점부를 제외하는 구면(球面)과 마주 보도록 배치되는 접촉 구조에 있어서, 상기 접촉부가 구면형 범프의 구면을 파고 들어가는 돌기를 갖고 있음과 아울러, 이 돌기가 파고 들어가는 양을 설정하는 수압면(受壓面)을 갖고 있는 것을 특징으로 하는 구면형 범프의 접촉 구조.
  2. 제1항에 있어서, 상기 돌기는 산마루(ridge)이고, 이 산마루가 구면형 범프의 대략 하사점부를 통과하는 경선(經線)방향으로 연장하고, 이 산마루의 연장 도중에서 구면형 범프의 구면을 파고 들어가는 것을 특징으로 하는 구면형 범프의 접촉 구조.
  3. 구면형 범프와 접촉핀의 접촉 구조로서, 접촉핀이 탄성지편에 지지되는 여러개의 접촉부를 갖고, 이 각 접촉부가 구면형 범프의 하사접부를 제외하는 구면(球面)과 마주 보고 간격을 두고 배치되는 접촉 구조에 있어서, 상기 각 접촉부가 구면형 범프의 구면을 파고 들어가는 돌기를 갖고 있음과 아울러, 이 돌기는 파고 들어가는 양을 설정하는 수압면(受壓面)을 갖고 있는 것을 특징으로 하는 구면형 범프의 접촉 구조.
  4. 제3항에 있어서, 상기 각 돌기가 구면형 범프의 구면을 파고 들어가도록 대략 등간격(等間隔)으로 배치되어 있는 것을 특징으로 하는 구면형 범프의 접촉 구조
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950029064A 1994-09-08 1995-09-06 구면형범프의접촉구조 KR100341033B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6240601A JP2620525B2 (ja) 1994-09-08 1994-09-08 球面形バンプとの接触構造
JP6-240601 1994-09-08

Publications (2)

Publication Number Publication Date
KR960012448A true KR960012448A (ko) 1996-04-20
KR100341033B1 KR100341033B1 (ko) 2002-11-29

Family

ID=17061924

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950029064A KR100341033B1 (ko) 1994-09-08 1995-09-06 구면형범프의접촉구조

Country Status (6)

Country Link
US (1) US5641945A (ko)
JP (1) JP2620525B2 (ko)
KR (1) KR100341033B1 (ko)
DE (1) DE19533272A1 (ko)
MY (1) MY118485A (ko)
TW (1) TW275157B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR100398025B1 (ko) * 2001-07-23 2003-09-19 변홍식 수용성 폴리우레탄이 코팅된 폴리우레탄 장갑의 건식제조방법

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JP4087012B2 (ja) * 1999-05-31 2008-05-14 株式会社エンプラス 電気部品用ソケット
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Also Published As

Publication number Publication date
TW275157B (ko) 1996-05-01
MY118485A (en) 2004-11-30
DE19533272A1 (de) 1996-03-14
JP2620525B2 (ja) 1997-06-18
US5641945A (en) 1997-06-24
KR100341033B1 (ko) 2002-11-29
JPH0878123A (ja) 1996-03-22

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