JPH08186154A - Film carrier and semiconductor device - Google Patents

Abstract

PURPOSE: To attain miniaturization of a TAB package type semiconductor device, lessening of a packaging area, improvement of operability and productivity in manufacture of the device and reduction of the cost of manufacture. CONSTITUTION: A film carrier 1 which is constituted of a continuous flexible tape having a device hole 3, a large number of inner leads 6 projecting inward from the peripheral edge of the hole and a large number of metal wirings 5 extending from the inner leads and wherein the device hole is formed so that the dimensions thereof are smaller than the external shape of a semiconductor component 2 and that the peripheral edge thereof is positioned inside the peripheral edge of the semiconductor component. In a semiconductor device of a TAB package type manufactured by connecting the semiconductor component to this film carrier, bumps are provided in a line in the longitudinal direction of the device and protective resin protrudes slightly outside the semiconductor component by a distance being equal to or smaller than a gap between the semiconductor component and the film carrier.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB (Tape Automated Bonding) technique for mounting semiconductor components such as ICs and LSIs and other electronic components on a film carrier, and particularly to a film for mounting the electronic components. The present invention relates to a carrier and a semiconductor device packaged with electronic components mounted thereon.

[0002]

2. Description of the Related Art In recent liquid crystal display devices, in order to connect a drive circuit to an LCD cell, a TAB method using a so-called TAB package in which a drive IC is mounted, or a drive IC is directly connected to a glass substrate. COG (chip on glass
s) method is generally adopted. In particular, the TAB package is smaller and thinner than other packages,
Since it is suitable for high-density mounting, has an advantage that it can be electrically inspected on a film carrier tape, and can be mounted by bending, it is used not only in liquid crystal display devices but also in various electronic devices.

In a conventional TAB package, as shown in FIG. 9, a device hole 33 having a size larger than that of an IC chip 32 mounted on a film carrier 31 made of polyimide or the like is provided, and an inner hole protruding into the device hole is provided. In order to connect the leads 34 to the electrodes of the chip via the bumps 35, prevent crosstalk between the inner leads and contact between the inner leads and the IC chip, and improve reliability, a protective resin 36 is used. The surfaces of the inner leads 4 and the IC chip 2 are covered. The electrodes or bumps are typically arranged along the periphery of the IC chip to minimize the length of the cantilevered inner leads. Further, in order to mount a particularly large-sized semiconductor element having a large number of electrodes, a film carrier is provided with a lead support portion extending into a device hole, as disclosed in, for example, JP-A-63-95639. A structure in which some leads are extended on top of that is known.

[0004]

However, in the above-mentioned conventional TAB package, there is a gap between the inner periphery of the device hole and the peripheral edge of the IC chip, and the inner lead in this region is not exposed, so that the protective resin is used. Therefore, the external dimensions of the package are considerably larger than the dimensions of the IC chip to be mounted, and the mounting area is increased. The wiring pattern supported on the film carrier is
The semiconductor components to be connected are miniaturized and the pitches of their electrodes and leads are made finer, resulting in a longer wiring distance and a large area for routing. For this reason,
There has been a problem that the area of the film carrier used to mount one IC chip is increased, the size of the entire package is further increased, the mounting area is increased, and it is against the demand for downsizing of electronic devices. .

Particularly in the case of a liquid crystal display device, as shown in FIG. 10, a plurality of TAB packages 38 each having a driving IC 37 mounted thereon are connected along the outer periphery of an LCD cell 39, and a driving circuit is further provided outside thereof. Is connected to the printed circuit board 40. In order to increase the display area with respect to the size of the entire device, it is necessary to reduce the so-called frame portion. In order to reduce the width W of the frame portion, the widths w1 and w2 of the outer peripheral portion 41 of the LCD cell and the printed circuit board 40 to which the TAB package 38 is connected.
It is necessary to reduce the width of the TAB package 8 and reduce the width w3 of the TAB package 8. Therefore, first, the width of the driving IC is designed to be small and the width is as narrow as possible, but there is a limit, and it is difficult to further downsize the TAB package having the above-described conventional structure, and the width W of the frame portion is sufficiently large. There was a problem that it could not be reduced. On the other hand,
In the COG method, the driving I is directly attached to the outer peripheral portion of the LCD cell.
To mount C and form its wiring pattern, TA
It is difficult to make the frame portion smaller than in the case of the B method.

Therefore, the present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide an electronic device for a film carrier used in a TAB package or a module having a plurality of electronic components mounted thereon. The use area of the film carrier for connecting components can be made smaller, and finally the outer dimensions of the entire package can be made smaller than before, so that the mounting area can be reduced and workability in the production of the TAB package can be reduced. It is to improve productivity and reduce manufacturing cost.

Further, it is an object of the present invention to provide a TAB package type semiconductor device which can reduce its outer dimensions to reduce the mounting area and thereby miniaturize electronic equipment. is there. Particularly, it is an object of the present invention to provide a TAB package type semiconductor device capable of substantially enlarging the display area by reducing the frame portion of the liquid crystal display device.

[0008]

The present invention is to achieve the above-mentioned object, and the contents thereof will be described below with reference to the embodiments shown in the drawings.

In the film carrier according to the first aspect, the device hole is opened so as to face the semiconductor component to be mounted, and a large number of inner leads for connecting to the semiconductor component are inwardly projected from the peripheral edge of the device hole. A continuous flexible tape that supports a large number of metal wirings extending from the inner leads, and the device hole is formed so as to be located inside the periphery of the semiconductor component at least at the periphery where the inner leads are projected. It is characterized by being.

According to a second aspect of the film carrier, in addition to the above-mentioned characteristic features of the first aspect, the inner leads are provided so as to project inwardly from the periphery of each device hole in a direction substantially orthogonal to the longitudinal direction of the film carrier. It is characterized by being.

Further, the film carrier according to claim 3,
It is characterized in that the size of the device hole is smaller than the outer shape of the semiconductor component and its position is inside the peripheral edge of the semiconductor component.

A semiconductor device according to a fourth aspect is a substrate made of a flexible film having a large number of metal wirings, device holes, and a large number of inner leads extending from the metal wirings and projecting inward from the periphery of the device holes. And a semiconductor component connected to the inner lead of the substrate through a device hole, and the device hole is formed so as to be located inside the peripheral edge of the semiconductor component at least at the peripheral edge where the inner lead is projected. It is characterized by being.

According to a fifth aspect of the semiconductor device, in addition to the features of the fourth aspect, the device hole is formed to have a size smaller than the outer shape of the semiconductor component and is arranged inside the peripheral edge of the semiconductor component. It is characterized by being

Further, in the semiconductor device according to the sixth aspect, the protective resin covering the semiconductor component and the inner leads is located outside the semiconductor component peripheral edge at least in the region where the peripheral edge of the device hole is located inside the peripheral edge of the semiconductor component. It is characterized in that it is formed so as to protrude, and the length of this protruding portion is within a range that does not exceed the gap distance between the substrate and the semiconductor component.

Furthermore, the semiconductor device according to claim 7 is characterized in that the electrodes of the semiconductor component connected to the inner leads are arranged in one row along the longitudinal direction thereof. The device is characterized in that the electrodes of the semiconductor component connected to the inner leads are arranged in two rows along the longitudinal direction thereof.

According to a ninth aspect of the semiconductor device, in addition to the characteristic features of the seventh aspect, the electrodes are divided into a plurality of blocks, and the inner leads are led out in mutually opposite directions. It is characterized by

According to a tenth aspect of the present invention, in addition to the characteristic features of the above-mentioned eighth aspect, a plurality of electrodes of at least one row of semiconductor components are separated from each other by a predetermined distance larger than the electrode pitch. It is characterized by being divided into blocks.

[0018]

Therefore, according to the film carrier of the first aspect, the peripheral edge of the device hole is moved from the outer side position to the inner side position of the conventional semiconductor component at least in the lead-out direction of the inner lead. A wiring pattern can be provided in an area overlapping with the semiconductor component, and the use area of the film carrier can be substantially expanded, and the size of the film carrier required for mounting one semiconductor component can be reduced as compared with the conventional case.

According to the film carrier of the second aspect, the use area of the film carrier required for mounting one semiconductor component can be reduced along the longitudinal direction of the film carrier.

According to the film carrier of the third aspect, the entire use area of the film carrier required for mounting one semiconductor component can be reduced as compared with the conventional case.

According to the semiconductor device of the fourth aspect, by using the film carrier of the first aspect, a gap between the peripheral edge of the conventional device hole and the peripheral edge of the semiconductor component and the gap are formed at least in the lead-out direction of the inner lead. Since the portion of the formed protective resin is eliminated and the wiring pattern can be provided in the region of the substrate overlapping the semiconductor component, the external dimensions of the substrate, that is, the external dimensions of the semiconductor device can be made smaller than before.

Further, according to the semiconductor device of the fifth aspect,
By arranging the entire device hole inside the peripheral edge of the semiconductor component, the protective resin portion conventionally provided in the space between the peripheral edge of the semiconductor component and the peripheral edge of the semiconductor component is eliminated over the entire periphery of the semiconductor component, and the device hole is eliminated. Since the wiring pattern can be formed in the area of the substrate that overlaps with the peripheral semiconductor components, the outer dimensions of the entire substrate can be made smaller than before.

According to the semiconductor device of the sixth aspect, since the protective resin portion which has conventionally been formed outside the peripheral edge of the semiconductor component is substantially eliminated, the dead space of the mounting area can be eliminated, and It is possible to easily confirm whether or not the protective resin is sufficiently applied because the protective resin slightly protrudes within a range that does not exceed the separation distance between the substrate and the semiconductor component.

According to the semiconductor device of the seventh aspect, the inner leads are arranged in the direction orthogonal to the longitudinal direction of the semiconductor component, and the size of the substrate can be reduced in that direction.

Further, according to the semiconductor device of claim 8,
It is possible to arrange the electrodes according to the mounting conditions such as the number of electrodes of the semiconductor component and the connection with the external device / circuit while reducing the size of the substrate.

According to the semiconductor device of the ninth aspect, the electrodes of the semiconductor component are divided into blocks according to their connection conditions and the like, so that the distance of the wiring extending from the inner leads to the outer leads on the substrate is shorter than before. can do.

According to the semiconductor device of the tenth aspect, in the case where the electrodes of the semiconductor component are in two rows, the electrodes are divided into blocks at appropriate intervals according to the number of electrodes, connection conditions, etc. The distance of the wiring that spreads from the inner lead to the outer lead can be made shorter than before.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 partially shows an embodiment of a film carrier to which the present invention is applied. The film carrier 1 is composed of a continuous plastic film tape having flexibility such as polyimide resin, polyester, glass epoxy resin, etc., and a device hole 3 corresponding to the semiconductor component 2 to be mounted is formed in the approximate center thereof. Has been done. A metal wiring pattern 5 such as a copper foil is formed on one surface 4 of the film carrier 1, and a large number of inner leads 6 are formed in the device hole 3 in order to connect the metal wiring pattern 5 to a corresponding electrode of the semiconductor component. Is provided so as to project inward beyond the peripheral edge of the. The semiconductor component 2 according to the present embodiment is I for driving an LCD cell of a liquid crystal display device.
It is a C chip, and its outer shape is an elongated rectangle in order to reduce the frame portion at the time of mounting.

The device hole 3 is used for the film carrier 1.
Is elongated in a direction orthogonal to the longitudinal direction of the semiconductor component 2 and is formed in a rectangular shape having a size smaller than the external dimensions of the semiconductor component 2. The device hole 3 is located completely inside the peripheral edge of the connected semiconductor component, and preferably the film carrier 1 has a region around the device hole 3 that overlaps the semiconductor component 2 with a certain width. It is arranged. Since the semiconductor component 2 is the LCD cell driving IC as described above, the inner leads 6 are derived in two directions from the respective peripheral edges orthogonal to the longitudinal direction of the film carrier 1, that is, the respective long sides facing each other, and It extends to near the center of the device hole where the bumps of the component 2 are to be arranged.

According to the present invention, by making the size of the device hole 3 smaller than the outer shape of the semiconductor component 2, the gap between the device hole and the semiconductor component of the conventional structure, that is, the dead space is eliminated, and conversely the peripheral edge of the device hole is eliminated. Wiring can be provided in the overlapping region of the film carrier 1 obtained between the semiconductor component and the periphery thereof, and the use area of the film carrier for one semiconductor component can be reduced. In particular, in this embodiment, the size of the device hole 3 is significantly reduced in the longitudinal direction of the film carrier 1, so that the number of semiconductor components that can be mounted on a tape reel of a certain length can be significantly increased as compared with the conventional one. The number of times the tape reels are replaced in the manufacture of the package is reduced, workability and productivity are improved, and the manufacturing cost can be reduced. In addition, the size of the semiconductor device manufactured from the film carrier 1 can be significantly reduced, and the mounting area can be reduced.

FIG. 2 shows a TAB package type semiconductor device using the film carrier of FIG. 1 according to the present invention. The TAB package 7 is an IC chip for driving an LCD cell in which the semiconductor component 2 has an elongated rectangular shape, and bumps 8 are arranged in a straight line at a substantially central position along the longitudinal direction. The device hole 3 is arranged substantially at the center of the film carrier 1, and is aligned so that the center of the device hole 3 is aligned with the center of the semiconductor component 2 and is located inside the peripheral edge of the semiconductor component 2. The packaging is
Similar to the conventional method, the tape-shaped film carrier 1 of FIG. 1 is aligned with the semiconductor component 2 as described above, and each inner lead 6 is thermocompression bonded to the corresponding bump 8 of the electrode pad using a bonding tool. And connect the protective resin 9 to a predetermined portion including the semiconductor component and the inner lead.
After coating, electrical characteristics are inspected, and finally, punching is performed along the cutting line 10 shown in FIG.

The protective resin 9 is formed of, for example, an epoxy-based thermosetting resin so as to slightly protrude from the peripheral edge of the semiconductor component 2 to the outside, and the length L of the protruding portion is equal to that of the semiconductor component 2 and the film carrier. Less than the gap 1 with 1 (0 <
It is convenient to provide such that l ≦ L). By providing this protruding portion, it can be easily confirmed from the outside that the protective resin 9 is completely applied to the required portion.

According to the present invention, as described with reference to FIG. 1, the size of the device hole 3 is smaller than the outer shape of the semiconductor component 2, and the device hole is arranged inside the peripheral edge of the semiconductor component. With this structure, the protective resin portion formed on the outside of the semiconductor component in the conventional structure can be substantially eliminated, and the use area of the film carrier 1 can be reduced, so that the external dimensions of the TAB package 7 are significantly smaller than those of the conventional structure. The mounting area can be reduced.
In particular, in this embodiment, since the inner leads 6 are led out in two directions orthogonal to the longitudinal direction of the semiconductor component 2, TA
The width of the B package 7 can be made extremely small as compared with the conventional one.

FIG. 3 shows a TAB of a modification of the embodiment shown in FIG.
Package 11 is shown. In the TAB package 7 of FIG. 2, the semiconductor component 2 is connected to the film carrier 1 face down, whereas in this modified example, the semiconductor component 2 faces the wiring pattern forming surface 4 of the film carrier 1. Connected face-up. In this case as well, the outer dimensions of the TAB package 11 can be similarly reduced.

The TAB package 7 of the present invention is mounted on an LCD cell of a liquid crystal display device as shown in FIG. TA
In the B package 7, the outer lead 12 on the output side is connected to the panel electrode 15 formed of an ITO film or the like of the LCD cell 14 by using, for example, an anisotropic conductive adhesive 13 or a photocurable insulating resin, as in the conventional case. . On the other hand, the outer lead 16 on the input side is connected by soldering or the like to the corresponding electrode terminal 18 of the printed circuit board 17 made of a normal glass epoxy board which constitutes the liquid crystal drive circuit. According to the present invention, the T having such a small size, in particular, a small width is
By connecting the AB package 7, the width W of the frame portion in FIG. 9 can be greatly reduced.

Further, according to the present invention, the arrangement of the electrodes and the bumps 8 of the semiconductor component 2 includes the function of each electrode, the design condition on wiring, the arrangement of the electrode terminals of the external device / circuit board to be connected, etc. Depending on various conditions such as the pitch, it is possible to customize the optimal arrangement and arrangement suitable for it. For example, in the embodiment shown in FIG. 1, the inner lead 6 on the input side is divided into two blocks 6-1 and 6-2 by half, and the inner lead block 6-3 on the output side is arranged between them. . Although not shown, each electrode of the semiconductor component 2 is similarly divided into blocks for input and output corresponding to the inner leads 6.

In this way, the electrodes of the semiconductor component and the inner leads are arranged and divided into blocks so that the lead-out directions of the inner leads are alternately opposite to each other in adjacent blocks, and wiring is performed from the inner leads to the outer leads. The distance required for can be shortened. Thereby, the used area of the film carrier can be reduced. For example, in the embodiment of FIG. 1, the inner lead 6 on the input side is divided into two blocks, and the wiring distance thereof is shortened.

FIG. 5 shows an embodiment of electrode arrangement by dividing the semiconductor component 2 of the embodiment shown in FIGS. 1 and 2 into different blocks. In the embodiment of FIG. 1, all the electrodes and the inner leads 6 are arranged at a constant pitch without distinction between blocks, whereas in the embodiments of FIGS. 5A to 5C, the electrode pitch hinders wiring. In this range, the distance between adjacent blocks is set as narrow as possible and the interval between adjacent blocks is set larger than the electrode pitch so that the blocks can be clearly distinguished.

In the embodiment of FIG. 5A, as in the case of the electrodes of FIG. 1, two input blocks 8a-1 and 8a-2 and one output block 8a-3 sandwiched between them are provided. And the blocks are largely separated from each other. In this embodiment, the wiring distance la on the input side is shortened. On the contrary, in the embodiment of FIG. 5B, the electrodes are divided into two output blocks 8b-1 and 8b-2 and one input block 8b-3 sandwiched between them. As a result, the wiring distance lb on the output side is shortened.
Further, in the embodiment of FIG. 5C, the electrodes are further divided into blocks, and four input blocks 8c-1 to 8c-4 are provided.
The three output blocks 8c-5 to 8c-7 are provided alternately to shorten the wiring distances la and lb on both the input side and the output side.

Further, according to the present invention, the electrodes are arranged in a plurality of rows according to the shape and size of the semiconductor component mounted on the film carrier, the number of electrodes thereof, the connection condition with the external device and the circuit board, and the like. be able to. In the TAB package 19 according to the second embodiment of the present invention shown in FIG. 6, half of the electrodes of the semiconductor component 20 are arranged in two rows along the longitudinal direction, and bumps 21a and 21b are formed on the respective electrodes. ing. The film carrier 22 has a device hole 2 having a size smaller than the outer shape of the semiconductor component 20 in the approximate center thereof.
3, inner leads 24a and 24b project from the respective peripheral edges of the device hole that face each other in the longitudinal direction toward the bump rows 21a and 21b so as to face each other. In order to further reduce the size of the TAB package 19, it is preferable to reduce the size of the device hole 23 by making the space between the electrode rows as narrow as possible.

The number of electrodes in each column does not necessarily have to be the same. For example, in the embodiment shown in FIG. 7, the semiconductor component 25 is a driving IC for a liquid crystal display device, an input electrode and its bump 26a are arranged in one column, and an output electrode and its bump 26b are arranged in the other column. It is arranged.
The output bumps 26b are all provided at the same fixed pitch, whereas the input bumps 26a are divided into three blocks 26a-1, 26a-2, 26a-3. Since each of the blocks is separated from each other with an interval that is considerably larger than the electrode pitch, the wiring distance l on the input side formed on the film carrier connected to the blocks.
a can be considerably shortened. Particularly, in the driving IC of the liquid crystal display device, since the number of input electrodes is considerably smaller than the number of output electrodes, it is possible to secure a sufficient separation distance between the blocks without forcibly narrowing the electrode pitch. This is advantageous because the distance of the input wiring can be easily shortened.

On the contrary, in another embodiment, in order to shorten the wiring distance on the output side, the electrodes on the input side and the bumps 26a are formed.
Can be arranged at the same fixed pitch, and the row of electrodes on the output side and the bumps 26b can be divided into a plurality of blocks which are separated from each other by a distance considerably larger than the electrode pitch. Further, each row of the electrodes on the input side and the output side and the bumps 26a, 26b can be similarly divided into an appropriate number of blocks to shorten the wiring distance on both the input side and the output side.

