KR930020628A - 집적 회로 이송 매체용 개별 건조제 - Google Patents

집적 회로 이송 매체용 개별 건조제 Download PDF

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Publication number
KR930020628A
KR930020628A KR1019930004135A KR930004135A KR930020628A KR 930020628 A KR930020628 A KR 930020628A KR 1019930004135 A KR1019930004135 A KR 1019930004135A KR 930004135 A KR930004135 A KR 930004135A KR 930020628 A KR930020628 A KR 930020628A
Authority
KR
South Korea
Prior art keywords
rail
length
desiccant
extending
housed inside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930004135A
Other languages
English (en)
Korean (ko)
Inventor
데이빗 게르케 로버트
무어 스토버 메리
Original Assignee
빈센트 비. 인그라시아
모토로라 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 빈센트 비. 인그라시아, 모토로라 인코포레이티드 filed Critical 빈센트 비. 인그라시아
Publication of KR930020628A publication Critical patent/KR930020628A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
KR1019930004135A 1992-03-31 1993-03-18 집적 회로 이송 매체용 개별 건조제 Withdrawn KR930020628A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86087092A 1992-03-31 1992-03-31
US860,870 1992-03-31

Publications (1)

Publication Number Publication Date
KR930020628A true KR930020628A (ko) 1993-10-20

Family

ID=25334237

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930004135A Withdrawn KR930020628A (ko) 1992-03-31 1993-03-18 집적 회로 이송 매체용 개별 건조제

Country Status (4)

Country Link
EP (1) EP0563629A1 (https=)
JP (1) JPH0648463A (https=)
KR (1) KR930020628A (https=)
TW (1) TW222342B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861289B2 (en) * 2002-07-25 2005-03-01 Delphi Technologies, Inc. Moisture-sensitive device protection system
US9335084B2 (en) 2010-04-26 2016-05-10 Whirlpool S.A. Cooling system of a refrigerator and suction system for a compressor fluid
JP2012084751A (ja) * 2010-10-13 2012-04-26 Murata Mfg Co Ltd 電子部品収納テープ
JP5541093B2 (ja) * 2010-10-14 2014-07-09 株式会社村田製作所 電子部品実装装置及び電子部品実装方法
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips
JP2022504968A (ja) * 2018-10-18 2022-01-13 シーエスピー テクノロジーズ，インコーポレイティド リール上の吸湿剤連行ポリマーを有するテープを用いて電子部品を包装する装置および方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4939014A (en) * 1987-12-16 1990-07-03 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
JPH0219271A (ja) * 1988-07-06 1990-01-23 Toshiba Corp 半導体装置用テーピング部品

Also Published As

Publication number Publication date
TW222342B (https=) 1994-04-11
JPH0648463A (ja) 1994-02-22
EP0563629A1 (en) 1993-10-06

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000