KR930017344U - 자동 용접기에 있어서 기판의 용제 분사장치 - Google Patents
자동 용접기에 있어서 기판의 용제 분사장치Info
- Publication number
- KR930017344U KR930017344U KR2019910024475U KR910024475U KR930017344U KR 930017344 U KR930017344 U KR 930017344U KR 2019910024475 U KR2019910024475 U KR 2019910024475U KR 910024475 U KR910024475 U KR 910024475U KR 930017344 U KR930017344 U KR 930017344U
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- welding machine
- spraying device
- automatic welding
- solvent spraying
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spray Control Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910024475U KR940001637Y1 (ko) | 1991-12-28 | 1991-12-28 | 자동 용접기에 있어서 기판의 용제 분사장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910024475U KR940001637Y1 (ko) | 1991-12-28 | 1991-12-28 | 자동 용접기에 있어서 기판의 용제 분사장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930017344U true KR930017344U (ko) | 1993-07-29 |
KR940001637Y1 KR940001637Y1 (ko) | 1994-03-21 |
Family
ID=19326099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019910024475U KR940001637Y1 (ko) | 1991-12-28 | 1991-12-28 | 자동 용접기에 있어서 기판의 용제 분사장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR940001637Y1 (ko) |
-
1991
- 1991-12-28 KR KR2019910024475U patent/KR940001637Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR940001637Y1 (ko) | 1994-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 19990322 Year of fee payment: 6 |
|
LAPS | Lapse due to unpaid annual fee |