KR950004417A - How to form an alignment mark - Google Patents

How to form an alignment mark Download PDF

Info

Publication number
KR950004417A
KR950004417A KR1019930012448A KR930012448A KR950004417A KR 950004417 A KR950004417 A KR 950004417A KR 1019930012448 A KR1019930012448 A KR 1019930012448A KR 930012448 A KR930012448 A KR 930012448A KR 950004417 A KR950004417 A KR 950004417A
Authority
KR
South Korea
Prior art keywords
alignment mark
alignment
symmetry
improving
shape
Prior art date
Application number
KR1019930012448A
Other languages
Korean (ko)
Inventor
황준
최호영
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019930012448A priority Critical patent/KR950004417A/en
Publication of KR950004417A publication Critical patent/KR950004417A/en

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체 웨이퍼의 스크라이브라인 상에 단면도 형태가 음각형태인 모양을 갖고 계속되는 공정에 대응하여 모양의 대칭성이 유지되도록 소정의 크기를 갖게 얼라인먼트 마크를 형성하는 것을 특징으로 하는 반사율이 심한 기판에서의 얼라인먼트 마크 형성 방법에 관한 것으로, 반사율이 심한 기판에서 양호한 검출신호를 얻을 수 있고, 얼라인먼트 마크의 대칭성이 유지되므로 정확한 얼라인먼트 마크의 위치를 감지하여 얼라인먼트의 정확도를 향상시키므로서 반도체소자의 고집적화 및 신뢰도를 향상시키는 효과가 있다.According to the present invention, an alignment mark having a predetermined size is formed on a scribe line of a semiconductor wafer to have a predetermined cross-sectional shape and a symmetry of shape in response to a subsequent process. The present invention relates to a method for forming an alignment mark, which provides a good detection signal on a substrate with high reflectance and maintains the alignment mark symmetry, thereby improving the accuracy of alignment by detecting the exact position of the alignment mark, thereby improving the integration accuracy and reliability of the semiconductor device. It is effective to improve.

Description

얼라인먼트 마크 형성 방법How to form an alignment mark

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 따른 얼라인먼트 마크 단면도, 제4도는 얼라인먼트 마크를 검출하는 원리를 나타내는 개념도, 제5도는 검출기의 모니터상에 나타나는 검출 신호 그래프.3 is a cross-sectional view of an alignment mark according to the present invention, FIG. 4 is a conceptual diagram showing a principle of detecting alignment marks, and FIG.

Claims (2)

얼라인먼트 마크 형성 방법에 있어서, 반도체 웨이퍼의 스크라이브라인 상에 단면도 형태가 음각형태인 모양을 갖고 계속되는 공정에 대응하여 모양의 대칭성이 유지되도록 소정의 크기를 갖게 얼라인먼트 마크를 형성하는 것을 특징으로 하는 반사율이 심한 기판에서의 얼라인먼트 마크 형성 방법.In the alignment mark forming method, an alignment mark is formed on a scribebrain of a semiconductor wafer with a predetermined cross-sectional shape and an alignment mark having a predetermined size so that symmetry of shape is maintained in response to a subsequent process. Method for forming alignment marks on severe substrates. 제1항에 있어서, 상기 얼라인먼트 마크는 가로와 세로의 폭이 각각 8∼10㎛인 것을 특징으로 하는 반사율이 심한 기판에서의 얼라인먼트 마크 형성 방법.The method of claim 1, wherein the alignment marks have widths of 8 to 10 mu m in width and length, respectively. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930012448A 1993-07-02 1993-07-02 How to form an alignment mark KR950004417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930012448A KR950004417A (en) 1993-07-02 1993-07-02 How to form an alignment mark

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930012448A KR950004417A (en) 1993-07-02 1993-07-02 How to form an alignment mark

Publications (1)

Publication Number Publication Date
KR950004417A true KR950004417A (en) 1995-02-18

Family

ID=67143185

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930012448A KR950004417A (en) 1993-07-02 1993-07-02 How to form an alignment mark

Country Status (1)

Country Link
KR (1) KR950004417A (en)

Similar Documents

Publication Publication Date Title
KR880011882A (en) Manufacturing method of CD Bar
KR950015703A (en) Manufacturing Method of Semiconductor Device Using Measurement Mark Pattern
KR950004417A (en) How to form an alignment mark
KR970029263A (en) Labels to easily distinguish wafers
KR960026101A (en) How to form an alignment mark
KR960035761A (en) Semiconductor device with overlap mark
KR950001885A (en) Alignment measurement mark structure with improved fidelity
KR970018313A (en) Overlay pattern structure for measuring alignment
KR970017940A (en) Mask alignment measurement method of semiconductor device
KR950025861A (en) Photomask Manufacturing Method
KR970022500A (en) Phase error detection method of phase inversion mask
KR940010216A (en) Manufacturing Method of Semiconductor Device
KR960039113A (en) How to form an alignment mark
KR940015706A (en) Method of manufacturing measurement mark in mask pattern of semiconductor device
KR960042909A (en) Semiconductor device manufacturing method
KR980005380A (en) How to create alignment marks
KR940016651A (en) Superposition error measurement mark manufacturing method
KR930008952A (en) Semiconductor substrate cutting method
KR970017902A (en) Method for forming alignment key pattern of semiconductor device
KR930017109A (en) Etching of Compound Semiconductor Devices
KR960026094A (en) How to check the alignment of the photo mask for forming the semiconductor pattern
KR970051933A (en) Reticle for semiconductor device manufacturing and wafer manufactured using the same
KR970028813A (en) Reticle for Semiconductor Device Manufacturing
KR970053219A (en) Semiconductor device for surface property inspection and manufacturing method thereof
KR950030245A (en) Misalignment measurement method between gate and contact formed on gate

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination