KR950002236U - Wafer transfer system of sputtering equipment - Google Patents

Wafer transfer system of sputtering equipment

Info

Publication number
KR950002236U
KR950002236U KR2019930010318U KR930010318U KR950002236U KR 950002236 U KR950002236 U KR 950002236U KR 2019930010318 U KR2019930010318 U KR 2019930010318U KR 930010318 U KR930010318 U KR 930010318U KR 950002236 U KR950002236 U KR 950002236U
Authority
KR
South Korea
Prior art keywords
transfer system
wafer transfer
sputtering equipment
sputtering
equipment
Prior art date
Application number
KR2019930010318U
Other languages
Korean (ko)
Other versions
KR960008156Y1 (en
Inventor
윤형훈
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930010318U priority Critical patent/KR960008156Y1/en
Publication of KR950002236U publication Critical patent/KR950002236U/en
Application granted granted Critical
Publication of KR960008156Y1 publication Critical patent/KR960008156Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
KR2019930010318U 1993-06-12 1993-06-12 Wafer transfer system of sputtering device KR960008156Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930010318U KR960008156Y1 (en) 1993-06-12 1993-06-12 Wafer transfer system of sputtering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930010318U KR960008156Y1 (en) 1993-06-12 1993-06-12 Wafer transfer system of sputtering device

Publications (2)

Publication Number Publication Date
KR950002236U true KR950002236U (en) 1995-01-04
KR960008156Y1 KR960008156Y1 (en) 1996-09-24

Family

ID=19356999

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930010318U KR960008156Y1 (en) 1993-06-12 1993-06-12 Wafer transfer system of sputtering device

Country Status (1)

Country Link
KR (1) KR960008156Y1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100375135B1 (en) * 2000-10-13 2003-03-08 주식회사 에버테크 Wafer process method
KR100506933B1 (en) * 2003-03-03 2005-08-09 삼성전자주식회사 Semiconductor manufacturing equipment
KR100563686B1 (en) * 1999-03-18 2006-03-28 동경 엘렉트론 주식회사 Substrate processing apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100563686B1 (en) * 1999-03-18 2006-03-28 동경 엘렉트론 주식회사 Substrate processing apparatus
KR100375135B1 (en) * 2000-10-13 2003-03-08 주식회사 에버테크 Wafer process method
KR100506933B1 (en) * 2003-03-03 2005-08-09 삼성전자주식회사 Semiconductor manufacturing equipment

Also Published As

Publication number Publication date
KR960008156Y1 (en) 1996-09-24

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Legal Events

Date Code Title Description
A201 Request for examination
O032 Opposition [utility model]: request for opposition
E701 Decision to grant or registration of patent right
O071 Decision to grant registration after opposition [utility model]: decision to grant registration
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20070622

Year of fee payment: 11

EXPY Expiration of term