KR950015660U - Probe holding device of probe card for wafer test - Google Patents

Probe holding device of probe card for wafer test

Info

Publication number
KR950015660U
KR950015660U KR2019930024848U KR930024848U KR950015660U KR 950015660 U KR950015660 U KR 950015660U KR 2019930024848 U KR2019930024848 U KR 2019930024848U KR 930024848 U KR930024848 U KR 930024848U KR 950015660 U KR950015660 U KR 950015660U
Authority
KR
South Korea
Prior art keywords
probe
holding device
wafer test
probe card
card
Prior art date
Application number
KR2019930024848U
Other languages
Korean (ko)
Other versions
KR0119772Y1 (en
Inventor
이상희
Original Assignee
금성일렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론주식회사 filed Critical 금성일렉트론주식회사
Priority to KR2019930024848U priority Critical patent/KR0119772Y1/en
Publication of KR950015660U publication Critical patent/KR950015660U/en
Application granted granted Critical
Publication of KR0119772Y1 publication Critical patent/KR0119772Y1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
KR2019930024848U 1993-11-24 1993-11-24 Tip fixing apparatus of prober card KR0119772Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930024848U KR0119772Y1 (en) 1993-11-24 1993-11-24 Tip fixing apparatus of prober card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930024848U KR0119772Y1 (en) 1993-11-24 1993-11-24 Tip fixing apparatus of prober card

Publications (2)

Publication Number Publication Date
KR950015660U true KR950015660U (en) 1995-06-19
KR0119772Y1 KR0119772Y1 (en) 1998-08-01

Family

ID=19368600

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930024848U KR0119772Y1 (en) 1993-11-24 1993-11-24 Tip fixing apparatus of prober card

Country Status (1)

Country Link
KR (1) KR0119772Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100246320B1 (en) * 1996-12-18 2000-03-15 김영환 Probe card for testing wafer
KR100791895B1 (en) * 2006-05-26 2008-01-07 (주)엠투엔 Probe of a probe card

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100246320B1 (en) * 1996-12-18 2000-03-15 김영환 Probe card for testing wafer
KR100791895B1 (en) * 2006-05-26 2008-01-07 (주)엠투엔 Probe of a probe card

Also Published As

Publication number Publication date
KR0119772Y1 (en) 1998-08-01

Similar Documents

Publication Publication Date Title
KR940008674U (en) Burn-in test device for semiconductor memory
DE69604810D1 (en) SEMICONDUCTOR WAFER TEST AND BURN-IN
DE69115776D1 (en) TEST DEVICE FOR INTEGRATED CIRCUITS
KR970705033A (en) Memory Bad Interpretation Device of Semiconductor Memory Test Apparatus
DE69605757D1 (en) IC test device
KR950015660U (en) Probe holding device of probe card for wafer test
DE69430036D1 (en) Test device for integrated circuits
KR960025391U (en) Probe card for semiconductor wafer testing
KR950021433U (en) Probe Card for Wafer Test
KR950021436U (en) Probe card for wafer testing
KR960025392U (en) Probe Cards for Wafer Testing
KR950021440U (en) Probe card device for semiconductor device measurement
KR940021356U (en) Connecting device for connection of probe card of test system
KR970046795U (en) Double sided probe card for wafer testing
KR970046797U (en) Probe card of semiconductor inspection device
KR970046814U (en) Semiconductor test probe card device
KR920003412U (en) D-board for semiconductor device test
KR960012671U (en) Wafer inspection device that measures probe card characteristics
KR950021437U (en) Probe tip height adjustment device for semiconductor wafer test
KR940023575U (en) Device transfer device of tester handler
KR940004345U (en) Probe flatness inspection device
KR910020706U (en) IC tester simple test device
KR970046792U (en) Pogo pin for connecting the probe card of the semiconductor memory tester
KR980005411U (en) Probe Cards for Wafer Testing
BR8702006A (en) PORTABLE TEST DEVICE FOR TRANSFORMERS AND HIGH VOLTAGE LINES

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
J2X1 Appeal (before the patent court)

Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL

B701 Decision to grant
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080222

Year of fee payment: 11

EXPY Expiration of term