KR960012404A - Probe card with array of probe tips forming fine inclination angle - Google Patents
Probe card with array of probe tips forming fine inclination angle Download PDFInfo
- Publication number
- KR960012404A KR960012404A KR1019940022362A KR19940022362A KR960012404A KR 960012404 A KR960012404 A KR 960012404A KR 1019940022362 A KR1019940022362 A KR 1019940022362A KR 19940022362 A KR19940022362 A KR 19940022362A KR 960012404 A KR960012404 A KR 960012404A
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- probe tip
- inclination angle
- probe card
- card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 발명은 완성된 웨이퍼 상태에 있는 반도체를 검사하는 장치은 프로브카드(probe card)에 관한 것으로, 특히 웨이퍼의 패드와 접촉하는 프로브팁의 배열을 수직으로 부터 약간의 미세경사각을 갖도록 하고 프로브팁을 고정판에 천공된 가이드홀을 통해 삽입 배열하되, 프로브팁의 도체부분을 짧게하여 많은 패드를 가진 칩을 한번에 많이 검사할 수 있도록 하고, 프로브팁이 상기 패드와 접촉시 패드의 중심부에 안정적으로 접촉되게 하며, 패드와의 반복되는 접촉에 따른 압력으로 부터 탄성을 유지함과 동시에 일정한 슬립을 갖도록 하여 웨이퍼의 검사효율을 극대화시킬 수 있도록 하는 미세 경사각도를 이루는 프로브팁의 배열구조를 갖는 프로브카드에 관한 것이다.The present invention relates to a probe card (probe card), the device for inspecting the semiconductor in the state of the completed wafer, in particular to arrange the probe tip in contact with the pad of the wafer to have a slight fine inclination angle from the vertical and fixed to the probe tip Inserted through the guide hole perforated in the array, the conductor portion of the probe tip is shortened so that many chips with a large number of pads can be inspected at a time, and when the probe tip is in contact with the pad, it makes stable contact with the center of the pad. The present invention relates to a probe card having an array structure of probe tips having a fine inclination angle to maximize the inspection efficiency of a wafer while maintaining elasticity from pressure due to repeated contact with a pad.
본 발명의 구체적인 수단은 회로가 구성된 인쇄회로기판(52)의 상면 중앙에 형성되는 보강판(54)과, 인쇄회로기판(52)의 저면 중앙에 프로브팁(56)을 지지 고정하는 고장판(58)으로 구성되어 상기 프로브팁(56)을 절연물(60)에 의해 고정판(58)에 고정시키는 프로브카드(50)에 있어서, 상기 고정판(58)에 한쪽 방향으로 모두 같은 경사각도를 갖는 가이드홀(58a)을 천공하고, 상기 가이드홀(58a)과 같은 경사각도를 갖는 프로브팁(56)의 경사부(56b)를 형성하여 상기 경사부(56b)를 가이드홀(58a)에 삽입 설치하고, 각각의 프로브팁(56)을 인쇄회로기판(52)의 회로부의 방향으로 위치시켜 절연물(60)로 접착 고정시키고, 프로브팁(56)의 노출된 나머지 부분, 즉 인쇄회로기판(52)에 솔더링되는 부분을 제외하고 절연처리하여 이루어진 것이 특징이다.Specific means of the present invention is a reinforcing plate 54 formed in the center of the upper surface of the printed circuit board 52, the circuit is configured, and a fault board for supporting and fixing the probe tip 56 in the center of the bottom surface of the printed circuit board 52 ( 58 is a probe card 50 configured to fix the probe tip 56 to the fixing plate 58 by an insulator 60, the guide holes having the same inclination angle in one direction to the fixing plate 58 in one direction. Punctures (58a), forms an inclined portion (56b) of the probe tip 56 having the same inclination angle as the guide hole (58a) to insert the inclined portion (56b) into the guide hole (58a), Each probe tip 56 is positioned in the direction of the circuit portion of the printed circuit board 52 to be adhesively fixed with the insulator 60 and soldered to the remaining exposed portion of the probe tip 56, that is, the printed circuit board 52. It is characterized by being insulated except for the part.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 3도는 본 발명 프로브카드의 정면도3 is a front view of the probe card of the present invention
제 4도는 제 3도의 저면도4 is a bottom view of the third
제 5도는 본 발명의 다른 실시예의 저면도.5 is a bottom view of another embodiment of the present invention.
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940022362A KR0143962B1 (en) | 1994-09-06 | 1994-09-06 | Probe card having skew probe tip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940022362A KR0143962B1 (en) | 1994-09-06 | 1994-09-06 | Probe card having skew probe tip |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960012404A true KR960012404A (en) | 1996-04-20 |
KR0143962B1 KR0143962B1 (en) | 1998-08-17 |
Family
ID=19392116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940022362A KR0143962B1 (en) | 1994-09-06 | 1994-09-06 | Probe card having skew probe tip |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0143962B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102188379B1 (en) * | 2020-08-07 | 2020-12-08 | 이정문 | Manufacturing method of probecard and probecard using the same |
-
1994
- 1994-09-06 KR KR1019940022362A patent/KR0143962B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102188379B1 (en) * | 2020-08-07 | 2020-12-08 | 이정문 | Manufacturing method of probecard and probecard using the same |
Also Published As
Publication number | Publication date |
---|---|
KR0143962B1 (en) | 1998-08-17 |
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Legal Events
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---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120405 Year of fee payment: 15 |
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LAPS | Lapse due to unpaid annual fee |