KR930001528U - 직접회로 이송장치 - Google Patents

직접회로 이송장치

Info

Publication number
KR930001528U
KR930001528U KR2019910009571U KR910009571U KR930001528U KR 930001528 U KR930001528 U KR 930001528U KR 2019910009571 U KR2019910009571 U KR 2019910009571U KR 910009571 U KR910009571 U KR 910009571U KR 930001528 U KR930001528 U KR 930001528U
Authority
KR
South Korea
Prior art keywords
integrated circuit
transfer device
circuit transfer
integrated
transfer
Prior art date
Application number
KR2019910009571U
Other languages
English (en)
Other versions
KR960006410Y1 (ko
Inventor
오석주
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019910009571U priority Critical patent/KR960006410Y1/ko
Publication of KR930001528U publication Critical patent/KR930001528U/ko
Application granted granted Critical
Publication of KR960006410Y1 publication Critical patent/KR960006410Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR2019910009571U 1991-06-25 1991-06-25 직접회로 이송장치 KR960006410Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910009571U KR960006410Y1 (ko) 1991-06-25 1991-06-25 직접회로 이송장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910009571U KR960006410Y1 (ko) 1991-06-25 1991-06-25 직접회로 이송장치

Publications (2)

Publication Number Publication Date
KR930001528U true KR930001528U (ko) 1993-01-21
KR960006410Y1 KR960006410Y1 (ko) 1996-07-24

Family

ID=19315614

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910009571U KR960006410Y1 (ko) 1991-06-25 1991-06-25 직접회로 이송장치

Country Status (1)

Country Link
KR (1) KR960006410Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210135766A (ko) * 2020-05-06 2021-11-16 강명석 쇄암선

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210135766A (ko) * 2020-05-06 2021-11-16 강명석 쇄암선

Also Published As

Publication number Publication date
KR960006410Y1 (ko) 1996-07-24

Similar Documents

Publication Publication Date Title
KR100201181B1 (en) Semiconductor integatrated circuit device
DE69123407D1 (de) Elektronisches Gerät
DE69217777D1 (de) Übertragungsdruckgerät
NO924651L (no) Anordning
KR930016406U (ko) 집적회로 팩 커넥터 장치
DE69216663D1 (de) Schaltkreis
DE69233541D1 (de) Datenübertragungsgerät
DE69226502D1 (de) Elektronisches Bildaufnahmegerät
DE69226742T2 (de) Halbleitervorrichtung
DE69124399D1 (de) Halbleitervorrichtung
KR930009747U (ko) 반도체장치
DE59203916D1 (de) Elektronisches orientierungsgerät.
IT1267098B1 (it) Dispositivo appendi-oggetti
DE69215184D1 (de) Integrierte Schaltung
DE69210935D1 (de) Halbleiteranordnung
KR920014867U (ko) 전자 부품 이송 장치
DE69331210D1 (de) Integriertes Speicherschaltungsgerät
DE69227663D1 (de) Halbleitereinrichtung
DE69223752D1 (de) Halbleiterschaltungen
DK0592007T3 (da) Omskifterapparat
KR930001528U (ko) 직접회로 이송장치
KR930018789U (ko) 직접회로 이송장치
KR920013731U (ko) 웨이퍼의 이송장치
KR920015875U (ko) 논리소자 집적회로
KR940002359U (ko) 회로기판 이송장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040621

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee