KR950033682A - 프린트 배선 기판의 제조 방법 - Google Patents
프린트 배선 기판의 제조 방법 Download PDFInfo
- Publication number
- KR950033682A KR950033682A KR1019950003635A KR19950003635A KR950033682A KR 950033682 A KR950033682 A KR 950033682A KR 1019950003635 A KR1019950003635 A KR 1019950003635A KR 19950003635 A KR19950003635 A KR 19950003635A KR 950033682 A KR950033682 A KR 950033682A
- Authority
- KR
- South Korea
- Prior art keywords
- carbon atoms
- resin composition
- photosensitive resin
- general formula
- group
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract 3
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract 10
- 239000002184 metal Substances 0.000 claims abstract 8
- 229910052751 metal Inorganic materials 0.000 claims abstract 8
- 229920000642 polymer Polymers 0.000 claims abstract 7
- 239000011342 resin composition Substances 0.000 claims abstract 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract 6
- 238000007747 plating Methods 0.000 claims abstract 5
- 150000002894 organic compounds Chemical class 0.000 claims abstract 3
- 125000003545 alkoxy group Chemical group 0.000 claims abstract 2
- 125000004181 carboxyalkyl group Chemical group 0.000 claims abstract 2
- 238000006116 polymerization reaction Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/155—Nonresinous additive to promote interlayer adhesion in element
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
적어도 하기 일반식(1)
(상기 식 중, R1은 H, 1 내지 9개의 탄소 원자를 갖는 알킬기, 1 내지 9개의 탄소 원자를 갖는 알콕시기 및 1 내지 9개의 탄소 원자를 갖는 카르복시알킬기 중의 하나이고, R2는 0 내지 9개의 탄소 원자를 갖는 알킬기이고, n은 반복 단위의 중합수임)로 표시되는 반복 단위로 구성된 1개 이상의 직쇄 고분자 중합체 및 하기 일반식(2)
(상기 식 중, R3은 H, 또는 1 내지 6개의 탄소 원자를 갖는 알킬기이고, X는 NH 또는 S이고, Z는 N 또는 C-Y이고, Y는 H, MH2또는 SH 중의 하나임)로 표시되는 유기 화합물로 이루어지는 감광성 수지 조성물층으로 이루어진 네가티브 패턴을 플레이팅 레지스트로서 사용하는 화학 금속 플레이팅에 의해 배선 패턴을 형성하는 프린트 배선 기판의 제조 방법.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예 1에 나타낸 세미-애디티브 방법에 의한 배선 형성 방법을 나타내는 플로우 챠트.
Claims (5)
- 금속 피복 및 절연 기판으로 이루어진 금속 피복 적층판의 표면에 감광성 수지 조성물 층을 형성하는 단계, 노출 및 현상에 의해 상기 감광성 수지 조성물 층의 네가티브 패턴을 형성하는 단계, 및 상기 감광성 수지 조성물 층의 상기 네카티브 패턴을 플레이팅 레지스트로서 사용하는 화학 금속 플레이팅에 의해 배선 패턴을 형성하는 단계로 이루어지며, 상기 감광성 수지 조성물이 적어도 하기 일반식(1)(상기 식 중, R1은 H, 1 내지 9개의 탄소 원자를 갖는 알킬기, 1 내지 9개의 탄소 원자를 갖는 알콕시기 및 1 내지 9개의 탄소 원자를 갖는 카르복시알킬기 중의 하나이고, R2는 0 내지 9개의 탄소 원자를 갖는 알킬기이고, n은 반복 단위의 중합수임)로 표시되는 반복 단위로 구성된 직쇄 고분자 중합체 및 하기 일반식(2)(상기 식 중, R3은 H 또는 1 내지 6개의 탄소 원자를 갖는 알킬기이고, X는 NH 또는 S이고, Z는 N 또는 C-Y이고, Y는 H, NH2또는 SH 중의 하나임)로 표시되는 유기 화합물로 이루어지 것을 특징으로 하는 프린트 배선 기판의 제조 방법.
- 제1항에 있어서, 상기 금속 피복이 Au, Ag, Cu, Ni, Cr, Ti, Sn, Pb 및 그의 합금으로 이루어진 군으로부터 선택된 임의의 금속으로 이루어지는 방법.
