KR950001981A - Substrate Transfer Method and Substrate Transfer Device of Substrate Processing Equipment - Google Patents

Substrate Transfer Method and Substrate Transfer Device of Substrate Processing Equipment Download PDF

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KR950001981A
KR950001981A KR1019940012977A KR19940012977A KR950001981A KR 950001981 A KR950001981 A KR 950001981A KR 1019940012977 A KR1019940012977 A KR 1019940012977A KR 19940012977 A KR19940012977 A KR 19940012977A KR 950001981 A KR950001981 A KR 950001981A
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substrate
processing
board
processed
substrate transfer
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KR0146907B1 (en
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마사히로 미마사카
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이시다 아키라
다이닛뽕스크린 세이조오 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

장치를 대형화시키지 않고 처리능력을 높일 수 있는 기판처리장치에서 기판의 반송방법을 제공한다.Provided is a substrate transfer method in a substrate processing apparatus capable of increasing processing capacity without increasing the size of the apparatus.

제 1 의 기판 반송기구가 인댁서(ID), 자외선 조사유니트(UV), 스핀 스크래버(SS1), 핫 플레이트(HP1), 쿨 플레이트(CP1), 밀착강화 유니트(AP1), 쿨 플레이트(CP2) 순서로, 또 주기(T)로 피처리 기판을 반송한다. 또한, 제 2 의 기판 반송기구가 제 1 의 기판 반송기구와 같이 해서 피처리 기판을 반송하는 결국 동일의 반송순서로 또 주기로 피러치 기판을 반송한다. 단, 양 기판 반송기구의 간섭을 방지하기 위해 각 기판 반송수단에 의해 행해지는 피처리 기판의 반송처리는 교대로 반송주기보다도 짧은 시간만큼 어긋난 상태에서 행해진다. 이렇게 해서 이 주기 사이에 2매의 기판에 대해서 일련의 기판처리가 시행된다.The first substrate transfer mechanism is the indenter (ID), the ultraviolet irradiation unit (UV), the spin scrubber (SS1), the hot plate (HP1), the cool plate (CP1), the adhesion strengthening unit (AP1), and the cool plate (CP2). ) And to-be-processed substrate in cycle T. Moreover, the 2nd board | substrate conveyance mechanism conveys a to-be-processed board | substrate in the same conveyance order, and also in a cycle as a 1st board | substrate conveyance mechanism conveys a to-be-processed board | substrate similarly. However, in order to prevent the interference of both board | substrate conveyance mechanisms, the conveyance process of the to-be-processed board | substrate performed by each board | substrate conveyance means alternately performs in the state shift | deviated by the time shorter than a conveyance period. In this way, a series of substrate processing is performed for two substrates between these cycles.

Description

기판처리장치의 기판반송방법 및 기판반송장치Substrate Transfer Method and Substrate Transfer Device of Substrate Processing Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1 도는 본 발명에 관한 기판의 반송방법을 적용할 수 있는 기판처리장치의 일예를 나타내는 측면도, 제 2 도는 제 1 도를 상방에서 본 평면배치도, 제 3 도는 제1도의 I-I위치에서 (-X)방향으로 본 측면구조도, 제 4 도는 제 3 도의 기판반송기구의 사시도.1 is a side view showing an example of a substrate processing apparatus to which the substrate transfer method according to the present invention can be applied, FIG. 2 is a planar layout view of FIG. 1 from above, and FIG. 4 is a perspective view of the substrate transport mechanism of FIG.

Claims (8)

