KR950032402A - 수지성형체의 도전성 개량방법 및 정전도장방법 - Google Patents

수지성형체의 도전성 개량방법 및 정전도장방법 Download PDF

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Publication number
KR950032402A
KR950032402A KR1019950006807A KR19950006807A KR950032402A KR 950032402 A KR950032402 A KR 950032402A KR 1019950006807 A KR1019950006807 A KR 1019950006807A KR 19950006807 A KR19950006807 A KR 19950006807A KR 950032402 A KR950032402 A KR 950032402A
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South Korea
Prior art keywords
resin
resin molded
carbon atoms
alkyl group
nitrogen
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KR1019950006807A
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English (en)
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KR0155455B1 (ko
Inventor
테츠오 시라이와
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핫토리 쇼이치
다이이치고교 세이야쿠 가부시키가이샤
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Priority claimed from JP6060801A external-priority patent/JPH07268124A/ja
Priority claimed from JP6062228A external-priority patent/JPH07265788A/ja
Application filed by 핫토리 쇼이치, 다이이치고교 세이야쿠 가부시키가이샤 filed Critical 핫토리 쇼이치
Publication of KR950032402A publication Critical patent/KR950032402A/ko
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Publication of KR0155455B1 publication Critical patent/KR0155455B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
    • B05D1/045—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field on non-conductive substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • B05D3/144—Pretreatment of polymeric substrates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)

Abstract

본 발명은 수지성형체의 도전성 개량방법에 관한 것으로서, 수지성형체 원료에 하기 일반식(1)으로 나타낸 질소함유 화합물을 넣고 그 혼연물을 성형해서 얻어진 성형체의 표면을 코로나 방전처리하고 전하를 가지는 도료를 분무해서 이 성형체에 부착하는 수지성형체의 도전성을 개량하며,
(1)
(식중 R1은 탄소수 6∼22의 알킬기이고 R2및 R3는 각각 탄소수 1∼4의 알킬기이며, 양자는 상호 동일하거나 다르더라도 좋다. n은 2∼3을 나타낸다) 도전성이 낮은 수지를 사용해서 그 수지의 물성 및 색상을 실질적으로 저해하지 않고 현저하게 도전성을 개량한 수지성형체를 우수한 생산성으로 얻을수 있고 또는 표면저항값이 높은 수지에 대해 수지물성을 실질적으로 저해하지 않고 도착효율, 표면외관, 생상성 등에 우수한 정전도장이 가능한 것을 특징으로 한다.

Description

수지성형체의 도전성 개량방법 및 정전도장방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 수지성형체원료에 하기 일반식(1)으로 나타낸 질소함유 화합물을 넣고 그 혼연물을 성형하여 얻어진 성형체의 표면을 코로나 방전처리하는 것을 특징으로 하는 수지성형체의 도전성 개량방법.
    (1)
    (상기식에서 R1은 탄소수 6∼22의 알킬기이고 R2및 R3는 각각 탄소수 1∼4의 알킬기이며, 양자는 상호 동일 하거나 다르더라도 좋다. n은 2∼3을 나타낸다.)
  2. 제1항에 있어서, 상기 일반식(1)으로 나타낸 질소함유 화합물의 사용량이 수지성형체 원료 100중량부에 대해 0.01∼10중량부인 것을 특징으로 하는 수지성형체의 도전성 개량방법.
  3. 수지성형체 원료에, 하기 일반식(1)으로 나타내는 질소함유 화합물을 넣고 그 혼연물을 성형해서 얻어진 성형체의 표면을 코로나 방전처리한 후 전하를 가지는 도료를 분무해서 상기 성형체에 부착시키는 것을 특징으로 하는 수지성형체의 정전도장방법.
    (1)
    (상기식에서 R1은 탄소수 6∼22의 알킬기이고 R2및 R3는 각각 탄소수 1∼4의 알킬기이며, 양자는 상호 동일 하거나 다르더라도 좋다. n은 2∼3을 나타낸다.)
  4. 제3항에 있어서, 상기 일반식(1)으로 나타낸 질소함유 화합물의 사용량이 수지성형체 원료 100중량부에 대해 0.01∼10중량부인 것을 특징으로 하는 수지성형체의 정전도장방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950006807A 1994-03-30 1995-03-29 수지성형체의 도전성 개량방법 및 정전도장방법 KR0155455B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP94-60801 1994-03-30
JP6060801A JPH07268124A (ja) 1994-03-30 1994-03-30 樹脂成形体の導電性改良方法
JP94-62228 1994-03-31
JP6062228A JPH07265788A (ja) 1994-03-31 1994-03-31 樹脂成形体の静電塗装方法

