KR950021322A - Measuring method of micro contact hole in semiconductor small intestine - Google Patents
Measuring method of micro contact hole in semiconductor small intestine Download PDFInfo
- Publication number
- KR950021322A KR950021322A KR1019930031898A KR930031898A KR950021322A KR 950021322 A KR950021322 A KR 950021322A KR 1019930031898 A KR1019930031898 A KR 1019930031898A KR 930031898 A KR930031898 A KR 930031898A KR 950021322 A KR950021322 A KR 950021322A
- Authority
- KR
- South Korea
- Prior art keywords
- contact hole
- measuring
- small intestine
- micro contact
- measuring method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
본 발명은 반도체 소자의 미세 콘택홀 측정방법에 관한 것으로, 절연막의 상부, 즉 감광막의 하부에 전기 전도도가 비교적 큰 도전체막을 일정두께 적층하여 전기 전도도가 높은 도전체막으로 인하여 대전을 유발하는 축적 전자가 콘택홀 외부로 빠져 나가게하여 정학한 콘택홀의 크기를 측정할 수 있는 기술이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring a fine contact hole in a semiconductor device, wherein a conductive film having a relatively high electrical conductivity is laminated to a predetermined thickness on an upper portion of an insulating film, i. It is a technology that can measure the size of the contact hole by allowing the exit out of the contact hole.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3A도 내지 제3C도는 본 발명의 미세콘택홀 형성공정을 도시한 단면도.3A to 3C are cross-sectional views showing a process for forming a micro contact hole of the present invention.
제4도는 본 발명의 미세콘택홀 형성을 위한 패턴 공정시 전자선을 이용한 콘택홀 크기 측정 모형도.4 is a contact hole size measurement model diagram using an electron beam during the pattern process for forming a micro contact hole of the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930031898A KR970010669B1 (en) | 1993-12-31 | 1993-12-31 | Measurment method of contact hole of a semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930031898A KR970010669B1 (en) | 1993-12-31 | 1993-12-31 | Measurment method of contact hole of a semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950021322A true KR950021322A (en) | 1995-07-26 |
KR970010669B1 KR970010669B1 (en) | 1997-06-30 |
Family
ID=19374813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930031898A KR970010669B1 (en) | 1993-12-31 | 1993-12-31 | Measurment method of contact hole of a semiconductor |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970010669B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100355772B1 (en) * | 1999-12-31 | 2002-10-19 | 아남반도체 주식회사 | Method for measuring a hole pattern in a scanning electronic microscope |
KR100807082B1 (en) * | 2001-12-29 | 2008-02-25 | 주식회사 하이닉스반도체 | Method of forming a contact in a semiconductor device |
-
1993
- 1993-12-31 KR KR1019930031898A patent/KR970010669B1/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100355772B1 (en) * | 1999-12-31 | 2002-10-19 | 아남반도체 주식회사 | Method for measuring a hole pattern in a scanning electronic microscope |
KR100807082B1 (en) * | 2001-12-29 | 2008-02-25 | 주식회사 하이닉스반도체 | Method of forming a contact in a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR970010669B1 (en) | 1997-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR950030242A (en) | Semiconductor device and manufacturing method | |
KR950034678A (en) | A method for forming a conductive connection in an integrated circuit and a conductive member in the circuit | |
KR910002010A (en) | Semiconductor device manufacturing method | |
KR880013239A (en) | Connection hole formation method of semiconductor device | |
KR940016513A (en) | Low resistance contact formation method of semiconductor device | |
KR920017184A (en) | Manufacturing Method of Semiconductor Device | |
KR970072325A (en) | Semiconductor device and manufacturing method thereof | |
KR950021322A (en) | Measuring method of micro contact hole in semiconductor small intestine | |
KR970064329A (en) | Circuit board and its formation method | |
KR900019179A (en) | Substrates used for forming thick film circuits | |
KR910003784A (en) | Semiconductor device | |
KR870008416A (en) | Interlevel connection method of VLSI and its structure | |
KR970017961A (en) | Semiconductor integrated circuit device and manufacturing method thereof | |
KR930024103A (en) | Manufacturing Method of Semiconductor Device | |
KR910013526A (en) | How to Form Contact Holes for Wiring | |
KR960015733A (en) | Method for forming metal wiring contact portion of semiconductor device and its structure | |
KR970052298A (en) | Via contact formation method of semiconductor device | |
KR940006229A (en) | TAB tape and manufacturing method | |
KR970003832A (en) | Metal wiring method using the electroplating method and its wiring apparatus | |
KR900005563A (en) | Manufacturing Method of Semiconductor Device | |
KR930003290A (en) | Metal contact formation method and structure | |
KR970052836A (en) | Semiconductor device with dummy wiring and manufacturing method thereof | |
KR970054004A (en) | Bit line formation method of semiconductor device | |
JPS57181143A (en) | Manufacture of semiconductor device | |
KR970053285A (en) | Metal wiring method of semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20090922 Year of fee payment: 13 |
|
LAPS | Lapse due to unpaid annual fee |