KR950028026A - 와이어본딩방법 및 장치 - Google Patents

와이어본딩방법 및 장치 Download PDF

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Publication number
KR950028026A
KR950028026A KR1019950005053A KR19950005053A KR950028026A KR 950028026 A KR950028026 A KR 950028026A KR 1019950005053 A KR1019950005053 A KR 1019950005053A KR 19950005053 A KR19950005053 A KR 19950005053A KR 950028026 A KR950028026 A KR 950028026A
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KR
South Korea
Prior art keywords
wire
tip
electrode
wire bonding
ball
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KR1019950005053A
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English (en)
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KR0179193B1 (ko
Inventor
고이치 하라다
구니유키 다카하시
이와오 다카하시
Original Assignee
후지야마 겐지
가부시끼가이샤 신가와
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Publication of KR950028026A publication Critical patent/KR950028026A/ko
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Publication of KR0179193B1 publication Critical patent/KR0179193B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

[목적] 방전이 안정되어 볼의 편차감소가 도모되고, 또 가공이 용이하며 비용절감이 도모되는 동시에 장기 수명화가 도모되는 전극을 제공한다.
[구성] 캐필러리(2)에 연이어 통해진 와이어(1) 선단과 전극(10)사이에 고전압을 인가하여 방전시키고, 와이어(1) 선단에 볼을 형성하는 와이어 본딩장치에 있어서, 전극(10)은 환봉의 선단부를 수직으로 후방에서 비스듬히 절단한 절단면(11)을 형성하여 선단면에 반원형상을 남기고, 이 반원형상의 윗면부분의 에지부(12)를 방전부로 하였다.

Description

와이어본딩방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명으로 이루어지는 외어어본딩장치의 1실시예를 예시하는 개략적 구성사시도.

Claims (8)

  1. 와이어의 선단과 전극사이에 고전압을 인가하여 방전시키고, 와이어선단에 볼을 형성하는 와이어본딩방법에 있어서, 선단부가 반원형상의 전극에지부를 윗면으로 하고, 에지부의 선단부분으로부터 와이어에 방전함으로써 볼을 형성하는 것을 특징으로 하는 와이어 본딩방법.
  2. 와이어의 선단과 전극사이에 고전압을 인가하여 방전시키고, 와이어선단에 볼을 형성하는 와이어본딩방법에 있어서, 선단부의 윗면이 각형상의 전극에지부의 선단부분으로부터 와이어에 방전함으로써 볼을 형성하는 것을 특징으로 하는 와이어 본딩방법.
  3. 와이어의 선단과 전극사이에 고전압을 인가하여 방전시키고, 와이어선단에 볼을 형성하는 와이어본딩장치에 있어서, 상기 전극은 환봉의 선단부를 수직으로 후방에서 비스듬히 절단하여 선단면에 반원형상을 남기고, 이 반원형상 윗면의 에지부의 선단부분을 방전부로한 것을 특징으로 하는 와이어 본딩방법.
  4. 와이어의 선단과 전극사이에 고전압을 인가하여 방전시키고, 와이어선단에 볼을 형성하는 와이어본딩장치에 있어서, 상기 전극은 적어도 선단부의 윗면이 각형상으로 형성되며, 이 각형상의 에지부를 방전부로한 것을 특징으로 하는 와이어 본딩방법.
  5. 와이어의 선단과 전극사이에 고전압을 인가하여 방전시키고, 와이어선단에 볼을 형성하는 와이어본딩장치에 있어서, 상기 전극은 환봉의 선단부를 수직으로 후방에서 비스듬히 절단하여 선단면에 반원형상을 남기고, 이 반원형상 윗면의 에지부의 선단부분을 방전부로하고, 상기 에지부의 방전부를 개구하여 내열성 또한 절연성의 커버로 주위를 피복한 것을 특징으로 하는 와이어 본딩방법.
  6. 와이어의 선단과 전극사이에 고전압을 인가하여 방전시키고, 와이어선단에 볼을 형성하는 와이어본딩장치에 있어서, 상기 전극은 적어도 선단부의 윗면이 각형상으로 형성되며, 이 각형상의 에지부를 방전부로하며 상기 에지부의 방전부를 개구하여 내열성 또한 절연성의 커버로 주위를 피복한 것을 특징으로 하는 와이어 본딩방법.
  7. 제2항, 제4항 또는 제6항에 있어서, 상기 전극의 각형상의 에지부는 다각형상에 의해 형성되어 있는 것을 특징으로 하는 와이어 본딩장치.
  8. 제5항, 제6항 있어서, 상기 커버는 세라믹으로 이루어지는 것을 특징으로 하는 와이어 본딩방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950005053A 1994-03-18 1995-03-11 와이어본딩 방법 및 장치 KR0179193B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6072943A JPH07263480A (ja) 1994-03-18 1994-03-18 ワイヤボンデイング方法及び装置
JP94-72943 1994-03-18

Publications (2)

Publication Number Publication Date
KR950028026A true KR950028026A (ko) 1995-10-18
KR0179193B1 KR0179193B1 (ko) 1999-04-15

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KR1019950005053A KR0179193B1 (ko) 1994-03-18 1995-03-11 와이어본딩 방법 및 장치

Country Status (3)

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US (1) US5616257A (ko)
JP (1) JPH07263480A (ko)
KR (1) KR0179193B1 (ko)

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Publication number Priority date Publication date Assignee Title
JP3400269B2 (ja) * 1996-10-17 2003-04-28 株式会社新川 ワイヤボンディングにおけるボール形成装置
JPH10125714A (ja) * 1996-10-17 1998-05-15 Shinkawa Ltd ワイヤボンディングにおけるボール形成方法
US6133540A (en) * 1998-08-03 2000-10-17 International Business Machines Corporation Apparatus and method for producing punch pin with spherical head
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US6354479B1 (en) 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
JP2003163235A (ja) 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
JP3727622B2 (ja) * 2002-09-27 2005-12-14 株式会社新川 ワイヤボンディング装置用放電電極
US7411157B2 (en) * 2003-09-26 2008-08-12 Kulicke And Soffa Industries, Inc. Electronic flame-off electrode with ball-shaped tip
US20050067382A1 (en) * 2003-09-26 2005-03-31 Gary Gillotti Fine pitch electronic flame-off wand electrode
US7495378B2 (en) * 2004-07-15 2009-02-24 Ngk Insulators, Ltd. Dielectric device
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
JP4872663B2 (ja) * 2006-12-28 2012-02-08 株式会社日立製作所 接合用材料及び接合方法
CN101971314B (zh) * 2008-06-10 2013-10-09 库力索法工业公司 用于在引线接合操作中降低氧化的输气系统

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US3950631A (en) * 1970-06-19 1976-04-13 U.S. Philips Corporation Device for welding a wire by means of thermo-compression bonding
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
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JP3027448B2 (ja) * 1991-10-04 2000-04-04 株式会社リコー ワイヤボンディング装置

Also Published As

Publication number Publication date
US5616257A (en) 1997-04-01
JPH07263480A (ja) 1995-10-13
KR0179193B1 (ko) 1999-04-15

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