KR960000310Y1 - Track equipment - Google Patents

Track equipment Download PDF

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Publication number
KR960000310Y1
KR960000310Y1 KR92010719U KR920010719U KR960000310Y1 KR 960000310 Y1 KR960000310 Y1 KR 960000310Y1 KR 92010719 U KR92010719 U KR 92010719U KR 920010719 U KR920010719 U KR 920010719U KR 960000310 Y1 KR960000310 Y1 KR 960000310Y1
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South Korea
Prior art keywords
gas
wafer
track equipment
track
wafer chuck
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KR92010719U
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Korean (ko)
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KR940001975U (en
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박해성
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김주용
현대전자산업주식회사
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Priority to KR92010719U priority Critical patent/KR960000310Y1/en
Publication of KR940001975U publication Critical patent/KR940001975U/en
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Publication of KR960000310Y1 publication Critical patent/KR960000310Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

내용 없음.No content.

Description

트랙장비Track equipment

제 1 도는 종래의 트랙장비의 구성을 개략적으로 도시한 정면도.1 is a front view schematically showing the configuration of a conventional track equipment.

제 2 도는 본 고안에 따른 트랙장비의 구성을 개략적으로 도시한 정면도.Figure 2 is a front view schematically showing the configuration of the track equipment according to the present invention.

제 3 도는 제 2 도의 개스분출기의 저면도.3 is a bottom view of the gas ejector of FIG.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 본체 2 : 회전축1 body 2 rotation axis

3 : 웨이퍼척 4 : 노즐3: wafer chuck 4: nozzle

5 : 현상액 공급원 6 : 본체내벽5: developer supply source 6: inner wall of main body

7 : 웨이퍼 l0 : 개스분출기7: wafer l0: gas ejector

11 : 기스분출구 12 : 개스유입관11: gas outlet 12: gas inlet pipe

13 : 개스공급원13 gas supply source

본 고안은 트랙장비(track system)에 관한 것으로, 특히 반도체 제조공정중 트랙장비롤 사용하여 감광막 현상공정을 진행할때 발생하는 반응부산물이 백-스트레스(back-spray)효과에 의하여 웨이퍼의 불량을 유발하게 하는 것을 방지하기 위해 트랙장비내에 링모양의 개스분출기를 장착한 트랙장비에 관한 것이다.The present invention relates to a track system, and in particular, reaction by-products generated during photoresist development using track equipment rolls during semiconductor manufacturing process cause wafer defects due to back-spray effect. To a track arrangement with a ring-shaped gas ejector in the track arrangement to prevent this.

일반적으로, 반도체 제조장비중 하나인 트랙장비는 반도체 제조공정중 리소그라피(Lithography) 공정 즉, 감광막 도포, 감광막 현상 및 세정공정에 사용되는 장비이다.In general, the track equipment, which is one of the semiconductor manufacturing equipment, is a equipment used for a lithography process, that is, a photoresist coating, a photoresist development, and a cleaning process.

종래 트랙장비는 크게 트랙장비 본체와 그 내부에 회전축, 웨이퍼 척(Wafer-chuck) 및 노즐(Nozzle) 등으로 구성되어 있는바, 이를 첨부된 제 1 도롤 참조하여 설명하면 다음과 같다. 제 1 도는 종래의 트랙장비의 구성을 설명하기 위하여 트랙장비의 정면을 개략적으로 도시한 것으로, 트랙장비의 구성온 트랙장비 본체(1) 하단부의 중앙에 모터(도시않음)의 회전운동을 전달하기 위한 회전축(2)이 구비되고, 상기 회전축(2) 상단면에 웨이퍼(7)를 고정하기 위한 웨이퍼 척(3)이 구비되며, 상기 웨이퍼 척(3) 상부와 예정거리 이격되어 트랙장비 본체(1) 외부의 현상액 공급원(5)에 연결된 노즐(4)이 구비되어 이루어진다.Conventional track equipment is largely composed of a track equipment main body and a rotating shaft, a wafer chuck (Wafer-chuck) and a nozzle (Nozzle), such as described with reference to the accompanying first roll. 1 is a view schematically showing the front of a track device in order to explain the structure of a conventional track device, and transmits a rotational motion of a motor (not shown) to the center of the lower part of the track device main body 1 of the track device. Is provided with a rotating shaft (2), a wafer chuck (3) for fixing the wafer (7) on the upper surface of the rotating shaft (2) is provided, and spaced apart from the wafer chuck (3) a predetermined distance from the track equipment body ( 1) A nozzle 4 connected to an external developer source 5 is provided.

상기한 구성으로 이루어진 트랙장비를 사용하여 감광막 도포, 감광막 현상 및 세정공정을 실시하게 되는데, 상기 감광막 현상공정시 백-스프레이 효과에 의하여 웨이퍼에 반응부산물이 부착됨에 따라 웨이퍼의 볼량율이 증가하는 문제가 발생한다. 즉, 웨이퍼를 웨이퍼 척 위에 올려 고정시킨 후에 감광막 현상을 위하여 노즐을 통해 현상액을 웨이퍼상에 도포된 감광막위에 뿌린다음, 회전축을 회전시키게 되는데, 이때 강한 회전력에 의한 원심력에 의하여 현상하고자 하는 감광막의 반응 부산물이 웨이프 밖으로 밀려나게 되고, 밀려난 반응부산물은 본쳬 내벽에 부딪히면서 그 일부가 웨이퍼로 되돌아 오는 현상(백-스프레이 효과)이 발생하게 되며, 이 백-스프레이 효과에 의해 되돌아온 반응부산물이 웨이퍼에 부착되면서 웨이퍼의 불량요소로 작용하게 된다.The photoresist coating, photoresist development, and cleaning processes are performed using the track device having the above-described configuration. In the photoresist development process, the volume ratio of the wafer increases as the reaction by-product is attached to the wafer by the back-spray effect. Occurs. That is, after the wafer is placed on the wafer chuck and fixed, the developer is sprayed onto the photosensitive film coated on the wafer through the nozzle for developing the photosensitive film, and then the rotating shaft is rotated. By-products are pushed out of the wafer, and the reaction by-products hit the inner wall of the main body and a part of them are returned to the wafer (back-spray effect), and the reaction by-products returned by the back-spray effect As it is attached, it acts as a defective element of the wafer.

따라서, 본 고안의 목적은 웨이퍼 척상부와 예정거리 이격된 위치에 웨이퍼보다 지름이 큰 링모양의 개스분출기를 설치하여 개스를 수직되게 분사시켜 원심력에 의해 밖으로 뛰어나오는 반응 부산물을 트랙장비의 하단으로 밀어내리게 함으로써, 종래와 같이 트랙장비 본체 내벽에 부딪혀 웨이퍼로 되돌아가는 백-스프레이 효과를 방지하므로 웨이퍼의 불량율을 현저히 감소시키는 트랙장비를 제공하는데 있다.Therefore, an object of the present invention is to install a ring-shaped gas ejector with a diameter larger than that of the wafer at a predetermined distance from the wafer chuck, and vertically inject the gas into the bottom of the track equipment. By pushing down, it prevents the back-spray effect that hits the inner wall of the track equipment main body and returns to the wafer as in the prior art, thereby providing a track equipment that significantly reduces the defect rate of the wafer.

이하, 본 고안을 첨부된 도면을 참조하여 상세히 설명하기로 한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

제 2 도는 본 고안에 따른 트랙장비의 구성을 설명하기 위하여 트랙장비의 정면을 개략적으로 도시한 것이고, 제 3 도는 제 2 도의 개스분출기의 저면을 도시한 것이다.2 is a schematic view of the front of the track equipment to explain the configuration of the track equipment according to the present invention, and FIG. 3 is a bottom view of the gas ejector of FIG.

본 고안에 따른 트랙장비의 구성을 제 2 도를 참조하여 설명하면, 전술한 제 1 도와 같이 트랙장비 본체(l)와 그 내부에 회전축 (2), 웨이퍼 척(3) 및 노즐(4)등의 기본적인 구성하에 개스분출기(10)를 구비하여 본 고안의 트랙장비를 이룬다.Referring to the configuration of the track equipment according to the present invention with reference to Figure 2, the track equipment body (1) and the rotating shaft (2), wafer chuck (3) and nozzles (4) and the like as described above 1 Under the basic configuration of the gas ejector 10 is provided to achieve the track equipment of the present invention.

상기 개스분출기(10)는 상기 웨이퍼 척(3) 상부와 예성거리 이격된 위치에서 개스유입관(12)에 의해 트랙장비 본체(1) 외부에 구비된 개스공급원(13)과 연결하여 구성하는데, 상기 개스분출기(10)의 전제형상은 링모양이며, 그 하단에 다수의 개스분출구(11)가 형성되어 있고, 그 지름(rl)은 통상 웨이퍼(7)의 지름(r2)보다 크게 (r1〉r2)구성한다.The gas ejector 10 is configured to connect with the gas supply source 13 provided outside the track equipment main body 1 by the gas inlet pipe 12 at a position spaced apart from the upper portion of the wafer chuck 3. The preliminary shape of the gas ejector 10 is ring-shaped, and a plurality of gas ejection openings 11 are formed at the lower end thereof, and the diameter rl thereof is larger than the diameter r2 of the wafer 7 ( r1> r2).

상기 개스분출구(11)는 개스분사기 개스의 흐름방향이 수직방향이 되도록 구성하거나, 수직방향을 기준으로 외부로 약 45°이하의 기울기를 갖도록 구성한다.The gas ejection opening 11 is configured such that the flow direction of the gas injector gas is vertical, or is configured to have an inclination of about 45 ° or less with respect to the vertical direction.

즉, 개스분출구(11)롤 통해 분사되는 개스흐름 방향을 개스흐름 방향 표시 "가"와 "나" 사이 예를들어, 각도(θ)의 범위가 약 0∼45°사이에서 개스흐름벽이 형성되도록 개스분출구(11)를 구성한다.That is, a gas flow wall is formed between the gas flow direction indications "a" and "b", for example, in the range of the angle (theta) between about 0 to 45 degrees. The gas ejection opening 11 is constituted as much as possible.

상술한 구성에 의거하여 본 고안 트랙장비의 동작을 설명하면 다음과 같다.Referring to the operation of the present invention track equipment based on the above configuration is as follows.

감광막이 도포된 웨이퍼(7)를 웨이퍼 척(3)에 고정한 다음, 회전축(2)을 천천히 회전시키면서 노즐(4)을 통해 현상액을 뿌린다. 현상액을 감광막 표면 전체에 골고루 퍼뜨린후 감광막 현상을 하기 위하여 회전축(2)을 고속으로 회전시킨다. 동시에 개스공급원(13)으로부터 개스 예를들어, 불활성 개스를 개스분출기(10)로 공급하여 개스분출구(11)를 통해 개스를 분사시킨다.The photosensitive film-coated wafer 7 is fixed to the wafer chuck 3, and then the developer is sprayed through the nozzle 4 while slowly rotating the rotating shaft 2. After spreading the developer evenly over the entire surface of the photoresist film, the rotary shaft 2 is rotated at high speed in order to develop the photoresist film. At the same time, a gas, for example, an inert gas is supplied from the gas supply source 13 to the gas ejector 10 to inject the gas through the gas ejection opening 11.

상기 동작중 감광막 현상을 위해 회전축(2)을 고속회전시키면 강한 원심력이 발생하여 반응부산물이 밖으로 밀려나거나 튀어나가게 되는데, 이때 일부 반응부산물이 본체 내벽 (6)에 부딪쳐 웨이퍼(7)로 되돌아가 웨이퍼(7)의 불량을 유발시키게 되므로 이를 근본적으로 해결하기 위해 개스분출기(10)의 개스분출구(11)를 통해 개스를 분사시켜 웨이퍼(7) 주변부에 개스흐름벽을 형성시키므로써. 웨이퍼(7) 밖으로 튀어나가는 반응부산물은 개스흐름벽에 의해 트랙장비의 아랫단으로 밀려내려가게 되어 백-스프레이 효과를 방지한다. 그리고 상기 개스분출기(10)의 지름(rl)을 일반적인 웨이퍼(7)의 지름(r2) 보다 크게하고, 개스분출구(11)에서 분사되는 개스의 호름방향을 웨이퍼(7)가 있는 내측으로 향하지 않게 즉, 개스의 흐름방향 "가"와 "나" 사이에서 개스흐름벽을 형성하게 개스분출구(11)를 구성시키므로써, 감광막 현상에 악영향을 미치지 않게 한다.When the rotating shaft 2 is rotated at a high speed for the photoresist phenomenon during the operation, a strong centrifugal force is generated to cause the reaction by-products to be pushed out or protrude out. In order to solve the problem (7) in order to fundamentally solve this by spraying the gas through the gas outlet 11 of the gas ejector 10 to form a gas flow wall around the wafer (7). Reaction by-products sticking out of the wafer 7 are pushed down the bottom of the track equipment by the gas flow wall to prevent the back-spray effect. In addition, the diameter rl of the gas ejector 10 is larger than the diameter r2 of the general wafer 7, and the circumferential direction of the gas injected from the gas ejection port 11 is not directed toward the inside of the wafer 7. In other words, the gas ejection opening 11 is formed so as to form a gas flow wall between the gas flow directions "a" and "b" so as not to adversely affect the photosensitive film phenomenon.

상술한 바와 같이 본 고안은 웨이퍼 척 상부의 예정위치에 개스분출기를 구비하여 웨이퍼 외주변에 개스흐름벽을 이루게 함으로써 백-스프레이 효과로 인한 웨이퍼의 불량을 감소시킬 수 있다.As described above, the present invention can reduce the defect of the wafer due to the back-spray effect by forming a gas flow wall on the outer periphery of the wafer by providing a gas ejector at a predetermined position above the wafer chuck.

Claims (4)

(정정)트랙장비 본체(1) 하단부의 중앙에 모터의 회전운동을 전달하기 위한 회전축(2)이 구비되고 상기 회전축(2) 상단면에 웨이퍼를 고정하기 위한 웨이퍼 척(3)이 구비되며, 상기 웨이퍼 척(3) 상부와 예정거리 이격된 위치에 노즐(4)이 구비되어 이루어진 트랙장비에 있어서,(Correction) In the center of the lower end of the track equipment main body 1 is provided with a rotating shaft (2) for transmitting the rotational movement of the motor and a wafer chuck (3) for fixing the wafer on the upper surface of the rotating shaft (2), In the track equipment is provided with a nozzle (4) at a position spaced apart from the upper portion of the wafer chuck 3, 상기 웨이퍼 척(3) 상부와 예정거리 이격된 위치에서 개스유입관(12)에 의해 트랙장비 본체(1) 외부에 구비된 개스공급원(13)과 연결된 링모양의 개스분출기(10)를 설치하여 구성된 것을 특징으로 하는 트랙장비.A ring-shaped gas ejector 10 connected to the gas supply source 13 provided outside the track equipment main body 1 by a gas inlet pipe 12 at a position spaced apart from the upper portion of the wafer chuck 3 by a predetermined distance is installed. Track equipment, characterized in that configured to. (정정) 제 1 항에 있어서,(Correction) The method according to claim 1, 상기 개스분출기(10)는 그 하단에 다수의 개스분출구(11)를 형성하고, 그 지름(rl)은 웨이퍼의 지름(r2)보다 크게 구성되게 함을 특징으로 하는 트랙장비.The gas ejector (10) has a plurality of gas ejection openings (11) formed at its lower end, the diameter (rl) of the track equipment, characterized in that configured to be larger than the diameter (r2) of the wafer. 제 1 또는 제 2 항에 있어서,The method according to claim 1 or 2, 상기 다수의 개스분출구(11)는 개스분사시 개스의 흐름방향이 수직방향이 되도록 구성함을 특징으로 하는 트랙장비.The plurality of gas ejection openings (11) is characterized in that the track device characterized in that the flow direction of the gas is configured in the vertical direction during the gas injection. 제 1 항에 있어서,The method of claim 1, 상기 다수의 개스분출구(11)는 개스분사식 개스의 흐름방향이 수직방향을 기준으로 외부로 약 45°이하의 기울기를 갖도록 구성함을 특징으로 하는 트랙장비.The plurality of gas ejection openings (11) is characterized in that the flow direction of the gas injection gas is configured to have a slope of less than about 45 ° to the outside based on the vertical direction.
KR92010719U 1992-06-16 1992-06-16 Track equipment KR960000310Y1 (en)

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KR92010719U KR960000310Y1 (en) 1992-06-16 1992-06-16 Track equipment

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KR92010719U KR960000310Y1 (en) 1992-06-16 1992-06-16 Track equipment

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KR960000310Y1 true KR960000310Y1 (en) 1996-01-05

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