- 제1항 또는 제2항에 있어서, 상기 화학 금속 플레이팅이 Au, Ag, Ni, Cr, Ti 및 Zn으로 이루어진 군으로부터 선택된 임의의 금속으로 이루어지는 방법.
- 제1항, 2항 및 3항 중 어느 한 항에 있어서, 상기 감광성 수지 조성물의 총량이 100중량부일 때 그 조성물이 적어도 일반식(1)로 표시되는 반복 단위로 구성된 상기 직쇄 고분자 중합체 1 내지 10 중량부 및 일반식(2)로 표시되는 상기 유기 화합물 0.01 내지 1 중량부를 함유하는 방법.
- 제1항 내지 4항 중 어느 한 항에 있어서, 상기 감광성 수지 조성물이 일반식(2)로 표시되는 상기 유기 화합물 1당량에 대해 일반식(1)로 표시되는 반복 단위로 구성된 상기 직쇄 고분자 중합체를 카르복실기를 기준으로 적어도 20 내지 500 당량 함유하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6027796A JPH07235755A (ja) | 1994-02-25 | 1994-02-25 | プリント配線基板の製法 |
| JP94-27796 | 1994-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR950033682A true KR950033682A (ko) | 1995-12-26 |
Family
ID=12230945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950003635A KR950033682A (ko) | 1994-02-25 | 1995-02-24 | 프린트 배선 기판의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5712080A (ko) |
| EP (1) | EP0669793A3 (ko) |
| JP (1) | JPH07235755A (ko) |
| KR (1) | KR950033682A (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3859182B2 (ja) * | 1997-03-27 | 2006-12-20 | 東京応化工業株式会社 | ネガ型ホトレジスト組成物 |
| JP4308585B2 (ja) * | 2003-06-09 | 2009-08-05 | Ａｚエレクトロニックマテリアルズ株式会社 | 感光性樹脂組成物密着性向上剤及びそれを含有する感光性樹脂組成物 |
| EP2202579A3 (en) | 2004-12-03 | 2010-10-27 | Tokyo Ohka Kogyo Co., Ltd. | Chemically amplified photoresist composition, photoresist laminated product, manufacturing method for photoresist composition, manufacturing method for photoresist pattern, and manufacturing method for connection element |
| JP5052769B2 (ja) * | 2005-07-15 | 2012-10-17 | 株式会社日立製作所 | イオン伝導性側鎖型ポリマー電解質、その前駆体およびリチウム二次電池 |
| KR100782407B1 (ko) * | 2006-10-30 | 2007-12-05 | 삼성전기주식회사 | 회로기판 제조방법 |
| US9105628B1 (en) | 2012-03-29 | 2015-08-11 | Valery Dubin | Through substrate via (TSuV) structures and method of making the same |
| JP6311200B2 (ja) * | 2014-06-26 | 2018-04-18 | 住友電工プリントサーキット株式会社 | プリント配線板、電子部品及びプリント配線板の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3622334A (en) * | 1969-12-31 | 1971-11-23 | Du Pont | Photopolymerizable compositions and elements containing heterocyclic nitrogen-containing compounds |
| ZA757987B (en) * | 1975-12-23 | 1976-12-29 | Dynachem Corp | Adhesion promoters for polymerizable films |
| US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
| JPH0783168B2 (ja) * | 1988-04-13 | 1995-09-06 | 株式会社日立製作所 | プリント板の製造方法 |
| JPH03179356A (ja) * | 1989-05-18 | 1991-08-05 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性樹脂組成物積層体 |
| TW229350B (ko) * | 1992-08-28 | 1994-09-01 | Hitachi Seisakusyo Kk |
-
1994
- 1994-02-25 JP JP6027796A patent/JPH07235755A/ja active Pending
-
1995
- 1995-02-23 EP EP95301193A patent/EP0669793A3/en not_active Withdrawn
- 1995-02-24 KR KR1019950003635A patent/KR950033682A/ko not_active Application Discontinuation
-
1997
- 1997-02-18 US US08/801,421 patent/US5712080A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5712080A (en) | 1998-01-27 |
| EP0669793A2 (en) | 1995-08-30 |
| JPH07235755A (ja) | 1995-09-05 |
| EP0669793A3 (en) | 1996-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |