KR960009110B1 - Spare unit method and assembly - Google Patents

Spare unit method and assembly Download PDF

Info

Publication number
KR960009110B1
KR960009110B1 KR93016783A KR930016783A KR960009110B1 KR 960009110 B1 KR960009110 B1 KR 960009110B1 KR 93016783 A KR93016783 A KR 93016783A KR 930016783 A KR930016783 A KR 930016783A KR 960009110 B1 KR960009110 B1 KR 960009110B1
Authority
KR
South Korea
Prior art keywords
ceramic substrate
insulated ceramic
metallic pattern
assembly
prepared
Prior art date
Application number
KR93016783A
Other languages
Korean (ko)
Other versions
KR950007074A (en
Inventor
Heung-Kyu Kwon
Jong-Sang Yun
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to KR93016783A priority Critical patent/KR960009110B1/en
Publication of KR950007074A publication Critical patent/KR950007074A/en
Application granted granted Critical
Publication of KR960009110B1 publication Critical patent/KR960009110B1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38Selection of media, e.g. special atmospheres for surrounding the working area

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The spare soldering unit is prepared by reducing metallic pattern(10) on the insulated ceramic substrate(20) in a conveyor furnace with H2 over 300deg.C; loading solder on the metallic pattern; forming free solder parts(40) on the metallic pattern, while passing through the conveyor furnace with 100% H2; forming also free solder parts(40) on the back side(30) of the insulated ceramic substrate(20) by the same method as above. The insulated ceramic substrate(20) is prepared by bonding copper to alumina substrate to make determined pattern(10) and plating the bonded copper layer with nickel.
KR93016783A 1993-08-27 1993-08-27 Spare unit method and assembly KR960009110B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR93016783A KR960009110B1 (en) 1993-08-27 1993-08-27 Spare unit method and assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR93016783A KR960009110B1 (en) 1993-08-27 1993-08-27 Spare unit method and assembly

Publications (2)

Publication Number Publication Date
KR950007074A KR950007074A (en) 1995-03-21
KR960009110B1 true KR960009110B1 (en) 1996-07-10

Family

ID=19362094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93016783A KR960009110B1 (en) 1993-08-27 1993-08-27 Spare unit method and assembly

Country Status (1)

Country Link
KR (1) KR960009110B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101508793B1 (en) * 2009-02-25 2015-04-06 한라비스테온공조 주식회사 Manufacturing method of heat exchanger using thermoelectric module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101508793B1 (en) * 2009-02-25 2015-04-06 한라비스테온공조 주식회사 Manufacturing method of heat exchanger using thermoelectric module

Also Published As

Publication number Publication date
KR950007074A (en) 1995-03-21

Similar Documents

Publication Publication Date Title
DE3262203D1 (en) Component assembly including a rigid substrate
TW350071B (en) Chip resistor and a method of producing the same
JPS57130441A (en) Integrated circuit device
EP0092020A3 (en) Composite structure, particularly for use as a printed-circuit board
JPS6457789A (en) Electronic component mounting structure
GB1289262A (en)
GB1031436A (en) Improvements in and relating to methods of soft-soldering
ATE295769T1 (en) THE USE OF SOLDER METALS ON NICKEL PLATED ELECTRICAL SURFACES
MY116760A (en) Electro-conductive composition and electronic equipment using same.
MY122692A (en) Electrodeposited copper foil with carrier and method for producing the same
KR960009110B1 (en) Spare unit method and assembly
EP0380289A3 (en) A process of manufacturing a multi-layer ceramic substrate assembly
MX9706314A (en) Method for attaching lead parts and shield case to print substrate, and method for attaching chip parts, lead parts and shield case to print cubstrate.
MY116051A (en) Thermal deformation management for chip carriers
GB9001833D0 (en) Method of bonding a diamond film to a substrate
ES2023345A6 (en) Multilayer transducer with bonded contacts and method for implementation of bonding
JPH09234826A (en) Metal-ceramic composite base plate and manufacture thereof
JPH09315876A (en) Aluminum-ceramic composite substrate and is production
JPS6486527A (en) Ccb tape carrier
JPS647542A (en) Formation of bump
JPS54146960A (en) Semiconductor device
CN1285614A (en) Method for preparation of printed IC board
JPS6417491A (en) Formation of conductor of ceramic wiring board
JPS6445782A (en) Substrate having good thermal conductivity
JPS57143835A (en) Mounting method of ic

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060630

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee