KR950034723A - Electronic component and manufacturing method - Google Patents

Electronic component and manufacturing method Download PDF

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Publication number
KR950034723A
KR950034723A KR1019950001498A KR19950001498A KR950034723A KR 950034723 A KR950034723 A KR 950034723A KR 1019950001498 A KR1019950001498 A KR 1019950001498A KR 19950001498 A KR19950001498 A KR 19950001498A KR 950034723 A KR950034723 A KR 950034723A
Authority
KR
South Korea
Prior art keywords
electronic component
manufacturing
layer
lead terminal
solder
Prior art date
Application number
KR1019950001498A
Other languages
Korean (ko)
Inventor
껜지 오가와
Original Assignee
사또우 껜이찌로우
롬 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사또우 껜이찌로우, 롬 가부시끼가이샤 filed Critical 사또우 껜이찌로우
Publication of KR950034723A publication Critical patent/KR950034723A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1. 청구범위에 기재된 발명이 속한 기술분야.1. The technical field to which the invention described in the claims belongs.

리드프레임을 사용하여 제조되는 전자부품 및 그 제조방법에 관한 것이다.An electronic component manufactured by using a lead frame and a method of manufacturing the same.

2. 발명이 해결하려고 하는 기술적 과제.2. The technical problem that the invention is trying to solve.

리드단자상의 땜납도금의 박리를 방지함과 동시에, 전류리크등의 품질불량이 일어나기 어려운 전자부품을 제공하는 것이다.The present invention provides an electronic component that prevents peeling of the solder plating on the lead terminal and is less likely to cause poor quality such as current leakage.

3. 발명의 해결방법의 요지.3. Summary of the Solution of the Invention.

수지몰두브(6), 그 수지몰두부(6)으로부터 돌출한 리드단자(1c)와를 구비하여 되는 전자부품에 있어서 상기 리드단자(1c)의 표면을, 하층에 동도금, 상층에 땜납도금으로 피복한 것을 특징으로 하는 전자부품 및 그 제조 방법.In an electronic component comprising a resin mold dove 6 and a lead terminal 1c protruding from the resin mold dove 6, the surface of the lead terminal 1c is coated with copper plating on the lower layer and solder plating on the upper layer. An electronic component and its manufacturing method characterized by the above-mentioned.

4. 발명의 중요한 용도.4. Important uses of the invention.

동도금층이 리드단자의 산화를 방지함과 동시에, 땜납층과의 밀착력을 높여서, 땜납도금의 박리를 방지할 수 있다.The copper plating layer prevents oxidation of the lead terminals and at the same time enhances adhesion to the solder layer, thereby preventing peeling of the solder plating.

Description

전자부품 및 그 제조방법Electronic component and manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발며으이 전자부품에 사용할 리드프레임을 나타내는 요부 평면도, 제2도는 본 발명의 전자부품에 사용할 리드프레임을 나타내는 X-X선 단면도, 제3도는 본 발명의 전자부품에 사용할 리드프레임의 제조공정을 설명하는 설명도.1 is a plan view of main parts showing a lead frame for use in an electronic component, FIG. 2 is a sectional view taken along line XX showing a lead frame for use in an electronic component of the present invention, and FIG. 3 is a manufacturing process of a lead frame for use in an electronic component of the present invention. Illustrative diagram illustrating the.

Claims (2)

수지몰드부(6)와, 그 수지몰드부(6)로부터 돌출한 리드단자(1c)와를 구비하여 되는 전자부품에 있어서, 상기 리드단자(1c)의 표면을 하층에 동도금, 상층에 땜납도금으로 피복한 것을 특징으로 하는 전자부품.In an electronic component comprising a resin mold part 6 and a lead terminal 1c protruding from the resin mold part 6, the surface of the lead terminal 1c is copper plated in the lower layer and solder plated in the upper layer. The electronic component characterized by the coating. 리드프레임(1)의 아우터리드부B에, 동도금층(2)을 형성하고, 그 동도금층(2)상에, 땜납도금층(5)을 형성한 후에, 상기 리드프레임(1)의 이너리드부A를 수지몰드하여 되는 것을 특징으로 하는 전자부품의 제조방법.After the copper plating layer 2 is formed on the outer portion B of the lead frame 1, and the solder plating layer 5 is formed on the copper plating layer 2, the inner lead portion of the lead frame 1 is formed. A method for producing an electronic part, comprising: molding A with a resin. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950001498A 1994-02-18 1995-01-27 Electronic component and manufacturing method KR950034723A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-20850 1994-02-18
JP6020850A JPH07231060A (en) 1994-02-18 1994-02-18 Electronic part and manufacture thereof

Publications (1)

Publication Number Publication Date
KR950034723A true KR950034723A (en) 1995-12-28

Family

ID=12038576

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950001498A KR950034723A (en) 1994-02-18 1995-01-27 Electronic component and manufacturing method

Country Status (2)

Country Link
JP (1) JPH07231060A (en)
KR (1) KR950034723A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110265376A (en) 2018-03-12 2019-09-20 意法半导体股份有限公司 Lead frame surface finishing
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Also Published As

Publication number Publication date
JPH07231060A (en) 1995-08-29

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