KR950004368A - 본딩하중 측정장치 - Google Patents

본딩하중 측정장치 Download PDF

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Publication number
KR950004368A
KR950004368A KR1019940011902A KR19940011902A KR950004368A KR 950004368 A KR950004368 A KR 950004368A KR 1019940011902 A KR1019940011902 A KR 1019940011902A KR 19940011902 A KR19940011902 A KR 19940011902A KR 950004368 A KR950004368 A KR 950004368A
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KR
South Korea
Prior art keywords
screw shaft
gauge
fixed
slider
screw
Prior art date
Application number
KR1019940011902A
Other languages
English (en)
Other versions
KR0139419B1 (ko
Inventor
이와오 다카하시
Original Assignee
아라이 가즈오
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아라이 가즈오, 가부시키가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR950004368A publication Critical patent/KR950004368A/ko
Application granted granted Critical
Publication of KR0139419B1 publication Critical patent/KR0139419B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)

Abstract

측정치의 신뢰성의 향상 및 본딩하중의 설정시간 단축을 도모한다. 틀체에 회전이 자유로이 지지된 나사축(18)과 나사축(18)을 손으로 돌리는 수동핸들(23)과, 나사축(18)의 회전에 의하여 상하이동되는 암나사(24)와 같이 상하이동하는 슬라이더(25)와, 슬라이더(25)에 고정된 게이지홀더(30)와 게이지홀더(30)에 착탈이 자유로이 부착된 텐션게이지(31)와, 텐션게이지(31)의 측정레버(34)에 고정되고, 본딩아암(5)의 캐필러리 고정나사(7)에 걸어맞춤하는 훅(35)와, 틀체를 와이어 본딩장치에 고정하는 고정클릭 및 가동클릭(43)을 구비하고 있다.

Description

본딩하중 측정장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명으로 이루어지는 본딩하중 측정장치의 1실시예를 도시하는 부분 절단면 정면도.

Claims (1)

  1. 틀체에 회전이 자유로이 지지된 나사축과, 이 나사축을 손으로 돌리는 수동부재와, 상기 나사축에 나사맞춤하고 그 나사축의 회전에 의하여 상하이동되는 암나사와, 이 암나사와 같이 상하이동하는 슬라이더와, 이 슬라이더에 고정된 게이지홀더와, 이 게이지 홀더에 착탈이 자유로이 고정된 텐션게이지와, 이 텐션게이지의 측정레버에 고정되고, 본딩아암 또는 본딩아암과 일체의 부재에 걸어맞춤하는 걸어맞춤부를 갖는 훅과 상기 틀체를 와이어 본딩장치에 고정하는 고정수단을 구비한 것을 특징으로 하는 본딩하중 측정장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940011902A 1993-07-26 1994-05-30 본딩하중 측정장치 KR0139419B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5202485A JP3005787B2 (ja) 1993-07-26 1993-07-26 ボンデイング荷重測定装置
JP93-202485 1993-07-26

Publications (2)

Publication Number Publication Date
KR950004368A true KR950004368A (ko) 1995-02-17
KR0139419B1 KR0139419B1 (ko) 1998-07-15

Family

ID=16458291

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940011902A KR0139419B1 (ko) 1993-07-26 1994-05-30 본딩하중 측정장치

Country Status (3)

Country Link
US (1) US5633469A (ko)
JP (1) JP3005787B2 (ko)
KR (1) KR0139419B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960040385A (ko) * 1995-05-25 1996-12-17 이대원 와이어 본딩용 캐피러리의 충격력 보정 방법
JP4614729B2 (ja) 2004-10-15 2011-01-19 コンドーエフアルピー工業株式会社 排水トラップ
JP2006118964A (ja) * 2004-10-21 2006-05-11 Nidec-Shimpo Corp 荷重試験機
CN101155964B (zh) 2006-04-11 2012-05-09 近藤-Frp工业株式会社 排水疏水阀
CN102608025B (zh) * 2012-03-06 2014-07-16 长安大学 路面层间粘结强度检测仪
CN109001108B (zh) * 2018-08-08 2021-07-02 中国石油天然气集团有限公司 定子马达橡胶粘接效果的检测装置以及检测方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2136344A (en) * 1928-12-29 1938-11-08 Wingfoot Corp Tension testing machine
US3580065A (en) * 1969-05-07 1971-05-25 Universal Oil Prod Co Laminate bond peeling strength tester
US3572108A (en) * 1969-06-05 1971-03-23 Collins Radio Co Means for testing wire bonds in microelectronic circuits
US3724265A (en) * 1969-11-19 1973-04-03 Western Electric Co Apparatus for testing the strength of the joint of a wire joined to a part
US3945248A (en) * 1975-06-09 1976-03-23 West Harry E Wire bond integrity tester
US4438880A (en) * 1981-08-17 1984-03-27 Orthodyne Electronics Corporation Ultrasonic wire bond touchdown sensor
GB2163262B (en) * 1984-08-16 1988-06-08 Dyna Pert Precima Limited Load testing machines
US4907458A (en) * 1987-12-09 1990-03-13 Biggs Kenneth L Pull testing
US4817848A (en) * 1988-05-12 1989-04-04 Hughes Aircraft Company Compliant motion servo
US4895028A (en) * 1989-01-27 1990-01-23 U.S. Philips Corporation Method of pull-testing wire connectors on an electrical device

Also Published As

Publication number Publication date
US5633469A (en) 1997-05-27
KR0139419B1 (ko) 1998-07-15
JP3005787B2 (ja) 2000-02-07
JPH0745661A (ja) 1995-02-14

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