KR930016276U - 와이어 본딩상태 검사장치 - Google Patents

와이어 본딩상태 검사장치

Info

Publication number
KR930016276U
KR930016276U KR2019910022455U KR910022455U KR930016276U KR 930016276 U KR930016276 U KR 930016276U KR 2019910022455 U KR2019910022455 U KR 2019910022455U KR 910022455 U KR910022455 U KR 910022455U KR 930016276 U KR930016276 U KR 930016276U
Authority
KR
South Korea
Prior art keywords
inspection device
wire bonding
bonding condition
condition inspection
wire
Prior art date
Application number
KR2019910022455U
Other languages
English (en)
Other versions
KR940005440Y1 (ko
Inventor
김강산
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019910022455U priority Critical patent/KR940005440Y1/ko
Publication of KR930016276U publication Critical patent/KR930016276U/ko
Application granted granted Critical
Publication of KR940005440Y1 publication Critical patent/KR940005440Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR2019910022455U 1991-12-17 1991-12-17 와이어 본딩상태 검사장치 KR940005440Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910022455U KR940005440Y1 (ko) 1991-12-17 1991-12-17 와이어 본딩상태 검사장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910022455U KR940005440Y1 (ko) 1991-12-17 1991-12-17 와이어 본딩상태 검사장치

Publications (2)

Publication Number Publication Date
KR930016276U true KR930016276U (ko) 1993-07-28
KR940005440Y1 KR940005440Y1 (ko) 1994-08-11

Family

ID=19324393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910022455U KR940005440Y1 (ko) 1991-12-17 1991-12-17 와이어 본딩상태 검사장치

Country Status (1)

Country Link
KR (1) KR940005440Y1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020065731A (ko) * 2001-02-07 2002-08-14 주식회사 칩팩코리아 반도체 패키지 제조 공정용 와이어 본딩 모니터링 방법
KR100439309B1 (ko) * 2002-01-29 2004-07-07 주식회사 넥사이언 와이어 본딩된 칩 테스트 장치 및 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020065731A (ko) * 2001-02-07 2002-08-14 주식회사 칩팩코리아 반도체 패키지 제조 공정용 와이어 본딩 모니터링 방법
KR100439309B1 (ko) * 2002-01-29 2004-07-07 주식회사 넥사이언 와이어 본딩된 칩 테스트 장치 및 방법

Also Published As

Publication number Publication date
KR940005440Y1 (ko) 1994-08-11

Similar Documents

Publication Publication Date Title
DE69418837D1 (de) Drahtverbindungseinrichtung
DE69231039D1 (de) Halbleiteranordnungzusammenbau
DE69219612D1 (de) Prüfungsvorrichtung
DE69124399D1 (de) Halbleitervorrichtung
DE69226742D1 (de) Halbleitervorrichtung
DE59205235D1 (de) Verbindungseinrichtung
KR900005726U (ko) 전선접속장치
KR930009747U (ko) 반도체장치
DE69210935D1 (de) Halbleiteranordnung
DE69221421D1 (de) Drahtdispergierungsvorrichtung
DE69227663D1 (de) Halbleitereinrichtung
KR930016276U (ko) 와이어 본딩상태 검사장치
DE69328763D1 (de) Drahtlängen-Messeinrichtung
DE69117474D1 (de) Drahtverbindung-Vorrichtung
KR900700217A (ko) 반도체 소자용 접합 와이어
KR920017246U (ko) 테이핑 점프와이어 불량 검출장치
KR930007514U (ko) 다이본딩 장치
KR920018172U (ko) 와이어 로우프의 꼬임 해제장치
KR900011727U (ko) 용접용 와이어의 엉킴방지장치
KR970046811U (ko) 와이어 본깅 검사 장치
KR950015652U (ko) 와이어 본딩 장치
KR920008356U (ko) 리드선의 심선꼬임장치
KR930012156U (ko) 전선연결부
KR920007053U (ko) 리드선의 결합장치
KR960010144U (ko) 전선납땜 장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040719

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee