KR940003566Y1 - Lead line structure for emi filter - Google Patents

Abstract

No content.

Description

Lead wire coupling structure of 3-terminal EMI filter

1 is a front view showing a lead wire coupling structure of the prior art.

Figure 2 is an exploded perspective view showing a lead wire coupling structure of the present invention.

3 is a front view showing the lead wire coupling structure of the present invention.

* Explanation of symbols for main parts of the drawings

2: 2-terminal lead wire 3: Vertical part

5: bending flange 6: shear hole

7,11: chip condenser 8,13: intermediate terminal lead wire

14: Bead

The present invention is a three-terminal EMI filter used to remove high frequency noise components included in signals on PCB patterns or input / output (I / O) cables in digital devices. The present invention relates to a lead wire coupling structure having an improved coupling structure.

In recent years, as the speed of digital devices increases, electro magnetic interference (EMI) generated by an increase in clock signal frequency has become a very serious problem. The ultra-high speed digital device as described above generates high frequency noise and generates electromagnetic interference, and a three-terminal EMI filter is used to remove the interference. However, the three-terminal EMI filter of Jongle has an assembly problem as shown in FIG. 1 in the coupling structure of the lead wire and the chip capacitor. That is, the three-terminal EMI filter 10 connects the upper electrode lla of the chip capacitor 11 to the middle portion of the c-type two-terminal lead wire 12 by soldering, and the lower electrode llb of the chip capacitor 11. Is connected to the intermediate terminal lead wire 13 by soldering, and beads 14 are inserted into both ends of the c-type two-terminal lead wire 12, which is produced by firing with a synthetic powder resin.

However, in the above structure, the coupling structure of the lead wires 12 and 13 and the chip capacitor 11 is composed of two terminal and the middle terminal lead wires 12 and 13 in the plane, and the chip capacitor 11 is simply placed at the middle portion. It must be connected by soldering, and since the chip capacitor 11 is not provided by any means for fixing, the solder capacitor has a problem that the position of the chip capacitor 11 is changed after the soldering connection. Therefore, after the assembly is completed, the appearance of the product is not only poor, but also during the lip work is very cumbersome work.

The present invention has been devised to solve the above problems, so that soldering and condensation of chip capacitors is made very easily, thereby improving productivity and improving the appearance of the product by not changing the position of the chip capacitor after soldering. Its purpose is to provide a lead wire coupling structure of three-terminal EMI filters that can improve the strength of the bond by increasing the soldering area of lead wires and chip capacitors.

In order to achieve the above object of the present invention, in the lead wire coupling structure of a three-terminal EMI filter, a planar vertical portion having a predetermined size is formed at the middle portion of the two-terminal lead wire, and a bent flange having a predetermined size rearward at the center of the vertical portion ( a flange is formed to protrude a shear hole, and the intermediate terminal lead wire is formed at a top portion with a flat horizontal portion of a predetermined size, and a predetermined size protrusion protruding to the lower portion of the horizontal portion. The lead electrode of the chip capacitor is inserted into the shear hole, and the lead electrode coupling structure of the 3-terminal EMI filter is formed by interviewing and fixing the lower electrode of the chip capacitor to the horizontal portion of the intermediate terminal lead wire and the projection. .

Hereinafter, the present invention will be described in more detail with reference to the drawings.

In the lead wire coupling structure 1 of the present invention shown in FIGS. 2 to 3, a planar vertical portion 3 having a predetermined size is formed in the middle portion of the two-terminal lead wire 2, and the vertical portion 3 Lead wires 3a and 3b are respectively extended at both end portions of the wires, and beads 4a and 4b are fitted to the lead wires 3a and 3b, respectively.

In addition, the flat vertical portion 3 of the predetermined size is formed with a shear hole 6 in which a bending flange 5 of a predetermined size protrudes to the rear in the center, and a chip capacitor 7 as the shear hole 6. The upper electrode 7a is inserted into and fixed by soldering, and the intermediate terminal lead wire 8 is soldered and fixed to the lower electrode 7b of the chip capacitor 7.

In the guider structure 1 of the present invention shown in FIGS. 2 to 3, a planar vertical portion 3 having a predetermined size is formed in the middle portion of the two-terminal lead line 2, and the vertical portion 3 is formed. Lead wires 3a and 3b extend from both ends of the wires, respectively, and beads 4a and 4b are fitted into the lead wires 3a and 3b, respectively.

In addition, the planar vertical portion 3 of the predetermined size is formed with a shear hole 6 in which a bending flange 5 of a predetermined size protrudes rearward in the center thereof, and a chip capacitor 7 as the shear hole 6. The upper electrode 7a is inserted into and fixed by soldering, and the intermediate terminal lead wire 8 is soldered and fixed to the lower electrode 7b of the chip capacitor 7. At this time, the intermediate terminal lead wire 8 is uniformly sized at the upper end to form a horizontal portion 8a, and a lower portion of the horizontal portion 8a is provided with a constant sized protrusion 8b to each chip capacitor. The lower electrode 7b of 70 is interviewed.

The operation and effects of the present proposal configured as described above will be described.

That is, according to the present proposal, the upper electrode 7a of the chip capacitor 7 is inserted into the shear hole 6 formed in the vertical portion 3 of the two-terminal lead wire 2, and fixed by soldering, and the chip capacitor 7 Since the lower electrode 7b is fixed by soldering in a state in which it is in contact with the horizontal portion 8a and the projection 8b of the intermediate terminal lead wire 8, the soldering area becomes significantly wider than in the prior art.

During the soldering operation, the chip capacitor 7 is temporarily fixed by the front end 6 of the two-terminal lead wire 2 and the horizontal portion 8a and the projection 8b of the intermediate terminal lead wire 8. Soldering is very easy. After the soldering fixing, the chip capacitor 7 is firmly supported by the shear hole 6 so that position deformation does not occur.

Therefore, according to the present invention, since the soldering area is remarkably improved compared to the prior art, it is possible to produce a solid product by increasing the bonding strength, and the work productivity is improved by the easy soldering operation, and the positional deformation of the chip capacitor 7 is achieved. This does not occur and is a very useful design that has a practical effect that the appearance is markedly disclosed.

Claims (1)

In a lead wire coupling structure of a three-terminal EMI filter, a planar vertical portion 3 having a predetermined size is formed in the middle portion, and a bending flange 5 having a constant size rearward in the center of the vertical portion 3 is formed. A two-terminal lead wire 2 having a shear hole 6 protruding therefrom; An intermediate terminal lead wire 8 having a constant size horizontal portion 8a and a constant size protrusion 8b projecting to the lower portion of the horizontal portion 8a; And an upper electrode 7a of the chip capacitor 7 is inserted into the front end hole 6, and a lower electrode 7b is positioned at the horizontal portion 8a and the protrusion 8b to be soldered and fixed. Lead wire coupling structure of 3-terminal EMI filter.