KR960012404A - Probe card with array of probe tips forming fine inclination angle - Google Patents

Probe card with array of probe tips forming fine inclination angle Download PDF

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Publication number
KR960012404A
KR960012404A KR1019940022362A KR19940022362A KR960012404A KR 960012404 A KR960012404 A KR 960012404A KR 1019940022362 A KR1019940022362 A KR 1019940022362A KR 19940022362 A KR19940022362 A KR 19940022362A KR 960012404 A KR960012404 A KR 960012404A
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KR
South Korea
Prior art keywords
probe
probe tip
inclination angle
probe card
card
Prior art date
Application number
KR1019940022362A
Other languages
Korean (ko)
Other versions
KR0143962B1 (en
Inventor
이억기
Original Assignee
이억기
김명림
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Filing date
Publication date
Application filed by 이억기, 김명림 filed Critical 이억기
Priority to KR1019940022362A priority Critical patent/KR0143962B1/en
Publication of KR960012404A publication Critical patent/KR960012404A/en
Application granted granted Critical
Publication of KR0143962B1 publication Critical patent/KR0143962B1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 발명은 완성된 웨이퍼 상태에 있는 반도체를 검사하는 장치은 프로브카드(probe card)에 관한 것으로, 특히 웨이퍼의 패드와 접촉하는 프로브팁의 배열을 수직으로 부터 약간의 미세경사각을 갖도록 하고 프로브팁을 고정판에 천공된 가이드홀을 통해 삽입 배열하되, 프로브팁의 도체부분을 짧게하여 많은 패드를 가진 칩을 한번에 많이 검사할 수 있도록 하고, 프로브팁이 상기 패드와 접촉시 패드의 중심부에 안정적으로 접촉되게 하며, 패드와의 반복되는 접촉에 따른 압력으로 부터 탄성을 유지함과 동시에 일정한 슬립을 갖도록 하여 웨이퍼의 검사효율을 극대화시킬 수 있도록 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드에 관한 것이다.The present invention relates to a probe card (probe card), the device for inspecting the semiconductor in the state of the completed wafer, in particular to arrange the probe tip in contact with the pad of the wafer to have a slight fine inclination angle from the vertical and fixed to the probe tip Inserted through the guide hole perforated in the array, the conductor portion of the probe tip is shortened so that many chips with a large number of pads can be inspected at a time, and when the probe tip is in contact with the pad, it makes stable contact with the center of the pad. The present invention relates to a probe card having an array structure of probe tips having a fine inclination angle to maximize the inspection efficiency of a wafer while maintaining elasticity from pressure due to repeated contact with a pad.

본 발명의 구체적인 수단은 회로가 구성된 인쇄회로기판(52)의 상면 중앙에 형성되는 보강판(54)과, 인쇄회로기판(52)의 저면 중앙에 프로브팁(56)을 지지 고정하는 고장판(58)으로 구성되어 상기 프로브팁(56)을 절연물(60)에 의해 고정판(58)에 고정시키는 프로브카드(50)에 있어서, 상기 고정판(58)에 한쪽 방향으로 모두 같은 경사각도를 갖는 가이드홀(58a)을 천공하고, 상기 가이드홀(58a)과 같은 경사각도를 갖는 프로브팁(56)의 경사부(56b)를 형성하여 상기 경사부(56b)를 가이드홀(58a)에 삽입 설치하고, 각각의 프로브팁(56)을 인쇄회로기판(52)의 회로부의 방향으로 위치시켜 절연물(60)로 접착 고정시키고, 프로브팁(56)의 노출된 나머지 부분, 즉 인쇄회로기판(52)에 솔더링되는 부분을 제외하고 절연처리하여 이루어진 것이 특징이다.Specific means of the present invention is a reinforcing plate 54 formed in the center of the upper surface of the printed circuit board 52, the circuit is configured, and a fault board for supporting and fixing the probe tip 56 in the center of the bottom surface of the printed circuit board 52 ( 58 is a probe card 50 configured to fix the probe tip 56 to the fixing plate 58 by an insulator 60, the guide holes having the same inclination angle in one direction to the fixing plate 58 in one direction. Punctures (58a), forms an inclined portion (56b) of the probe tip 56 having the same inclination angle as the guide hole (58a) to insert the inclined portion (56b) into the guide hole (58a), Each probe tip 56 is positioned in the direction of the circuit portion of the printed circuit board 52 to be adhesively fixed with the insulator 60 and soldered to the remaining exposed portion of the probe tip 56, that is, the printed circuit board 52. It is characterized by being insulated except for the part.

