KR930003872Y1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR930003872Y1
KR930003872Y1 KR2019900019502U KR900019502U KR930003872Y1 KR 930003872 Y1 KR930003872 Y1 KR 930003872Y1 KR 2019900019502 U KR2019900019502 U KR 2019900019502U KR 900019502 U KR900019502 U KR 900019502U KR 930003872 Y1 KR930003872 Y1 KR 930003872Y1
Authority
KR
South Korea
Prior art keywords
heat sink
semiconductor chip
semiconductor device
tab tape
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR2019900019502U
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English (en)
Korean (ko)
Other versions
KR910013038U (ko
Inventor
미쓰하루 시미즈
요시끼 다께다
가쓰야 후까세
마사또 다나까
Original Assignee
신고오덴기 고오교오 가부시끼가이샤
이노우에 사다오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신고오덴기 고오교오 가부시끼가이샤, 이노우에 사다오 filed Critical 신고오덴기 고오교오 가부시끼가이샤
Publication of KR910013038U publication Critical patent/KR910013038U/ko
Application granted granted Critical
Publication of KR930003872Y1 publication Critical patent/KR930003872Y1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019900019502U 1989-12-26 1990-12-11 반도체 장치 Expired - Fee Related KR930003872Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP150344/1 1989-12-26
JP1989150344U JPH0388350U (enrdf_load_stackoverflow) 1989-12-26 1989-12-26

Publications (2)

Publication Number Publication Date
KR910013038U KR910013038U (ko) 1991-07-30
KR930003872Y1 true KR930003872Y1 (ko) 1993-06-23

Family

ID=15494942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900019502U Expired - Fee Related KR930003872Y1 (ko) 1989-12-26 1990-12-11 반도체 장치

Country Status (2)

Country Link
JP (1) JPH0388350U (enrdf_load_stackoverflow)
KR (1) KR930003872Y1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101301782B1 (ko) * 2011-03-30 2013-08-29 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243364A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Power semiconductor device and process for production of same
JPH01304738A (ja) * 1988-06-01 1989-12-08 Mitsubishi Electric Corp 半導体装置のパッケージ構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101301782B1 (ko) * 2011-03-30 2013-08-29 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법

Also Published As

Publication number Publication date
JPH0388350U (enrdf_load_stackoverflow) 1991-09-10
KR910013038U (ko) 1991-07-30

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