KR960002390A - Manufacturing method of external electrode of multilayer chip capacitor - Google Patents

Manufacturing method of external electrode of multilayer chip capacitor Download PDF

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Publication number
KR960002390A
KR960002390A KR1019940012388A KR19940012388A KR960002390A KR 960002390 A KR960002390 A KR 960002390A KR 1019940012388 A KR1019940012388 A KR 1019940012388A KR 19940012388 A KR19940012388 A KR 19940012388A KR 960002390 A KR960002390 A KR 960002390A
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KR
South Korea
Prior art keywords
external electrode
chip capacitor
depositing
manufacturing
chip
Prior art date
Application number
KR1019940012388A
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Korean (ko)
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KR0130868B1 (en
Inventor
박순섭
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김정덕
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Priority to KR1019940012388A priority Critical patent/KR0130868B1/en
Publication of KR960002390A publication Critical patent/KR960002390A/en
Application granted granted Critical
Publication of KR0130868B1 publication Critical patent/KR0130868B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

본 발명은 칩(chip)화된 다층 칩 캐패시터(MLCC:Multilayer Chip Capacitor)에 관한 것으로, 상세하게는 일반 박막 제조 공정에서 이용되는 증착법과 도금 방법을 이용하여 다층 칩 캐패시터(MILL)의 외부전극을 제조하는 방법에 관한 것이다.The present invention relates to a chipped multilayer chip capacitor (MLCC), and more particularly, to manufacture an external electrode of a multilayer chip capacitor (MILL) using a deposition method and a plating method used in a general thin film manufacturing process. It is about how to.

즉 본 발명에 따른 칩 캐패시터의 외부전극 제조방법은 액상코팅법이나 인쇄법 대신 박막 형성공정을 이용하면서도, 종래와 같이 박막을 칩 전체에 형성하는 것이 아니라, 틀을 이용하여 다수의 칩에 동시에 전극이 형성될 부분에만 정밀하게 외부 전극을 증착 제조함으로서, 내부 전극과 외부 전극을 증착 제조함으로써, 내부 전극과 외부 전극을 접속함에 있어서, 정밀 접속이 가능하여, 접속 차체가 견고하게 이루어져 불량이 적고, 형상 및 치수제어가 용이하여 정밀도가 높으며, 제조공정이 간단한 장점이 있다.In other words, the method of manufacturing an external electrode of a chip capacitor according to the present invention uses a thin film forming process instead of a liquid coating method or a printing method. By depositing and manufacturing the external electrode precisely to the portion to be formed, by depositing and manufacturing the internal electrode and the external electrode, in the connection between the internal electrode and the external electrode, precise connection is possible, the connection vehicle body is firmly formed, there are few defects, Easy to control shape and dimension, high precision, and simple manufacturing process has the advantage.

Description

다층 칩 캐피시터(Multilayer chip capacitor)의 외부 전극 제조방법External electrode manufacturing method of multilayer chip capacitor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 제조방법에 따른 다층 칩 캐패시터의 사시도,1 is a perspective view of a multi-layer chip capacitor according to the manufacturing method of the present invention,

제2도는 제1도네 도시한 다층 칩 캐피시터의 A-A'방향의 수직 단면도,2 is a vertical cross-sectional view taken along the line AA ′ of the multilayer chip capacitor shown in FIG.

제3도는 외부 전극 형성전의 다층 칩 캐피시터의 수직 단면도.3 is a vertical sectional view of a multilayer chip capacitor before forming an external electrode.

Claims (5)

소정의 객 수의 사각 격자형으로 이루어진 틀과, 이 틀을 덮어주는 덮개를 소정의 결합 수단으로 결합하는 결합단계와, 상기 결합 단계에서 상기 결합된 틀에 소정의 객 수의 전극 증착을 소망하는 내부 전극 및 유전체가 번갈아 적층되어 형성된 판상의 칩캐패시터 몸체들을 올려놓고 흔들어주어 칩 캐패시터 몸체들이 이 틀의 격차속에 안착되도록 하는 칩 안착단계와; 상기 칩 안착단계에서 안착도니 칩 캐피시터 몸체들이 상기의 격자로 부터 돌출된 소정의 부분에 증착법에 의해 선택적으로 제1외부전극을 증착하는 증착 단계와, 상기 증착 단계에서 증착된 제1외부 전극 상면에 도금법에 의해 제2외부전극을 도금하는 도금 단계를 포함하는 것을 특징으로 하는 다층 칩 캐피시터의 외부 전극 제조방법.Combining a frame having a predetermined number of square lattice shapes, a cover covering the frame with a predetermined coupling means, and depositing a predetermined number of electrodes on the bonded frame in the combining step. A chip mounting step of placing and shaking the plate-shaped chip capacitor bodies formed by alternately stacking internal electrodes and dielectrics so that the chip capacitor bodies are seated in the gap of the frame; Deposition step of depositing the first external electrode selectively by the deposition method on the predetermined portion protruding from the grating the seated chip chip capacitor body in the chip mounting step, and on the upper surface of the first external electrode deposited in the deposition step And a plating step of plating the second external electrode by a plating method. 제1항에 있어서, 상기 증착 단계는 스퍼터링법이 적용되는 것을 특징으로 하는 다층 칩 캐패서터의 외부전극 제조방법.The method of claim 1, wherein the deposition step is performed by a sputtering method. 제1항에 있어서, 상기 증착 단계는 증발 증착법이 적용되는 것을 특징으로 하는 다층 칩 캐피시터의 외부 전극 제조방법.The method of claim 1, wherein the depositing step is performed by an evaporation deposition method. 제1항에 있어서, 상기 칩 안착 단계에서 상기 틀의 격자에 안착된 상기 칩 캐패시트는 상기 틀의 격자 높이보다 외부 전극이 형성될 부분 만큼높은 점에 특징이 있는 칩 캐패시터의 외부 전극 제조 방법.The method of claim 1, wherein the chip capacitor seated on the grid of the mold in the chip mounting step is higher than the grid height of the mold by a portion where an external electrode is to be formed. 제1항에 있어서, 증착 단계는 상기 틀에서 상기 덮개를 틀의 반대쪽으로 조립하여 칩 몸체의 양단에 제1의 부 전극이 형성될 수 있도록 2회 실시되는 것을 특징으로 하는 칩 캐패시티의 외부 전극 제조방법.The external electrode of claim 1, wherein the depositing step is performed twice so that the first secondary electrodes are formed at both ends of the chip body by assembling the cover to the opposite side of the mold. Manufacturing method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940012388A 1994-06-02 1994-06-02 Multilayer chip capacitor electrode producing method KR0130868B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940012388A KR0130868B1 (en) 1994-06-02 1994-06-02 Multilayer chip capacitor electrode producing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940012388A KR0130868B1 (en) 1994-06-02 1994-06-02 Multilayer chip capacitor electrode producing method

Publications (2)

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KR960002390A true KR960002390A (en) 1996-01-26
KR0130868B1 KR0130868B1 (en) 1998-05-15

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Publication number Priority date Publication date Assignee Title
KR101228688B1 (en) 2010-11-25 2013-02-01 삼성전기주식회사 Multi-layered ceramic capacitor

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