피처리 기판에 각각 다른 처리를 행하는 복수의 처리부와 상기 처리부 사이를 자유롭게 이동되도록 구성되고, 각각 독립해서 상기 피처리 기판을 상기 처리부 사이에서 반송 가능하도록한 n개(n≥2)의 기판 반송수단을 구비한 기판반송장치에서, 각 기판반송수단에 의해 상기 피처리 기판을 소정의 반송순서로, 또 소정의 주기(T)로 상기 처리부 사이를 각각 반송하는 기판 반송방법에 있어서, 각 기판 반송수단에 의한 상기 피처리 기판의 반송처리가, 교대로 상기 주기보다도 짧은 시간만큼 어긋난 상태에서 행해지는 것을 특징으로 하는 기판처리장치의 기판의 반송방법.N (n≥2) substrate transfer means configured to move freely between the plurality of processing units and the processing units that perform different processing on the processing target substrates, and to independently transport the processing target substrates between the processing units, respectively. In the substrate transfer apparatus provided with each said board | substrate, each board | substrate conveying means in which each said board | substrate conveying means conveys between the said process parts in predetermined | prescribed conveyance order and in predetermined | prescribed period T, respectively. The conveyance process of the said to-be-processed board | substrate by a process is performed in the state which shifted by the time shorter than the said cycle alternately, The board | substrate conveyance method of the substrate processing apparatus characterized by the above-mentioned. 제 1 항에 있어서, 각 기판 반송수단에 의한 처리 피처리 기판의 반송처리가 교대로 시간(T/n)만큼 어긋난 상태에서 행해지는 것을 특징으로 하는 기판처리장치의 기판 반송방법.The substrate conveyance method of the substrate processing apparatus of Claim 1 characterized by the conveyance process of the to-be-processed board | substrate by each board | substrate conveying means alternately shifting by time (T / n). 제 1 항에 있어서, 상기 복수의 처리부중 1개가 동일 처리를 행하는 동일 구성의 복수의 유니트로 구성된 것을 특징으로 하는 기판처리장치의 기판 반송방법.The substrate transfer method of the substrate processing apparatus according to claim 1, wherein one of the plurality of processing units is composed of a plurality of units having the same configuration for performing the same processing. 제 3 항에 있어서, 상기 유니트를 포함한 처리부에서 기판을 병렬처리하는 것을 특징으로 하는 기판처리장치의 기판 반송방법.4. The substrate transfer method of the substrate processing apparatus according to claim 3, wherein the substrate is processed in parallel in a processing unit including the unit. 피처리 기판에 각각 다른 처리를 행하는 복수의 처리부를 구비한 기판처리장치의 기판 반송장치에 있어서, 상기 처리부 사이를 자유롭게 이동되도록 구성되고, 각각 독립해서 상기 피처리 기판을 상기 처리부 사이에서 반송 가능하도록한 n(n≥2)의 기판 반송수단과, 상기 복수의 기판 반송수단을 제어해서 각 피처리 기판을 소정의 반송순서로, 또 소정의 주기(T)로 상기 처리부 사이를 각각 반송함과 동시에, 각 기판반송수단에 의해 상기 피처리 기판의 반송처리를 교대로 상기 주기보도 짧은 시간만큼 어긋난 상태에서 행하는 제어수단을 구비한 기판처리장치의 기판 반송장치.A substrate transfer apparatus of a substrate processing apparatus having a plurality of processing units which perform different treatments on a substrate to be processed, wherein the substrate transfer apparatus is configured to move freely between the processing units and to independently transport the processing substrates between the processing units. By controlling one n (n≥2) substrate transfer means and the plurality of substrate transfer means, each of the substrates to be processed is transferred between the processing units in a predetermined transfer order and at a predetermined period T, respectively. And a control means for performing the transfer processing of the substrate to be processed by the substrate transfer means alternately in a state where the periodic report is shifted by a short time. 제 3 항에 있어서 상기 제어수단은 각 기판 반송수단에 의해 상기 피처리 기판의 반송처리가 교대로 시간(T/n)만큼 어긋난 상태에서 행해지도록 상기 복수의 기판 반송수단을 제어하는 것을 특징으로 하는 기판처리장치의 기판 반송장치.4. The control means according to claim 3, wherein the control means controls the plurality of substrate transfer means such that each substrate transfer means performs the transfer processing of the substrate to be processed alternately by a time T / n. Substrate conveying apparatus of substrate processing apparatus. 제 5 항에 있어서, 상기 복수의 처리부중 1개가 동일 처리를 행하는 동일 구성의 복수의 유니트로 구성된 것을 특징으로 하는 기판처리장치의 기판 반송장치.6. The substrate transfer apparatus of the substrate processing apparatus according to claim 5, wherein one of the plurality of processing units is composed of a plurality of units having the same configuration for performing the same processing. 제 7 항에 있어서, 상기 유니트를 포함하는 처리부에서 기판을 병렬처리하는 것을 특징으로 하는 기판처리장치의 기판 반송장치.The substrate transfer apparatus of the substrate processing apparatus according to claim 7, wherein the substrate is processed in parallel in a processing unit including the unit. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940012977A 1993-06-14 1994-06-09 Method and apparatus for transporting substrates within a substrate processing apparatus Expired - Fee Related KR0146907B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP93-168604 1993-06-14
JP5168604A JPH077065A (en) 1993-06-14 1993-06-14 Substrate carrying method of substrate treating apparatus

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KR950001981A true KR950001981A (en) 1995-01-04
KR0146907B1 KR0146907B1 (en) 1998-11-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100729906B1 (en) * 2000-05-25 2007-06-18 동경 엘렉트론 주식회사 Substrate processing apparatus and substrate processing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100706381B1 (en) * 1999-06-03 2007-04-10 동경 엘렉트론 주식회사 Board Transfer Device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100729906B1 (en) * 2000-05-25 2007-06-18 동경 엘렉트론 주식회사 Substrate processing apparatus and substrate processing method

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KR0146907B1 (en) 1998-11-02

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