In still another embodiment, some of the output electrodes are arranged in the input side row so that the number of electrodes in both rows is substantially equal and the electrode pitch in one row is not too narrow. Can be In this case, if the input side columns are divided into blocks as described above and the output electrodes are arranged in blocks outside the input electrodes, the film carrier 22
In addition, wiring can be routed from the inner lead on the input side to the outer lead on the output side along the periphery of the device hole 23.

Further, the semiconductor component 20 does not necessarily have to be arranged in the center regardless of whether the electrodes are in one row or a plurality of rows. In the embodiment shown in FIG. 8, the two bump rows 21a and 21b whose intervals are sufficiently narrow are arranged near one side edge 27 of the semiconductor component 20. As a matter of course, the device hole 23 is arranged inside the peripheral edge of the semiconductor component 20.

In this case, it is convenient to form a plurality of dummy bumps 29 along the side 28 of the semiconductor component 20 farther from the bump row. The dummy bump 29 is
As described above, when connecting the film carrier and the semiconductor component 20 using the bonding tool, the flatness of the bonding tool with respect to the film carrier is ensured by supporting the film carrier as a spacer. As a result, the inner leads and the bumps can be joined in a good condition, and the parallelism between the film carrier and the semiconductor component can be sufficiently ensured. Therefore,
So that the protective resin is completely applied to the semiconductor component 20,
The flow can be improved.

Although the present invention has been described with reference to the preferred embodiments, it will be apparent to those skilled in the art that the present invention can be implemented by making various modifications and changes to the above embodiments within the technical scope thereof. can do.

[0047]

Since the present invention is constituted as described above, it has the following effects.

According to the film carrier of the first aspect, the device hole can be used for a wiring pattern by forming the device hole so that the peripheral edge from which the inner lead is projected is located inside the peripheral edge of the semiconductor component. Since the area of the film carrier is substantially expanded, the degree of freedom in designing the wiring is increased, and the use area of the film carrier required for mounting one semiconductor component is reduced, so that the manufacturing cost can be reduced. At the same time, when a TAB package is manufactured using this, the external dimensions can be reduced, and the mounting area can be reduced when connected to an external device or circuit.

In addition to this, according to the film carrier of the second aspect, the use area of the film carrier per one semiconductor component is reduced in the longitudinal direction, so that the semiconductor component which can be mounted on one tape reel is reduced. Since the number of the tape reels is larger than the conventional one, the manufacturing cost can be reduced, and the number of times the tape reels are replaced can be reduced, so that workability and productivity can be improved. Further, according to the film carrier of claim 3, the use area of the film carrier is further reduced,
The mounting area can be further reduced.

According to a fourth aspect of the semiconductor device, by using the film carrier according to the first aspect as a substrate, a gap between the conventional device hole peripheral edge and the semiconductor component peripheral edge is formed at least in the inner lead lead-out direction. Also, since the protective resin is eliminated and a wiring pattern is formed in a region of the substrate that overlaps with the semiconductor component, the degree of freedom in designing the wiring and the package is increased, and the external dimensions of the substrate are reduced. It becomes smaller, the mounting area can be reduced, and the demand for miniaturization of electronic devices can be met.

Particularly, according to the semiconductor device of the seventh aspect, the inner leads are perpendicular to the longitudinal direction of the semiconductor component.
Since it is led out in the direction, it is used for driving the liquid crystal display device.
When it is applied to the mounting of C, the outer dimension of the semiconductor device becomes smaller in the lead-out direction of the inner leads, so that the frame portion of the liquid crystal display device can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view partly showing a film carrier according to the present invention.

2 is a sectional view showing an embodiment of a TAB package type semiconductor device according to the present invention using the film carrier of FIG.

FIG. 3 is a sectional view showing a modification of the embodiment of FIG.

FIG. 4 is a cross-sectional view showing a portion of an LCD cell mounted with a TAB package according to the embodiment of FIG.

5A to 5C each show an arrangement of different blocks of electrodes of a semiconductor component.