Description

미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드Probe card with array of probe tips forming fine inclination angle

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 3도는 본 발명 프로브카드의 정면도3 is a front view of the probe card of the present invention

제 4도는 제 3도의 저면도4 is a bottom view of the third

제 5도는 본 발명의 다른 실시예의 저면도.5 is a bottom view of another embodiment of the present invention.

Claims (7)

회로가 구서된 인쇄회로기판의 상면 중앙에 형성되는 보강판과, 인쇄회로기판의 저면 중앙에 프로브팁을 지지 고정하는 고정판으로 구성되어 상기 프로브팁을 절연물에 의해 고정판에 고정시키는 프로브카드에 있어서, 상기 고정판에 한쪽 방향으로 같은 경사각도를 갖는 가이드홀을 프로브팁의 수와 대응되는 위치에 천공하고, 상기 가이드홀과 같은 경사각도를 갖는 프로브팁의 경사부를 형성하여 상기 경사부를 가이드홀에 삽입 설치하고, 이를 절연물에 의해 고정판에 고정 유지시킨 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.A probe card comprising a reinforcing plate formed at a center of an upper surface of a printed circuit board on which a circuit is written, and a fixing plate for holding a probe tip at a center of a bottom surface of a printed circuit board to fix the probe tip to a fixed plate by an insulator. The guide plate having the same inclination angle in one direction is drilled in the fixing plate at a position corresponding to the number of probe tips, and the inclined portion is inserted into the guide hole by forming an inclined portion of the probe tip having the same inclination angle as the guide hole. And a probe card having an array structure of probe tips forming a fine inclination angle, wherein the probe card is fixed to the fixed plate by an insulator. 제 1항에 있어서, 상기 가이드홀에 삽입되어 돌출된 프로브팁의 접촉단부는 좌, 우로 배열되며, 모두 같은 방향으로 같은 경사각도를 갖는 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.The method of claim 1, wherein the contact ends of the probe tips inserted into the guide holes protruding from the left and right sides of the probe tips are arranged in the same direction, and all have the same inclination angle in the same direction. Having a probe card. 제 1항 또는 제 2항에 있어서 상기 가이드홀에 삽입되어 돌출된 프로브팁의 접촉단부 배열은 반도체의 검사에 대응하여 2열, 3열, 4열 또는 그 이상의 열을 갖을 수 있도록 한 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.The method according to claim 1 or 2, wherein the arrangement of the contact ends of the probe tips inserted into the guide holes protruding may have two, three, four or more rows corresponding to the inspection of the semiconductor. Probe card having an array of probe tips forming a fine inclination angle. 제 1항에 있어서, 상기 프로브팁의 외경이 80미크론에서 30미크론 범위이고, 고정판의 저면으로 부터 돌출된 프로브팁 도체부분의 돌출길이는 2000미크론 이내인 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.The probe tip of claim 1, wherein an outer diameter of the probe tip ranges from 80 microns to 30 microns, and a protruding length of the probe tip conductor portion protruding from the bottom of the fixing plate is within 2000 microns. Probe card with an array structure. 제 4항에 있어서, 상기 프로브팁은 열경화한 백금합금 재질인 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.5. The probe card of claim 4, wherein the probe tip is a thermosetting platinum alloy material. 제 1항에 있어서, 가이드홀을 갖는 고정판은 세라믹재인 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.The probe card according to claim 1, wherein the fixing plate having the guide hole is made of a ceramic material. 제 1항에 있어서, 프로브팁의 경사부의 경사각도는 수직으로 부터 3°~6°이내인 것을 특징으로 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드.The probe card of claim 1, wherein the inclination angle of the inclined portion of the probe tip is within 3 ° to 6 ° from the vertical. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940022362A 1994-09-06 1994-09-06 Probe card having skew probe tip KR0143962B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940022362A KR0143962B1 (en) 1994-09-06 1994-09-06 Probe card having skew probe tip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940022362A KR0143962B1 (en) 1994-09-06 1994-09-06 Probe card having skew probe tip

Publications (2)

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KR960012404A true KR960012404A (en) 1996-04-20
KR0143962B1 KR0143962B1 (en) 1998-08-17

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KR1019940022362A KR0143962B1 (en) 1994-09-06 1994-09-06 Probe card having skew probe tip

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102188379B1 (en) * 2020-08-07 2020-12-08 이정문 Manufacturing method of probecard and probecard using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102188379B1 (en) * 2020-08-07 2020-12-08 이정문 Manufacturing method of probecard and probecard using the same

Also Published As

Publication number Publication date
KR0143962B1 (en) 1998-08-17

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