KR940004133Y1 - Electromagnetic wave shield and heat radiation plate - Google Patents

Electromagnetic wave shield and heat radiation plate Download PDF

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Publication number
KR940004133Y1
KR940004133Y1 KR92004621U KR920004621U KR940004133Y1 KR 940004133 Y1 KR940004133 Y1 KR 940004133Y1 KR 92004621 U KR92004621 U KR 92004621U KR 920004621 U KR920004621 U KR 920004621U KR 940004133 Y1 KR940004133 Y1 KR 940004133Y1
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KR
South Korea
Prior art keywords
heat sink
electromagnetic wave
wave shield
heat radiation
radiation plate
Prior art date
Application number
KR92004621U
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Korean (ko)
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KR930022611U (en
Inventor
박태길
Original Assignee
박성규
대우통신 주식회사
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Application filed by 박성규, 대우통신 주식회사 filed Critical 박성규
Priority to KR92004621U priority Critical patent/KR940004133Y1/en
Publication of KR930022611U publication Critical patent/KR930022611U/en
Application granted granted Critical
Publication of KR940004133Y1 publication Critical patent/KR940004133Y1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

내용 없음.No content.

Description

전자파 차폐판 겸용 방열판Electromagnetic shielding plate combined heat sink

제1도는 본 고안의 사용상태 예시도.Figure 1 is an illustration of the state of use of the present invention.

제2도는 본 고안의 사시도.2 is a perspective view of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 차폐(판)부 2 : 방열(판)(부)1 Shield (plate) 2 Heat radiation (plate)

3 : 피시비기판 4, 4′4″4″′: 체결공3: PCB 4, 4′4 ″ 4 ″ ′: Fastener

5, 5′5″5″′: 볼트 6 : 발열부품5, 5'5 "5" ': Bolt 6: Heat generating parts

본 고안은 모니터, 텔레비젼등의 전자기기에서 차폐판과 방열판을 일체로 형성하여 공용으로 사용할 수 있도록 전자판 차폐판 겸용 방열판에 관한 것이다.The present invention relates to an electronic shielding plate combined heat sink to be used in common by forming a shielding plate and a heat sink in electronic devices such as monitors, televisions.

종래에는 통상의 피시비기판 밑에 전자파 차폐를 위한 차폐판을 설치하고, 방열판은 발열부품을 많이 위치시킨 일측에 별도의 방열판을 설치하였으나, 이는 회로 부품등에 의해 공간의 제약을 받아 부품과 떨어진 위치에 입설하여 설치하므로서 방열 효과를 높이기 위해 크게 설치해야 하므로 설치비가 증대하고, 설치작업으로 부품 및 공정수가 증대 되었다.Conventionally, a shielding plate for shielding electromagnetic waves is installed under a conventional PCB, and a heat sink is installed on a side where a large number of heat generating parts are placed, but this is placed in a position away from the parts due to space constraints by circuit components. The installation cost increased, and the number of parts and processes increased due to the installation work.

본 고안은 상기한 바와 같은 제반 문제점을 해소코자 차폐판 일측에 발열부품을 부착할 수 있는 방열판 부위를 입설 절곡되게 하여 일체로 형성시켜, 차폐판 고정만으로 방열판도 고정되어 작업의 이중성이 방지되고 방열판의 방열면적이 증대되므로 방열효과가 높아지며 차폐판 상기 공간을 이용하게 되므로 공간의 제약을 받지 않게 되므로 발열부품에 맞게 형성시켜 방열효과를 충분히 발휘할수 있도록 하는데 그 목적이 있는 것으로 이를 첨부 도면에 의거하여 상세히 설명하면 다음과 같다.The present invention solves all the problems described above to form a single body of the heat sink that can be attached to the heat generating parts on one side of the shield plate, and integrally formed, the heat sink is fixed only by fixing the shield plate prevents duplication of work and the heat sink Since the heat dissipation area is increased, the heat dissipation effect is increased, and the shielding plate uses the space, so that the space is not limited by the space. It will be described in detail as follows.