Publications (2)

Publication Number Publication Date
KR950032402A true KR950032402A (ko) 1995-12-20
KR0155455B1 KR0155455B1 (ko) 1998-12-01

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KR1019950006807A KR0155455B1 (ko) 1994-03-30 1995-03-29 수지성형체의 도전성 개량방법 및 정전도장방법

Country Status (4)

Country Link
US (1) US5571472A (ko)
EP (1) EP0675505B1 (ko)
KR (1) KR0155455B1 (ko)
DE (1) DE69502983T2 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08253606A (ja) * 1995-03-15 1996-10-01 Dai Ichi Kogyo Seiyaku Co Ltd 樹脂成形体の導電性改良方法および静電塗装方法
US5858472A (en) * 1995-09-25 1999-01-12 Nippon Paint Co., Ltd. Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition
JP4155677B2 (ja) * 1998-09-08 2008-09-24 株式会社リコー 中間転写ベルト、その製造方法及び画像形成装置
US7049362B2 (en) * 1998-12-28 2006-05-23 Osaka Gas Co.,Ltd. Resin molded product
US7897087B2 (en) * 2004-05-05 2011-03-01 Naughton David B Method of manufacturing a molded article
FR2872068B1 (fr) 2004-06-28 2006-10-27 Centre Nat Rech Scient Cnrse Procede et dispositif pour le depot de couches minces par pulverisation electrohydrodynamique, notamment en post-decharge
US8758860B1 (en) 2012-11-07 2014-06-24 Bayer Materialscience Llc Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior

Family Cites Families (13)

* Cited by examiner, † Cited by third party
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US3478387A (en) * 1965-10-21 1969-11-18 Continental Can Co Apparatus for electrostatic molding
JPS5066538A (ko) * 1973-10-16 1975-06-04
US3930061A (en) * 1974-04-08 1975-12-30 Ransburg Corp Electrostatic method for forming structures and articles
JPS56830A (en) * 1979-06-18 1981-01-07 Shin Etsu Chem Co Ltd Surface treatment of acrylic resin molded product
JPS5721433A (en) * 1980-07-15 1982-02-04 Tokuyama Soda Co Ltd Polypropylene film
US4664856A (en) * 1984-12-27 1987-05-12 Morrison-Knudsen Forest Products, Inc. Method of treating materials to improve their conductance for use in the manufacture of directionally aligned materials
JPS61155451A (ja) * 1984-12-28 1986-07-15 Ube Ind Ltd 導電性樹脂組成物
JPS61218649A (ja) * 1985-03-25 1986-09-29 Mitsui Petrochem Ind Ltd ポリエチレン系組成物及び該組成物から成る低滑性、低粘着性のフイルム
JPH03101874A (ja) * 1989-09-13 1991-04-26 Kanto Auto Works Ltd 樹脂成形体の導電性改良方法
JPH03101875A (ja) * 1989-09-13 1991-04-26 Kanto Auto Works Ltd 樹脂成形体の静電塗装方法
US5188783A (en) * 1990-02-20 1993-02-23 Hughes Aircraft Company Method of making articles containing an ion-conductive polymer
US5206273A (en) * 1991-11-12 1993-04-27 Witco Corporation Compositions and method for improving the slip of polyolefins and the adhesion of water based inks to polyolefins
US5439628A (en) * 1993-03-22 1995-08-08 Inteplast Corporation Method for manufacturing polypropylene film and sheet

Also Published As

Publication number Publication date
EP0675505A1 (en) 1995-10-04
KR0155455B1 (ko) 1998-12-01
DE69502983D1 (de) 1998-07-23
EP0675505B1 (en) 1998-06-17
US5571472A (en) 1996-11-05
DE69502983T2 (de) 1999-03-18

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