KR950018249A - Epoxy Resin Compositions for Semiconductor Device Encapsulation - Google Patents

Epoxy Resin Compositions for Semiconductor Device Encapsulation Download PDF

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Publication number
KR950018249A
KR950018249A KR1019930030127A KR930030127A KR950018249A KR 950018249 A KR950018249 A KR 950018249A KR 1019930030127 A KR1019930030127 A KR 1019930030127A KR 930030127 A KR930030127 A KR 930030127A KR 950018249 A KR950018249 A KR 950018249A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
epoxy
semiconductor device
weight
Prior art date
Application number
KR1019930030127A
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Korean (ko)
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KR0130542B1 (en
Inventor
이희우
양이욱
유금원
Original Assignee
유현식
제일모직 주식회사
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Priority to KR1019930030127A priority Critical patent/KR0130542B1/en
Publication of KR950018249A publication Critical patent/KR950018249A/en
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Publication of KR0130542B1 publication Critical patent/KR0130542B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 반도체 소자 봉지용 에폭시 수지 조성물에 관한 것이다.The present invention relates to an epoxy resin composition for sealing semiconductor elements.

본 발명은 내열성, 접착성 및 내습성을 동시에 개선함으로 봉지재의 고내열, 고접착 및 고내습화를 달성하여 패케이지 크랙 발생이 감소된 반도체소자 봉지용 에폭시 수지 조성물의 제공을 목적으로 한다.An object of the present invention is to provide an epoxy resin composition for encapsulating a semiconductor device in which package cracks are reduced by achieving high heat resistance, high adhesion, and high moisture resistance of an encapsulant by simultaneously improving heat resistance, adhesion, and moisture resistance.

본 발명은 에폭시 수지, 페놀릭수지, 무기충전재, 경화촉진제 및 기타 첨가제로 구성되는 에폭시 수지 조성물에 있어서, 에폭시 수지를 하기 구조식(I) 내지 (VI)을 일정비율로 조합, 전처리후 사용하는 것을 특징으로 한다.The present invention relates to an epoxy resin composition composed of an epoxy resin, a phenolic resin, an inorganic filler, a curing accelerator, and other additives, wherein the epoxy resin is used after a combination of the following structural formulas (I) to (VI) in a predetermined ratio and pretreatment. It features.

Description

반도체 소자 봉지용 에폭시 수지조성물Epoxy Resin Compositions for Semiconductor Device Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (4)

에폭시 수지, 페놀릭수지, 무기충전재, 경화촉진제 및 기타 첨가제로 구성되는 에폭시 수지조성물에 있어서, 에폭시 수지를 하기 구조식(I) 내지 (VI)을 일정비율로 조합, 전처리후 사용하는 것을 특징으로 하는 반도체 소자 봉지용 에폭시수지 조성물.In the epoxy resin composition composed of an epoxy resin, a phenolic resin, an inorganic filler, a curing accelerator, and other additives, the epoxy resin is used after combining the following structural formulas (I) to (VI) at a predetermined ratio and pretreatment. Epoxy resin composition for sealing semiconductor elements. 제1항에 있어서, 에폭시 수지는 액상 에폭시 (IV) 또는 (V) 또는 (VI)이 나프톨 에폭시 (I) 또는 (II) 또는 (III)에 대하여 10~30중량%로 전처리화한 에폭시 수지로 8~15중량% 사용한 것을 특징으로 하는 반도체 소자 봉지용 에폭시 수지 조성물.The epoxy resin according to claim 1, wherein the epoxy resin is an epoxy resin in which the liquid epoxy (IV) or (V) or (VI) is pretreated at 10 to 30% by weight relative to the naphthol epoxy (I) or (II) or (III). Epoxy resin composition for semiconductor element sealing characterized by using 8-15 weight%. 제1항에 있어서, 페놀릭 수지는 구조식(VII)과 같은 구조를 가지는 화합물로 5~10중량% 사용한 것을 특징으로 하는 반도체 소자 봉지용 에폭시 수지 조성물.The epoxy resin composition for semiconductor element encapsulation according to claim 1, wherein the phenolic resin is used in a compound having a structure similar to that of the formula (VII). 제1항에 있어서, 무기충전제는 고순도 용융 실리카로서 이의 사용량에 대하여 구상형의 적용비율이 10~50중량%이며, 이를 75~85중량% 사용한 것을 특징으로 하는 반도체 소자 봉지용 에폭시 수지 조성물.The method of claim 1, wherein the inorganic filler is a high-purity fused silica, the spherical application ratio of 10 to 50% by weight based on the amount of its use, the epoxy resin composition for semiconductor element encapsulation, characterized in that 75 to 85% by weight was used. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930030127A 1993-12-28 1993-12-28 Epoxy resin composition for semiconductor encapsulation KR0130542B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930030127A KR0130542B1 (en) 1993-12-28 1993-12-28 Epoxy resin composition for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930030127A KR0130542B1 (en) 1993-12-28 1993-12-28 Epoxy resin composition for semiconductor encapsulation

Publications (2)

Publication Number Publication Date
KR950018249A true KR950018249A (en) 1995-07-22
KR0130542B1 KR0130542B1 (en) 1998-04-07

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KR1019930030127A KR0130542B1 (en) 1993-12-28 1993-12-28 Epoxy resin composition for semiconductor encapsulation

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100617287B1 (en) * 2001-07-17 2006-08-30 신에쓰 가가꾸 고교 가부시끼가이샤 Semiconductor encapsulating epoxy resin composition and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100617287B1 (en) * 2001-07-17 2006-08-30 신에쓰 가가꾸 고교 가부시끼가이샤 Semiconductor encapsulating epoxy resin composition and semiconductor device

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Publication number Publication date
KR0130542B1 (en) 1998-04-07

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