다수개의 체결공(4) (4′)(4″)(4″′)을 천설시킨 차폐판(부)(1) 일측을 절곡 연장시켜 발열부품(6) 크기에 알맞게 부착할 수 있도록또는형 방열판(부)(2)를 절곡하여 일체로 형성시킨 것을 특징으로 하는 전자파 차폐판 겸용 방열판이다.One side of the shielding plate (part) 1 having a plurality of fastening holes 4, 4 ′, 4 ″, 4 ″ ′ bent to extend so that it can be properly attached to the size of the heating part 6. or It is a heat shield plate for electromagnetic wave shield combined use, characterized in that the type heat sink (part) 2 is bent and integrally formed.

이와 같이 구성된 본 고안의 작용 및 효과를 살펴보면 다음과 같다.Looking at the operation and effects of the present invention configured as described above are as follows.

필요에 따라 차폐판(부)(1) 고정후 방열판(부)(2)를 발열부품(6) 크기에 맞게 절곡하여 형성시키고 피시비기판(3) 고정부에 맞게 천설시킨 차폐판(부)(2)의 다수개의 체결공(4)(4′)(4″)(4″′)에 볼트 (5)(5′)(5″)(5″′)를 체결시키면 피시비기판(3)과 차폐판(부)(1)가 고정되면서 방열판(부)(2)가 고정되고 발열부품(6)을형으로 형성시킨 방열판(부)(2) 외면측에 부착하면 차폐판(부)(1)도 열전도로 인한 방열판 역학을 하게 되므로 발열부품(6)와 떨어져 입설시킨 방열판에 비해 방열효과가 크게 증대되고, 방열판(부)(2)고정을 위한 별도의 이중작업 및 부품이 절약되고, 설치공간의 제약을 벗어나 부품의 크기에 알맞게 방열판(부)(2)의 크기가 조절되므로 설치비가 절감되는 유용한 고안인 것이다.If necessary, after fixing the shielding plate (part) (1), the heat sink (part) (2) is formed by bending the heat generating part (6) to fit the size of the shielding plate (part) (installed) to fit the PCB (3) fixing part ( The bolts 5, 5 ', 5' and 5 '' are fastened to the plurality of fastening holes 4, 4 ', 4' and 4 '. As the shield plate (part) 1 is fixed, the heat sink (part) 2 is fixed and the heat generating part 6 is removed. When attached to the heat sink (part) 2 formed on the outer surface side, the shield plate (part) 1 also performs heat sink dynamics due to heat conduction, so the heat dissipation effect is greatly increased as compared with the heat sink placed away from the heat generating part 6. It is possible to save additional dual work and parts for fixing the heat sink (part) (2), and to reduce the installation cost because the size of the heat sink (part) (2) is adjusted to fit the size of the parts out of the constraint of the installation space. It is an idea.

Claims (1)

다수개의 체결공(4)(4′)(4″)(4″′)을 천설시킨 차폐판(부)(1)일측을 절곡 연장시켜 발열부품(6) 크기에 알맞게 부착할 수 있도록형 또는형으로 절곡 형성시킨 방열판(부)(2)을 일체로 형성시킨것 을 특징으로 하는 전자파 차폐판 겸용 방열판.One side of the shielding plate (part) 1, which has a plurality of fastening holes 4, 4 ', 4 ″, 4 ″', is bent and extended so that it can be properly attached to the size of the heating part 6. Mold or An electromagnetic wave shield combined heat sink characterized in that the heat sink (part) (2) formed by bending in a shape is integrally formed.
KR92004621U 1992-03-23 1992-03-23 Electromagnetic wave shield and heat radiation plate KR940004133Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92004621U KR940004133Y1 (en) 1992-03-23 1992-03-23 Electromagnetic wave shield and heat radiation plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92004621U KR940004133Y1 (en) 1992-03-23 1992-03-23 Electromagnetic wave shield and heat radiation plate

Publications (2)

Publication Number Publication Date
KR930022611U KR930022611U (en) 1993-10-16
KR940004133Y1 true KR940004133Y1 (en) 1994-06-20

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR92004621U KR940004133Y1 (en) 1992-03-23 1992-03-23 Electromagnetic wave shield and heat radiation plate

Country Status (1)

Country Link
KR (1) KR940004133Y1 (en)

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Publication number Publication date
KR930022611U (en) 1993-10-16

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