6A is a sectional view showing a second embodiment of a TAB package type semiconductor device according to the present invention, and FIG. 6B is a plan view thereof.

FIG. 7 is a plan view showing a modification of the semiconductor component used in the second embodiment of FIG.

FIG. 8 is a plan view showing another modified example of the semiconductor component used in the second embodiment of FIG.

FIG. 9 is a cross-sectional view showing a conventional TAB package type semiconductor device.

10 is a conventional L mounted with the TAB package of FIG. 9;
It is a top view which shows the part of a CD cell.

[Explanation of symbols]

 1 film carrier 2 semiconductor component 3 device hole 4 surface 5 wiring pattern 6 inner lead 6-1 to 6-3 block 7 TAB package 8 bump 8a-1 to 8a-3 block 8b-1 to 8b-3 block 8c-1 to 1 8c-7 Block 9 Protective Resin 10 Cutting Line 11 TAB Package 12 Outer Lead 13 Anisotropic Conductive Adhesive 14 LCD Cell 15 Panel Electrode 16 Outer Lead 17 Printed Circuit Board 18 Terminal 19 TAB Package 20 Semiconductor Components 21a, 21b Bump 22 Film Carrier 23 Device holes 24a, 24b Inner leads 25 Semiconductor parts 26a, 26b Bumps 27, 28 Sides 29 Dummy bumps 31 Film carriers 32 IC chips 33 Device holes 34 Inner leads 35 Bumps 36 Mamoru resin 37 drive IC 38 TAB package 39 LCD cell 40 printed circuit board 41 the outer peripheral portion

Front Page Continuation (72) Inventor Ryoichi Fujimori 3-3-5 Yamato, Suwa City, Nagano Seiko Epson Corporation

Claims (10)

[Claims] 1. A device hole is formed so as to face a semiconductor component to be mounted, and a large number of inner leads project inward from a peripheral edge of the device hole for connecting to the semiconductor component and extend from the inner lead. A film carrier made of a continuous flexible tape that supports a large number of metal wirings, wherein the device hole is located inside the peripheral edge of the semiconductor component at least at the peripheral edge from which the inner lead is projected. A film carrier characterized by being formed as follows. 2. The film carrier according to claim 1, wherein the inner lead is provided so as to project inward from a peripheral edge of the device hole in a direction substantially orthogonal to a longitudinal direction of the film carrier. 3. The device hole according to claim 1, wherein the device hole is formed so that its size is smaller than the outer shape of the semiconductor component and is located inside the peripheral edge of the semiconductor component. 2. The film carrier according to 2. 4. A substrate made of a flexible film having a large number of metal wirings, device holes, and a plurality of inner leads extending from the metal wirings and projecting inward from the periphery of the device hole, and the device hole. A semiconductor device comprising a semiconductor component connected to the inner lead of the substrate via, wherein the device hole is at least at the peripheral edge of the inner lead protruding from the inner side of the peripheral edge of the semiconductor component. A semiconductor device characterized in that it is formed so as to be located at. 5. The semiconductor device according to claim 4, wherein the device hole has a size smaller than an outer shape of the semiconductor component and is arranged inside a peripheral edge of the semiconductor component. 6. The substrate is provided with a protective resin covering the semiconductor component and the inner leads, outside the periphery of the semiconductor component, at least in a region where the periphery of the device hole is located inside the periphery of the semiconductor component. 6. The semiconductor device according to claim 4, wherein the semiconductor device is formed so as to protrude within a range of a length that does not exceed a gap between the semiconductor component and the semiconductor component. 7. The electrode according to claim 4, wherein the electrodes of the semiconductor component connected to the inner leads are arranged in a row along the longitudinal direction thereof. Semiconductor device. 8. The electrode according to claim 4, wherein the electrodes of the semiconductor component connected to the inner leads are arranged in two rows along the longitudinal direction thereof. Semiconductor device. 9. The row of electrodes of the semiconductor component is divided into a plurality of blocks, and the lead-out directions of the inner leads are opposite to each other between the adjacent blocks. Semiconductor device. 10. The electrode of at least one of the columns of the semiconductor component is divided into a plurality of blocks separated from each other with a predetermined interval larger than the electrode pitch. Semiconductor device.