KR960009110B1 - Spare unit method and assembly - Google Patents
Spare unit method and assembly Download PDFInfo
- Publication number
- KR960009110B1 KR960009110B1 KR93016783A KR930016783A KR960009110B1 KR 960009110 B1 KR960009110 B1 KR 960009110B1 KR 93016783 A KR93016783 A KR 93016783A KR 930016783 A KR930016783 A KR 930016783A KR 960009110 B1 KR960009110 B1 KR 960009110B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic substrate
- insulated ceramic
- metallic pattern
- assembly
- prepared
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The spare soldering unit is prepared by reducing metallic pattern(10) on the insulated ceramic substrate(20) in a conveyor furnace with H2 over 300deg.C; loading solder on the metallic pattern; forming free solder parts(40) on the metallic pattern, while passing through the conveyor furnace with 100% H2; forming also free solder parts(40) on the back side(30) of the insulated ceramic substrate(20) by the same method as above. The insulated ceramic substrate(20) is prepared by bonding copper to alumina substrate to make determined pattern(10) and plating the bonded copper layer with nickel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93016783A KR960009110B1 (en) | 1993-08-27 | 1993-08-27 | Spare unit method and assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93016783A KR960009110B1 (en) | 1993-08-27 | 1993-08-27 | Spare unit method and assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950007074A KR950007074A (en) | 1995-03-21 |
KR960009110B1 true KR960009110B1 (en) | 1996-07-10 |
Family
ID=19362094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR93016783A KR960009110B1 (en) | 1993-08-27 | 1993-08-27 | Spare unit method and assembly |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960009110B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101508793B1 (en) * | 2009-02-25 | 2015-04-06 | 한라비스테온공조 주식회사 | Manufacturing method of heat exchanger using thermoelectric module |
-
1993
- 1993-08-27 KR KR93016783A patent/KR960009110B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101508793B1 (en) * | 2009-02-25 | 2015-04-06 | 한라비스테온공조 주식회사 | Manufacturing method of heat exchanger using thermoelectric module |
Also Published As
Publication number | Publication date |
---|---|
KR950007074A (en) | 1995-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060630 Year of fee payment: 11 |
|
LAPS | Lapse due to unpaid annual fee |