KR950010724A

KR950010724A - Assemblies for Tab Package Soldering

Info

Publication number: KR950010724A
Application number: KR1019930017983A
Authority: KR
Inventors: 손정하
Original assignee: 김광호; 삼성전자 주식회사
Priority date: 1993-09-08
Filing date: 1993-09-08
Publication date: 1995-04-28

Abstract

이 발명은 베이스 필름 상부에 실장된 TAB 집적회로를 인쇄회로 기판상에 실장하여 전기적으로 연결하기 위한 탭 패키지 솔더링용 조립체에 관한 것으로서, LCD판넬(20)에 장착된 탭 패키지(30)는 상부 글래스(21)와 하부 글래스(22)를 가지며 이 하부 글래스(22) 상부에 형성된 투명전극(23)을 구비하는 LCD판넬(20)과 상기 LCD판넬(20)과 갭 영역(40)을 사이에 두고 수평으로 배치되어 있는 PCB(35)와 상기 PCB(35)의 상부에 형성된 PCB 적층부재(38)와 베이스 필름(50)하부에 마련된 인너 리드부(24)의 범프(32)에 탭 IC(31)를 실장하여 접착시킨후 상기 탭IC(31)를 각각 봉지하고 있는 상부 봉지부(33) 및 하부 봉지부(34)를 각각 구비한다. 따라서 상기 탭 패키지(30)의 인너리드부(24)와 인쇄회로기판(35)이 전기적으로 연결되도록 오목형상의 인쇄회로기판적층부재(38)로 접착시켜서 베이스 필름(50)에 일정한 장력을 주어 탭 솔더링이 용이하도록 한 탭 패키지 솔더링용 조립체를 얻을 수 있다.The present invention relates to a tab package soldering assembly for mounting and electrically connecting a TAB integrated circuit mounted on a base film on a printed circuit board, wherein the tab package 30 mounted on the LCD panel 20 has an upper glass. LCD panel 20 having a transparent glass 23 formed on top of the lower glass 22, and having the LCD panel 20 and the gap region 40 interposed therebetween. The tab IC 31 is formed on the bumps 32 of the PCB 35 disposed horizontally, the PCB stacking member 38 formed on the PCB 35, and the inner lead portion 24 provided below the base film 50. ) And each of the upper and lower encapsulation portions 33 and 34 encapsulating the tab IC 31, respectively. Therefore, the inner lead portion 24 of the tab package 30 and the printed circuit board 35 are bonded to each other by a concave-shaped printed circuit board laminated member 38 so as to be electrically connected to the base film 50. An assembly for tap package soldering can be obtained to facilitate tap soldering.

Description

Assemblies for Tab Package Soldering

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래의 탭 패키지의 평면도.1 is a plan view of a conventional tab package.

제2도는 종래의 탭 패키지 솔더링용 조립체의 단면도.2 is a cross-sectional view of a conventional assembly for tab package soldering.

제3도는 이 발명에 따른 탭 패키지 솔더링용 조립체의 단면도이다.3 is a cross-sectional view of an assembly for tab package soldering according to the present invention.

Claims

A liquid crystal display panel having an upper glass and a lower glass and having a transparent electrode formed on the lower glass, and a printed circuit board horizontally disposed with the gap region between the liquid crystal display panel and the upper portion of the printed circuit board After mounting and bonding the tab integrated circuit to the inner surface of the tab soldering pad formed on the bottom of the tape and the tab soldering pad formed on the tape, the upper encapsulation portion and the lower encapsulation portion encapsulating the tab integrated circuit are respectively provided. In the tab package mounted to the panel; The inner lead portion of the tab package and the printed circuit board is bonded by a concave-shaped printed circuit board laminated member to be electrically connected to give a constant tension to the base film to facilitate tab soldering Assembly for soldering tab packages.

The assembly for tab package soldering as claimed in claim 1, wherein the lamination member is any one of lamination members of a flat plate shape and a concave shape.

3. The assembly of claim 2 wherein the stacking member serves as a tab soldering pad and is a conductor.

※ Note: The disclosure is based on the initial application.